摘要:
An adaptive frame prediction method includes: using at least one block partition method to partition an MB that needs to perform intra-frame prediction; using at least one prediction mode to predict each sub-block in each block partition result and obtaining a sub-block residual of a current sub-block; selecting multiple transformation methods according to the sub-block type to transform each sub-block residual and obtain the code-rate distortion ratio of the current sub-block; performing frame prediction for the MB according to the block partition method, the prediction mode, and the transformation method corresponding to the code-rate distortion ratio of a minimum value among all code-rate distortion ratios. An adaptive prediction apparatus disclosed herein includes: a block partition module, a predicting module, a transforming module, a selecting module, and a frame predicting module. The method and the apparatus herein perform the intra-frame or inter-frame coding flexibly, get more adaptive to the local texture statistic features of the MBs, and improve the coding efficiency.
摘要:
The present invention describes a peptide and analogues thereof, which is a fragment of an olfactory receptor protein capable of selectively binding to trimethylamine so that they are useful for detecting trimethylamine. The present invention further describes a method and a device for detecting trimethylamine by using the peptide and the analogues thereof.
摘要:
According to embodiments of the present invention, a biosensor is provided. The biosensor includes a support substrate, a plurality of sensing electrodes arranged on the support substrate, each of the plurality of sensing electrodes comprises a plurality of sensing electrode segments laterally disposed from each other, and a plurality of input-output ports configured for external connection, wherein each of the plurality of sensing electrodes is electrically isolated from each other and respectively coupled to each of the plurality of input-output ports.
摘要:
Disclosed is a heat dissipating circuit board, which includes a metal core including an insulating layer formed on the surface thereof, a circuit layer formed on the insulating layer and including a seed layer and a first circuit pattern, and a heat dissipating frame layer bonded onto the circuit layer using solder and having a second circuit pattern, and in which the heat dissipating frame layer is bonded onto the circuit layer not by a plating process but by using solder, thus reducing the cost and time of the plating process and relieving stress applied to the heat dissipating circuit board due to the plating process. A method of manufacturing the heat dissipating circuit board is also provided.
摘要:
Disclosed is a heat dissipating circuit board, which includes a metal core including an insulating layer formed on the surface thereof, a circuit layer formed on the insulating layer and including a seed layer and a first circuit pattern, and a heat dissipating frame layer bonded onto the circuit layer using solder and having a second circuit pattern, and in which the heat dissipating frame layer is bonded onto the circuit layer not by a plating process but by using solder, thus reducing the cost and time of the plating process and relieving stress applied to the heat dissipating circuit board due to the plating process. A method of manufacturing the heat dissipating circuit board is also provided.
摘要:
A method for coding multi-view video images is provided in the present invention. The method comprises: obtaining a view dependency between inter-view reference images for a viewpoint image; and encoding the viewpoint image in motion skip mode according to the view dependency and a first inter-view motion dependency of a first non-anchor image, wherein the first non-anchor image has no inter-view reference image. In the embodiments of the present invention, inter-view motion dependencies of the image under coding are set, and therefore, the coding and the decoding of the multi-view video images in motion skip mode are simplified, and the efficiency in and the gain of coding the multi-view video image are improved.
摘要:
Disclosed herein is a power semiconductor module. The module includes metal plates each having a first through hole, with an anodic oxidation layer formed on a surface of metal plates and an interior of the first through hole. A cooling member has a second through hole at a position corresponding to the first through hole, and the metal plates are attached to both sides of the cooling member. A circuit layer is formed on the anodic oxidation layer and performs an interlayer connection through a via formed in the first and second through holes. A power device is connected to the circuit layer. A resin encapsulant encloses the circuit layer and the power device. A housing is installed to each of the metal plates to form a sealing space for the resin encapsulant.
摘要:
Disclosed is a power semiconductor module having improved heat dissipation performance, including an anodized metal substrate including a metal plate, an anodized layer formed on a surface of the metal plate, and a circuit layer formed on the anodized layer on the metal plate, a power device connected to the circuit layer, and a housing mounted on the metal plate and for defining a sealing space which accommodates a resin sealing material for sealing the circuit layer and the power device.
摘要:
A method and an apparatus of multi-view coding and decoding are provided. In the process of encoding multi-view video images, a frame number and view identifier information of the image that uses auxiliary reference information are written into a code stream, and sent to the decoder. The decoder obtains the frame number and the view identifier information of the image that uses the auxiliary reference information, and determines the auxiliary reference information applied to a specified image according to the frame number and the view identifier information. Errors of the image may be concealed according to the auxiliary reference information.
摘要:
Disclosed herein is a power semiconductor module. The module includes metal plates each having a first through hole, with an anodic oxidation layer formed on a surface of metal plates and an interior of the first through hole. A cooling member has a second through hole at a position corresponding to the first through hole, and the metal plates are attached to both sides of the cooling member. A circuit layer is formed on the anodic oxidation layer and performs an interlayer connection through a via formed in the first and second through holes. A power device is connected to the circuit layer. A resin encapsulant encloses the circuit layer and the power device. A housing is installed to each of the metal plates to form a sealing space for the resin encapsulant.