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1.发明申请PRINTED CIRCUIT BOARD UNIT, ELECTRONIC DEVICE AND METHOD OF FABRICATING PRINTED CIRCUIT BOARD 审中-公开印刷电路板单元，电子设备及制作印刷电路板的方法公开(公告)号：US20110240355A1
公开(公告)日：2011-10-06
申请号：US13071693
申请日：2011-03-25
CPC分类号： H05K3/305 , H01L21/56 , H01L23/562 , H01L24/98 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/014 , H01L2924/351 , Y02P70/613 , Y10T29/49124 , H01L2924/00
摘要： A printed circuit board unit includes a printed circuit board and an electronic component. The electronic component is electrically connected to a predetermined position on the printed circuit board by means of soldering while being joined to the printed circuit board using an adhesive layer. The adhesive layer, disposed between the printed circuit board and the electronic component, partially includes a multilayer laminated region including a first reinforcement resin layer and a second reinforcement resin layer. The first reinforcement resin layer is disposed on a side of the printed circuit board, whereas the second reinforcement resin layer is disposed on a side of the electronic component. The second reinforcement resin layer has adhesive strength greater than that of the first reinforcement resin layer.
摘要翻译： 印刷电路板单元包括印刷电路板和电子部件。 电子部件通过焊接电连接到印刷电路板上的预定位置，同时使用粘合剂层与印刷电路板接合。 布置在印刷电路板和电子部件之间的粘合剂层部分地包括包括第一增强树脂层和第二增强树脂层的多层层叠区域。 第一增强树脂层设置在印刷电路板的一侧，而第二增强树脂层设置在电子部件的一侧。 第二增强树脂层的粘合强度大于第一增强树脂层的粘合强度。
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公开(公告)号：US20100200643A1
公开(公告)日：2010-08-12
申请号：US12697195
申请日：2010-01-29
CPC分类号： H05K3/4617 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H05K1/186 , H05K3/323 , H05K3/341 , H05K3/368 , H05K3/4069 , H05K3/4602 , H05K3/4658 , H05K2201/09481 , H05K2203/061 , H01L2224/0401
摘要： A method for producing an electronic part unit, the method includes: mounting a first electronic part on a first surface of a first substrate by reflow soldering; mounting a second electronic part on a second surface of a second substrate by reflow soldering; adhering a second surface of the first substrate to a first surface of a third substrate; and adhering a second surface of the second substrate to a second surface of the third substrate.
摘要翻译： 一种电子部件单元的制造方法，所述方法包括：通过回流焊将第一电子部件安装在第一基板的第一面上; 通过回流焊将第二电子部件安装在第二基板的第二表面上; 将第一基板的第二表面粘附到第三基板的第一表面; 以及将所述第二基板的第二表面附着到所述第三基板的第二表面。
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公开(公告)号：US07564111B2
公开(公告)日：2009-07-21
申请号：US11657590
申请日：2007-01-25
申请人： Koji Sawahata , Susumu Moriya , Hiroshi Aoki , Izumi Kobayashi , Toshiyuki Honda , Shigeo Iriguchi , Masashi Takenaka
发明人： Koji Sawahata , Susumu Moriya , Hiroshi Aoki , Izumi Kobayashi , Toshiyuki Honda , Shigeo Iriguchi , Masashi Takenaka
IPC分类号： H01L31/0232
CPC分类号： H04N5/2251 , H01L27/14618 , H01L2924/0002 , H04N5/2257 , H01L2924/00
摘要： In an imaging apparatus constituted of a case body for mounting an imaging device and a flexible substrate bonding to an external connection terminal provided on the case body, the flexible substrate is bent along each face of case body 41 so as to surround case body 41. By bending the flexible substrate, a load applied to the flexible substrate is received at the bent portion of the flexible substrate, there is formed a structure hard to transmit the load to the bonding portion to the external connection terminal. Further, by fixing the case body to a portion of the flexible substrate with an adhesive agent, etc., there is formed a structure not to transmit a stress to the direction of peeling the flexible substrate from the external connection terminal. Also, the case body is covered with the flexible substrate equipped with an electromagnetic wave shield material.
摘要翻译： 在由用于安装成像装置的壳体和与设置在壳体上的外部连接端子接合的柔性基板构成的成像装置中，柔性基板沿着壳体41的每个面弯曲以围绕壳体41。 通过弯曲柔性基板，施加到柔性基板的负载被容纳在柔性基板的弯曲部分处，形成难以将负载传递到外部连接端子的接合部分的结构。 此外，通过利用粘合剂等将壳体固定到柔性基板的一部分上，形成了不向外部连接端子向柔性基板剥离的方向施加应力的结构。 此外，壳体被配备有电磁波屏蔽材料的柔性基板覆盖。
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公开(公告)号：US20070120050A1
公开(公告)日：2007-05-31
申请号：US11657590
申请日：2007-01-25
申请人： Koji Sawahata , Susumu Moriya , Hiroshi Aoki , Izumi Kobayashi , Toshiyuki Honda , Shigeo Iriguchi , Masashi Takenaka
发明人： Koji Sawahata , Susumu Moriya , Hiroshi Aoki , Izumi Kobayashi , Toshiyuki Honda , Shigeo Iriguchi , Masashi Takenaka
IPC分类号： H01J5/02
CPC分类号： H04N5/2251 , H01L27/14618 , H01L2924/0002 , H04N5/2257 , H01L2924/00
摘要： In an imaging apparatus constituted of a case body for mounting an imaging device and a flexible substrate bonding to an external connection terminal provided on the case body, the flexible substrate is bent along each face of case body 41 so as to surround case body 41. By bending the flexible substrate, a load applied to the flexible substrate is received at the bent portion of the flexible substrate, there is formed a structure hard to transmit the load to the bonding portion to the external connection terminal. Further, by fixing the case body to a portion of the flexible substrate with an adhesive agent, etc., there is formed a structure not to transmit a stress to the direction of peeling the flexible substrate from the external connection terminal. Also, the case body is covered with the flexible substrate equipped with an electromagnetic wave shield material.
摘要翻译： 在由用于安装成像装置的壳体和与设置在壳体上的外部连接端子接合的柔性基板构成的成像装置中，柔性基板沿着壳体41的每个面弯曲以围绕壳体41。 通过弯曲柔性基板，施加到柔性基板的负载被容纳在柔性基板的弯曲部分处，形成难以将负载传递到外部连接端子的接合部分的结构。 此外，通过利用粘合剂等将壳体固定到柔性基板的一部分上，形成了不向外部连接端子向柔性基板剥离的方向施加应力的结构。 此外，壳体被配备有电磁波屏蔽材料的柔性基板覆盖。
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公开(公告)号：US06538382B2
公开(公告)日：2003-03-25
申请号：US09970706
申请日：2001-10-05
申请人： Kenji Kimura , Takeshi Kawahara , Taizo Ohno , Satoshi Watanabe , Shigeo Iriguchi , Takayoshi Nakamura
发明人： Kenji Kimura , Takeshi Kawahara , Taizo Ohno , Satoshi Watanabe , Shigeo Iriguchi , Takayoshi Nakamura
IPC分类号： H01J1749
CPC分类号： H05K5/02
摘要： A plasma display apparatus has an electronic circuit module including a rigid substrate attached to a chassis thereof and a flexible substrate partially overlapped with the rigid substrate. The rigid substrate has chips and the flexible substrate has a first portion with apertures for exposing the chips and bonding pads and a second portion positioned on the outside of the rigid substrate. Bonding wires connect terminals of the chips with the bonding pads of the flexible substrate. A reinforcing pattern or a dummy pattern is provided in at least the first portion of the flexible substrate. The reinforcing pattern provides for rigidity for the first portion of the flexible substrate for accurate positioning of the bonding pads relative to the chips.
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公开(公告)号：US20060243884A1
公开(公告)日：2006-11-02
申请号：US11391706
申请日：2006-03-29
申请人： Masanori Onodera , Susumu Moriya , Izumi Kobayashi , Hiroshi Aoki , Koji Sawahata , Shigeo Iriguchi , Toshiyuki Honda , Katsuro Hiraiwa
发明人： Masanori Onodera , Susumu Moriya , Izumi Kobayashi , Hiroshi Aoki , Koji Sawahata , Shigeo Iriguchi , Toshiyuki Honda , Katsuro Hiraiwa
IPC分类号： H01L27/00
CPC分类号： H04N5/2254 , H04N5/2253
摘要： A camera module includes a module structure constituted by a lens unit to which an image pickup lens is attached and a package to which an imaging element is attached so as to be opposite to the image pickup lens. An optical filter is arranged between the imaging element and the image pickup lens. A portion of a flat surface of the optical filter is fixed to a filter fixing portion via an adhesive. The optical filter is adhered to the filter fixing portion in a state in which an end portion formed by a side surface of the optical filter and the flat surface is in noncontact with the filter fixing portion or the adhesive. Minute particles generated from a cut surface of the optical filter fall outside the filer fixing portion.
摘要翻译： 相机模块包括由附接有图像拾取透镜的透镜单元和附接有成像元件以与图像拾取透镜相对的包装构成的模块结构。 在成像元件和图像拾取透镜之间布置有滤光器。 滤光器的平坦表面的一部分通过粘合剂固定到过滤器固定部分。 滤光器在由滤光器的侧表面形成的端部与平坦表面与过滤器固定部或粘合剂不接触的状态下粘附到过滤器固定部。 从滤光器的切割表面产生的微粒子落在滤光片固定部分的外侧。
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公开(公告)号：US20090175010A1
公开(公告)日：2009-07-09
申请号：US12285632
申请日：2008-10-09
申请人： Shigeo Iriguchi , Kiyoyuki Hatanaka , Satoshi Watanabe , Nobuo Taketomi , Keiichi Yamamoto , Masaru Sugie
发明人： Shigeo Iriguchi , Kiyoyuki Hatanaka , Satoshi Watanabe , Nobuo Taketomi , Keiichi Yamamoto , Masaru Sugie
CPC分类号： H05K3/3494 , H05K1/0212 , H05K3/225 , H05K2203/101 , H05K2203/176 , Y10T29/49137
摘要： A repair system which prevents heating of weakly heat resistant devices together and causing deterioration of the quality when preheating a first surface of the circuit board, wherein an electromagnetic induction material is buried in advance inside the circuit board near a specific electronic device envisioned as needed repair when becoming a defective electronic device in a production process and an electromagnetic coil emitting electromagnetic waves to an electromagnetic induction member in the vicinity of the repair device is provided and the heat generated by the electromagnetic induction member due to the electromagnetic waves enables the repair device to be heated and detached from the circuit board.
摘要翻译： 一种在预热电路板的第一表面时防止弱耐热装置加热并导致质量劣化的修复系统，其中电磁感应材料预先埋在电路板内面靠近需要修理的特定电子装置附近 当在生产过程中成为有缺陷的电子装置时，并且提供了向维修装置附近的电磁感应构件发射电磁波的电磁线圈，并且由于电磁波而由电磁感应构件产生的热能够使修理装置 从电路板加热和分离。
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公开(公告)号：US07101205B2
公开(公告)日：2006-09-05
申请号：US11033256
申请日：2005-01-12
IPC分类号： H01R3/00
CPC分类号： H05K1/028 , H01R12/59 , H01R35/02 , H04M1/0227
摘要： A flexible printed circuit board that electrically connects a main body and a rotary body to each other is twisted in advance through an angle that is a half of an angle of rotation through which the rotary body is rotated. One end of the flexible printed circuit board is fixed to the main body, and the other end thereof is fixed to the rotary body. The rotary body is rotated in a direction causing the twist of the flexible printed circuit board to diminish.
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9.发明申请公开(公告)号：US20110240352A1
公开(公告)日：2011-10-06
申请号：US13071678
申请日：2011-03-25
CPC分类号： H05K3/3452 , H05K3/225 , H05K3/303 , H05K3/3436 , H05K2201/0129 , H05K2203/0574 , H05K2203/0588 , H05K2203/176 , Y02P70/613 , Y10T29/49144
摘要： A printed circuit board includes a printed circuit board body and a resin layer. The printed circuit board body includes a plurality of mounting pads. The resin layer, containing a thermoplastic resin, is formed on the surface of the printed circuit board body. The resin layer includes a plurality of holes disposed to be aligned with the positions of the mounting pads on a one-to-one basis for exposing the mounting pads therethrough. In a method of fabricating the printed circuit board, the resin layer is formed atop the printed circuit board body.
摘要翻译： 印刷电路板包括印刷电路板主体和树脂层。 印刷电路板主体包括多个安装焊盘。 在印刷电路板主体的表面上形成含有热塑性树脂的树脂层。 树脂层包括多个孔，其设置成与安装焊盘的位置一一对准地对准，以使安装焊盘从中穿过。 在制造印刷电路板的方法中，树脂层形成在印刷电路板主体的顶部。
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公开(公告)号：US08456854B2
公开(公告)日：2013-06-04
申请号：US12285632
申请日：2008-10-09
申请人： Shigeo Iriguchi , Kiyoyuki Hatanaka , Satoshi Watanabe , Nobuo Taketomi , Keiichi Yamamoto , Masaru Sugie
发明人： Shigeo Iriguchi , Kiyoyuki Hatanaka , Satoshi Watanabe , Nobuo Taketomi , Keiichi Yamamoto , Masaru Sugie
CPC分类号： H05K3/3494 , H05K1/0212 , H05K3/225 , H05K2203/101 , H05K2203/176 , Y10T29/49137
摘要： A repair system which prevents heating of weakly heat resistant devices together and causing deterioration of the quality when preheating a first surface of the circuit board, wherein an electromagnetic induction material is buried in advance inside the circuit board near a specific electronic device envisioned as needed repair when becoming a defective electronic device in a production process and an electromagnetic coil emitting electromagnetic waves to an electromagnetic induction member in the vicinity of the repair device is provided and the heat generated by the electromagnetic induction member due to the electromagnetic waves enables the repair device to be heated and detached from the circuit board.
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