公开(公告)号：US08093504B2

公开(公告)日：2012-01-10

申请号：US12414659

申请日：2009-03-30

申请人： Shih-Chieh Chao ,  Chih-Wen Huang ,  Chun-Lin Liao

发明人： Shih-Chieh Chao ,  Chih-Wen Huang ,  Chun-Lin Liao

IPC分类号： H05K1/09

CPC分类号： H05K1/0233 ,  H05K1/0225 ,  H05K2201/086 ,  H05K2201/09309 ,  H05K2201/09663

摘要： A circuit board structure includes a dielectric layer, a first metal layer, a second metal layer and a first ferrite element. The first metal layer is disposed on an upper surface of the dielectric layer and has a first circuit area, a second circuit area and a first metallic neck connecting the first circuit and the second circuit areas. The second metal layer is disposed on a lower surface of the dielectric layer and has a third circuit area, a fourth circuit area and at least a second metallic neck connecting the third circuit and the fourth circuit areas. The orthogonal projections of the first and the second metallic necks on the upper surface are not overlapped. The first ferrite element is disposed on the upper surface and overlays at least one of the orthogonal projections of the first and the second metallic necks on the upper surface.

摘要翻译： 电路板结构包括电介质层，第一金属层，第二金属层和第一铁氧体元件。 第一金属层设置在电介质层的上表面上，并且具有第一电路区域，第二电路区域和连接第一电路和第二电路区域的第一金属颈部。 第二金属层设置在电介质层的下表面上，并且具有第三电路区域，第四电路区域和连接第三电路和第四电路区域的至少第二金属颈。 第一和第二金属颈部在上表面上的正交突起不重叠。 第一铁氧体元件设置在上表面上并且覆盖在上表面上的第一和第二金属颈部的至少一个正交突起。

公开(公告)号：US20100200281A1

公开(公告)日：2010-08-12

申请号：US12414659

申请日：2009-03-30

申请人： Shih-Chieh Chao ,  Chih-Wen Huang ,  Chun-Lin Liao

发明人： Shih-Chieh Chao ,  Chih-Wen Huang ,  Chun-Lin Liao

IPC分类号： H05K1/09

CPC分类号： H05K1/0233 ,  H05K1/0225 ,  H05K2201/086 ,  H05K2201/09309 ,  H05K2201/09663

摘要： A circuit board structure includes a dielectric layer, a first metal layer, a second metal layer and a first ferrite element. The first metal layer is disposed on an upper surface of the dielectric layer and has a first circuit area, a second circuit area and a first metallic neck connecting the first circuit and the second circuit areas. The second metal layer is disposed on a lower surface of the dielectric layer and has a third circuit area, a fourth circuit area and at least a second metallic neck connecting the third circuit and the fourth circuit areas. The orthogonal projections of the first and the second metallic necks on the upper surface are not overlapped. The first ferrite element is disposed on the upper surface and overlays at least one of the orthogonal projections of the first and the second metallic necks on the upper surface.

摘要翻译： 电路板结构包括电介质层，第一金属层，第二金属层和第一铁氧体元件。 第一金属层设置在电介质层的上表面上，并且具有第一电路区域，第二电路区域和连接第一电路和第二电路区域的第一金属颈部。 第二金属层设置在电介质层的下表面上，并且具有第三电路区域，第四电路区域和连接第三电路和第四电路区域的至少第二金属颈。 第一和第二金属颈部在上表面上的正交突起不重叠。 第一铁氧体元件设置在上表面上并且覆盖在上表面上的第一和第二金属颈部的至少一个正交突起。

公开(公告)号：US07391281B2

公开(公告)日：2008-06-24

申请号：US11437724

申请日：2006-05-22

申请人： Shih-Chieh Chao ,  Chih-Wen Huang ,  Chun-Lin Liao

发明人： Shih-Chieh Chao ,  Chih-Wen Huang ,  Chun-Lin Liao

IPC分类号： H03H7/38

CPC分类号： H05K1/0231 ,  G06F17/5063 ,  H05K3/0005

摘要： A method for suppressing the resonant effect between capacitors connected in parallel is disclosed. By adjusting the length of the transmission line of the shunt capacitors, the performance of the shunt capacitors, which can be applied on various types of filtering circuits, can be improved in the desired bandwidth.

摘要翻译： 公开了一种用于抑制并联连接的电容器之间的谐振效应的方法。 通过调整分流电容器的传输线的长度，可以在期望的带宽中改善可应用于各种类型的滤波电路的并联电容器的性能。

公开(公告)号：US20060090929A1

公开(公告)日：2006-05-04

申请号：US11055615

申请日：2005-02-11

申请人： Shih-Chieh Chao ,  Chih-Wen Huang ,  Chun-Lin Liao

发明人： Shih-Chieh Chao ,  Chih-Wen Huang ,  Chun-Lin Liao

IPC分类号： H05K7/06

CPC分类号： H05K1/0218 ,  H05K1/0219 ,  H05K1/0231 ,  H05K2201/09236 ,  H05K2201/09972

摘要： A multi-layer printed circuit board having a low noise characteristic, the multi-layer printed circuit board includes at least one circuit layer; at least one isolation line for dividing the at least one circuit layer into at least two areas, the at least one isolation line forming an open pattern and the at least one isolation line extendedly forming a long neck line into the at least one area; and at least one capacitor placed at one side of the opening of the open pattern in any one of the areas.

摘要翻译： 一种具有低噪声特性的多层印刷电路板，所述多层印刷电路板包括至少一个电路层; 用于将所述至少一个电路层分成至少两个区域的至少一个隔离线，所述至少一个隔离线形成开放图案，所述至少一个隔离线将长的颈线延伸到所述至少一个区域中; 以及放置在任何一个区域中的开放图案的开口的一侧的至少一个电容器。

公开(公告)号：US20120187944A1

公开(公告)日：2012-07-26

申请号：US13115995

申请日：2011-05-26

申请人： Shih-Chieh Chao ,  Chih-Wen Huang

发明人： Shih-Chieh Chao ,  Chih-Wen Huang

IPC分类号： G01R33/02

CPC分类号： G01R33/0283

摘要： A planar magnetic field probe is provided. The planar magnetic field probe increases the sensitivity of magnetic field intensity detection by using a left multi-sensor loop and a right multi-sensor loop formed by a first patterned metal layer and a second patterned metal layer, and decreases the electric field noise coupling by surrounding the left multi-sensor loop and the right multi-sensor loop with a symmetrical shielding metal structure formed by a first patterned shielding metal layer, a second patterned shielding metal layer and a plurality of through vias.

摘要翻译： 提供平面磁场探头。 平面磁场探测器通过使用由第一图案化金属层和第二图案化金属层形成的左多传感器环路和右多传感器环路来增加磁场强度检测的灵敏度，并且通过以下方式减小电场噪声耦合 围绕左多传感器回路和右多传感器回路，其具有由第一图案化屏蔽金属层，第二图案化屏蔽金属层和多个通孔形成的对称屏蔽金属结构。

公开(公告)号：US08035993B2

公开(公告)日：2011-10-11

申请号：US12422292

申请日：2009-04-13

申请人： Shih-Chieh Chao ,  Chih-Wen Huang ,  Chun-Lin Liao

发明人： Shih-Chieh Chao ,  Chih-Wen Huang ,  Chun-Lin Liao

IPC分类号： H05K9/00

CPC分类号： H05K1/0236 ,  H01F2017/0046 ,  H05K1/0231 ,  H05K1/165 ,  H05K2201/09309 ,  H05K2201/09627

摘要： A circuit board including a first patterned metal layer and a second patterned metal layer is provided. The first patterned metal layer has metal blocks and spiral structures. A gap is kept between any two adjacent metal blocks. Each of the spiral structures is electrically connected between any two adjacent metal blocks. The second patterned metal layer is disposed beside the first patterned metal layer and has jumper segments. Each of the jumper segments has a first end and a second end opposite to the first end. Each of the spiral structures has an outer end and an inner end. The outer end is connected to one of the two adjacent metal blocks. The inner end is electrically connected to the first end of one of the jumper segments, and the second end of the jumper segment is electrically connected to the other one of the two the metal blocks.

摘要翻译： 提供了包括第一图案化金属层和第二图案化金属层的电路板。 第一图案化金属层具有金属块和螺旋结构。 在任何两个相邻的金属块之间保持间隙。 每个螺旋结构电连接在任何两个相邻的金属块之间。 第二图案化金属层设置在第一图案化金属层旁边并且具有跨接段。 每个跳线段具有与第一端相对的第一端和第二端。 每个螺旋结构具有外端和内端。 外端连接到两个相邻的金属块中的一个。 内端电连接到一个跳线段的第一端，并且跳线段的第二端电连接到两个金属块中的另一个。

公开(公告)号：US20100172111A1

公开(公告)日：2010-07-08

申请号：US12422292

申请日：2009-04-13

申请人： Shih-Chieh Chao ,  Chih-Wen Huang ,  Chun-Lin Liao

发明人： Shih-Chieh Chao ,  Chih-Wen Huang ,  Chun-Lin Liao

IPC分类号： H05K7/00 ,  H01F5/00

CPC分类号： H05K1/0236 ,  H01F2017/0046 ,  H05K1/0231 ,  H05K1/165 ,  H05K2201/09309 ,  H05K2201/09627

摘要： A circuit board including a first patterned metal layer and a second patterned metal layer is provided. The first patterned metal layer has metal blocks and spiral structures. A gap is kept between any two adjacent metal blocks. Each of the spiral structures is electrically connected between any two adjacent metal blocks. The second patterned metal layer is disposed beside the first patterned metal layer and has jumper segments. Each of the jumper segments has a first end and a second end opposite to the first end. Each of the spiral structures has an outer end and an inner end. The outer end is connected to one of the two adjacent metal blocks. The inner end is electrically connected to the first end of one of the jumper segments, and the second end of the jumper segment is electrically connected to the other one of the two the metal blocks.

摘要翻译： 提供了包括第一图案化金属层和第二图案化金属层的电路板。 第一图案化金属层具有金属块和螺旋结构。 在任何两个相邻的金属块之间保持间隙。 每个螺旋结构电连接在任何两个相邻的金属块之间。 第二图案化金属层设置在第一图案化金属层旁边并且具有跨接段。 每个跳线段具有与第一端相对的第一端和第二端。 每个螺旋结构具有外端和内端。 外端连接到两个相邻的金属块中的一个。 内端电连接到一个跳线段的第一端，并且跳线段的第二端电连接到两个金属块中的另一个。

公开(公告)号：US08891241B2

公开(公告)日：2014-11-18

申请号：US13615638

申请日：2012-09-14

申请人： Shih-Chieh Chao ,  Chih-Wen Huang

发明人： Shih-Chieh Chao ,  Chih-Wen Huang

IPC分类号： H05K7/20 ,  H05K9/00

CPC分类号： H01L23/3677 ,  H01L23/433 ,  H01L23/552 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/14 ,  H01L2924/1434 ,  H05K1/0206 ,  H05K1/0236

摘要： An electronic assembly includes a heat generating element, a heat dissipation fin set and a filter circuit board. The filter circuit board is disposed between the heat generating element and the heat dissipation fin set. The filter circuit board includes a metal layer, an electromagnetic band gap structure layer, an insulation layer disposed between the metal layer and the electromagnetic band gap structure layer and plural first thermal vias. The heat dissipation fin set is disposed on the heat generating element and directly contacts the metal layer. The electromagnetic band gap structure layer has plural conductive patterns arranged in the same pitches. The heat generating element directly contacts at least one of the conductive patterns. The first thermal vias pass through the insulation layer, the metal layer and the conductive patterns. Two ends of each first thermal via respectively connect the metal layer and the corresponding conductive pattern.

摘要翻译： 电子组件包括发热元件，散热片组和滤波器电路板。 过滤器电路板设置在发热元件和散热片组之间。 滤波器电路板包括金属层，电磁带隙结构层，设置在金属层与电磁带隙结构层之间的绝缘层和多个第一热通孔。 散热翅片组设置在发热元件上并直接接触金属层。 电磁带隙结构层具有以相同间距布置的多个导电图案。 发热元件直接接触至少一个导电图案。 第一个热通孔穿过绝缘层，金属层和导电图案。 每个第一热通孔的两端分别连接金属层和相应的导电图案。

公开(公告)号：US07501583B2

公开(公告)日：2009-03-10

申请号：US11643830

申请日：2006-12-22

申请人： Shih-Chieh Chao ,  Chih-Wen Huang ,  Chun-Lin Liao

发明人： Shih-Chieh Chao ,  Chih-Wen Huang ,  Chun-Lin Liao

IPC分类号： H05K1/03

CPC分类号： H05K1/0216 ,  H05K2201/093 ,  H05K2201/09309 ,  H05K2201/09663

摘要： A low noise multilayer printed circuit board includes at least one ground layer and at least one power layer. The at least one ground layer is divided into a first area and a second area. The first area and the second area are connected by a first metal neckline. The at least one power layer is divided into a third area and a fourth area. The third area and the fourth area are connected by a second metal neckline. The first area corresponds to the third area. The second area corresponds to the fourth area. The location where the first and second areas are connected by the first metal neckline is different from that where the third and fourth areas are connected by the second metal neckline.

摘要翻译： 低噪声多层印刷电路板包括至少一个接地层和至少一个功率层。 所述至少一个接地层被分成第一区域和第二区域。 第一区域和第二区域通过第一金属领口连接。 所述至少一个功率层被划分为第三区域和第四区域。 第三区域和第四区域通过第二金属领口连接。 第一个区域对应于第三个区域。 第二个区域对应于第四个区域。 第一和第二区域通过第一金属领口连接的位置与通过第二金属领口连接第三和第四区域的位置不同。

公开(公告)号：US20090056984A1

公开(公告)日：2009-03-05

申请号：US11951345

申请日：2007-12-06

申请人： Shih-Chieh Chao ,  Chih-Wen Huang ,  Chun-Lin Liao

发明人： Shih-Chieh Chao ,  Chih-Wen Huang ,  Chun-Lin Liao

IPC分类号： H05K1/02

CPC分类号： H05K1/0236 ,  H05K2201/09309 ,  H05K2201/09681 ,  H05K2201/0969

摘要： A signal transmission structure is provided. The signal transmission structure includes conduction blocks periodically formed at a power plane, neck blocks connecting adjacent conduction blocks, and openings formed corresponding to the neck blocks at a ground plane for reducing equivalent capacitance between the neck blocks and the ground plane, so as to improve the noise isolation performance.

摘要翻译： 提供了一种信号传输结构。 信号传输结构包括在电源平面周期性地形成的导电块，连接相邻导电块的颈块和在接地平面处对应于颈块形成的开口，用于减小颈部块和接地平面之间的等效电容，从而改善 噪声隔离性能。