公开(公告)号：US08852971B2

公开(公告)日：2014-10-07

申请号：US13408433

申请日：2012-02-29

申请人： Eui-seok Kim ,  Won-soo Ji ,  Choo-ho Kim ,  Shin-min Rhee ,  Dong-hun Lee ,  Hee-young Jun

发明人： Eui-seok Kim ,  Won-soo Ji ,  Choo-ho Kim ,  Shin-min Rhee ,  Dong-hun Lee ,  Hee-young Jun

IPC分类号： H01L33/48 ,  H01L21/00 ,  H01L33/00 ,  B23K26/40 ,  B23K26/00

CPC分类号： B23K26/40 ,  B23K26/0093 ,  B23K2101/36 ,  B23K2103/172 ,  B23K2103/52 ,  H01L33/0095 ,  H01L2224/48091 ,  H01L2924/12044 ,  H01L2933/0033 ,  H01L2924/00014 ,  H01L2924/00

摘要： A method of cutting light emitting element packages includes preparing a ceramic substrate having a surface on which a plurality of light emitting element chips are mounted and a light-transmitting material layer is formed to cover the plurality of light emitting element chips; partially removing the light-transmitting material layer between the plurality of light emitting element chips along a cutting line by using a mechanical cutting method; and separating individual light emitting element packages by cutting the ceramic substrate along the cutting line by using a laser cutting method.

摘要翻译： 切割发光元件封装的方法包括制备具有其上安装有多个发光元件芯片的表面的陶瓷基板，并且形成透光材料层以覆盖多个发光元件芯片; 通过使用机械切割方法沿切割线部分去除多个发光元件芯片之间的透光材料层; 以及通过使用激光切割方法沿着切割线切割陶瓷基板来分离各个发光元件封装。

公开(公告)号：US20130095586A1

公开(公告)日：2013-04-18

申请号：US13408433

申请日：2012-02-29

申请人： Eui-seok KIM ,  Won-soo JI ,  Choo-ho KIM ,  Shin-min RHEE ,  Dong-hun LEE ,  Hee-young JUN

发明人： Eui-seok KIM ,  Won-soo JI ,  Choo-ho KIM ,  Shin-min RHEE ,  Dong-hun LEE ,  Hee-young JUN

IPC分类号： H01L21/78

CPC分类号： B23K26/40 ,  B23K26/0093 ,  B23K2101/36 ,  B23K2103/172 ,  B23K2103/52 ,  H01L33/0095 ,  H01L2224/48091 ,  H01L2924/12044 ,  H01L2933/0033 ,  H01L2924/00014 ,  H01L2924/00

摘要： A method of cutting light emitting element packages includes preparing a ceramic substrate having a surface on which a plurality of light emitting element chips are mounted and a light-transmitting material layer is formed to cover the plurality of light emitting element chips; partially removing the light-transmitting material layer between the plurality of light emitting element chips along a cutting line by using a mechanical cutting method; and separating individual light emitting element packages by cutting the ceramic substrate along the cutting line by using a laser cutting method.

摘要翻译： 切割发光元件封装的方法包括制备具有其上安装有多个发光元件芯片的表面的陶瓷基板，并且形成透光材料层以覆盖多个发光元件芯片; 通过使用机械切割方法沿切割线部分去除多个发光元件芯片之间的透光材料层; 以及通过使用激光切割方法沿着切割线切割陶瓷基板来分离各个发光元件封装。