公开(公告)号：US06498319B1

公开(公告)日：2002-12-24

申请号：US09631949

申请日：2000-08-03

申请人： Takashi Matsumoto ,  Shinichi Kazui ,  Masayuki Kawaharata ,  Madoka Tanouchi ,  Masatake Muranaga

发明人： Takashi Matsumoto ,  Shinichi Kazui ,  Masayuki Kawaharata ,  Madoka Tanouchi ,  Masatake Muranaga

IPC分类号： B23K2638

CPC分类号： H05K3/0029 ,  B23K26/40 ,  B23K2101/42 ,  B23K2103/172 ,  B23K2103/52 ,  B32B18/00 ,  B32B38/0004 ,  B32B2310/0843 ,  C04B35/185 ,  C04B2235/665 ,  C04B2237/348 ,  C04B2237/365 ,  C04B2237/74 ,  H01L21/481 ,  H05K1/0306 ,  H05K3/0052 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2203/163

摘要： A plurality of green sheets are prepared, and at least one board pattern is formed on each of the sheets. The sheets are laminated and bonded with each other to form a multi-layer board. The unsintered multi-layer board is cut by irradiating the periphery of at least one board pattern on the surface of the multi-layer board with laser light. When the multi-layer board is cut, the width of the cut portion of the multi-layer board is measured. The cutting width is held constant by controlling the velocity at which the multi-layer board is cut, according to the measured width. Thus a section in the multi-layer board where at least one board pattern is formed is cut away from the other section of the multi-layer board. The cut away multi-layer board is then sintered. As a result, a multi-layer board is produced.

摘要翻译： 制备多个生片，并且在每个片上形成至少一个板图案。 将这些片层压并粘合在一起形成多层板。 通过用激光照射多层板的表面上的至少一个板图案的周边来切割未烧结的多层板。 当多层板被切割时，测量多层板的切割部分的宽度。 根据测量的宽度，通过控制多层板被切割的速度来保持切割宽度不变。 因此，在多层板中形成有至少一个板图案的部分被切割成多层板的另一部分。 然后将切割的多层板烧结。 结果，制造了多层板。

公开(公告)号：US5906309A

公开(公告)日：1999-05-25

申请号：US759949

申请日：1996-12-03

申请人： Yutaka Hashimoto ,  Hideaki Sasaki ,  Mamoru Kobayashi ,  Shinichi Kazui

发明人： Yutaka Hashimoto ,  Hideaki Sasaki ,  Mamoru Kobayashi ,  Shinichi Kazui

IPC分类号： G01B11/02 ,  G01B11/06 ,  H01L21/60 ,  H01L21/66 ,  H05K13/08 ,  B23K3/08 ,  G01B11/24

CPC分类号： H05K13/08 ,  G01B11/0608 ,  H01L22/12

摘要： A work having a number of solder bumps on a substrate is mounted on a work positioning mechanism, and scanned by an optical micro head to measure errors of a mount posture of the work. Each stage is controlled to correct the errors, and thereafter, the apex positions of the bumps are scanned and measured. The measurement results are collected by a personal computer, and the measurement results together with control data of each axis are sent to a main personal computer and displayed on its screen. An error of an apex position of each bump from a regression plane is calculated, and if the error is smaller than a reference value, the work is judged to be good.

公开(公告)号：US4766009A

公开(公告)日：1988-08-23

申请号：US004279

申请日：1987-01-06

申请人： Midori Imura ,  Makoto Morijiri ,  Masanobu Hanazono ,  Shinichi Kazui

发明人： Midori Imura ,  Makoto Morijiri ,  Masanobu Hanazono ,  Shinichi Kazui

IPC分类号： C23C18/14 ,  B23K26/14 ,  C23C18/16 ,  C23C18/40 ,  C23F1/00 ,  C23F1/02 ,  C23F4/04 ,  H05K3/06 ,  H05K3/18 ,  H05K3/22 ,  B05D3/06

CPC分类号： C23C18/1669 ,  B23K26/146 ,  C23C18/161 ,  C23C18/1612 ,  C23F1/02 ,  H05K3/225 ,  H05K2203/107 ,  H05K2203/173 ,  H05K2203/175 ,  H05K3/068 ,  H05K3/187

摘要： A selective working method in which the surface to be worked of a workpiece is locally irradiated with energy beams and an electroless plating solution or an electroless etching solution is contacted with the irradiated workpiece surface, with the electroless plating solution or the electroless etching solution flowing continuously in the substantially same direction of as the direction of an irradiation of energy beams. The electroless plating of the electroless etching can be conducted selectively by this method. Above selective working method is best suited for the formation or correction (repair, filling up etc.) of micro-patterns on the workpiece such as metals, semi-conductors, insulators, etc.

摘要翻译： 使用能量束局部照射被加工物的表面和化学镀溶液或无电解蚀刻溶液的选择性加工方法与被照射的工件表面接触，化学镀溶液或无电解蚀刻溶液连续流动 在与能量束的照射方向基本相同的方向上。 无电解蚀刻的化学镀可以通过该方法选择性地进行。 上述选择性加工方法最适合于金属，半导体，绝缘子等工件上的微图案的形成或校正（修复，填充等）。

公开(公告)号：US20090014502A1

公开(公告)日：2009-01-15

申请号：US12198018

申请日：2008-08-25

申请人： Motoyuki Itoh ,  Masanori Ochiai ,  Shinichi Kazui

发明人： Motoyuki Itoh ,  Masanori Ochiai ,  Shinichi Kazui

IPC分类号： B23K31/02

CPC分类号： H01L24/11 ,  B23K3/0623 ,  H01L21/4853 ,  H01L24/742 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/11005 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K3/3478 ,  H05K2203/041 ,  H05K2203/0485 ,  H05K2203/0557 ,  H05K2203/104 ,  Y10T29/49204 ,  Y10T156/10 ,  H01L2924/00 ,  H01L2224/05599

摘要： An improved placing method and placing apparatus are provided for placing conductive balls in a predetermined pattern onto a base unit. In the placing method for placing balls having conductivity in a predetermined pattern onto one surface of the base unit, an arrangement member has one surface, another surface opposite to the one surface of the arrangement member and positioning openings, wherein the positioning openings are arranged corresponding to the pattern such that the openings are through from the one surface to the another surfaces of the arrangement member so that the balls are inserted therein. The another surface of the arrangement member is positioned opposite to the one surface of the base unit. The arrangement member has two or more line members of which the core axes are substantially aligned. The transfer device is arranged in a manner that the line members are substantially in a horizontal position to contact with the balls supplied to one surface of the arrangement member, and then the transfer device is horizontally moved with respect to the one surface of the arrangement member. Then, the balls are placed on the one surface of the base unit through the positioning openings.

摘要翻译： 提供了一种改进的放置方法和放置装置，用于将预定图案中的导电球放置在基座单元上。 在用于将具有预定图案的导电性的球放置在基座单元的一个表面上的布置方法中，布置构件具有一个表面，与布置构件的一个表面相对的另一表面和定位开口，其中定位开口相应地布置 使得开口从配置构件的一个表面延伸到另一个表面，使得球插入其中。 布置构件的另一个表面与基座单元的一个表面相对定位。 布置构件具有两个或更多个线构件，其中心轴基本对齐。 转印装置以这样的方式布置，使得线构件基本上处于水平位置以与供给到布置构件的一个表面的球接触，然后转印装置相对于布置构件的一个表面水平移动 。 然后，通过定位孔将球放置在基座单元的一个表面上。

公开(公告)号：US5940728A

公开(公告)日：1999-08-17

申请号：US647672

申请日：1996-05-15

申请人： Kaoru Katayama ,  Hiroshi Fukuda ,  Shinichi Kazui ,  Toshihiko Ohta ,  Yasuhiro Iwata ,  Mitsugu Shirai ,  Mitsunori Tamura

发明人： Kaoru Katayama ,  Hiroshi Fukuda ,  Shinichi Kazui ,  Toshihiko Ohta ,  Yasuhiro Iwata ,  Mitsugu Shirai ,  Mitsunori Tamura

IPC分类号： B23K1/005 ,  H01L21/60 ,  H05K3/34 ,  H01L21/44

CPC分类号： H01L24/75 ,  H01L24/81 ,  H05K3/3489 ,  H01L2224/1181 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2224/45144 ,  H01L2224/75 ,  H01L2224/7501 ,  H01L2224/81014 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/166 ,  H05K3/3457 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49174

摘要： A process for manufacturing electronic circuits, according to which soldering can be carried out without using flux by applying a metal surface treatment procedure which allows oxide film, organic matters, carbon or the like on the surface of metal to be easily removed without using a complex process nor unfavorably affecting electronic devices or circuit substrates. A process of connecting an electronic device and a circuit substrate by means of solder comprises the steps of irradiating the solder with a laser beam to clean the solder, aligning and mounting the electronic device on the circuit substrate, and hot-melting said solder in a low-oxygen content atmosphere to bond the electronic device and the circuit substrate.

摘要翻译： 一种用于制造电子电路的方法，根据该方法，可以通过施加允许在金属表面上的氧化物膜，有机物质，碳等的金属表面处理方法而不使用复合物来进行焊接，而不使用焊剂 过程也不利于影响电子设备或电路基板。 通过焊料连接电子设备和电路基板的过程包括以下步骤：用激光束照射焊料以清洁焊料，将电子器件对准和安装在电路基板上，并将所述焊料热熔化成 低氧含量的气氛来粘合电子器件和电路基板。

公开(公告)号：US5832595A

公开(公告)日：1998-11-10

申请号：US260382

申请日：1994-06-14

申请人： Shigenobu Maruyama ,  Mikio Hongo ,  Haruhisa Sakamoto ,  Tateoki Miyauchi ,  Ryohei Satoh ,  Kiyoshi Matsui ,  Shinichi Kazui ,  Kaoru Katayama ,  Hiroshi Fukuda

发明人： Shigenobu Maruyama ,  Mikio Hongo ,  Haruhisa Sakamoto ,  Tateoki Miyauchi ,  Ryohei Satoh ,  Kiyoshi Matsui ,  Shinichi Kazui ,  Kaoru Katayama ,  Hiroshi Fukuda

IPC分类号： H01L23/538 ,  H01L21/48 ,  H01L23/12 ,  H05K1/09 ,  H05K3/00 ,  H05K3/02 ,  H05K3/10 ,  H05K3/22

CPC分类号： H01L21/485 ,  H05K3/225 ,  H05K1/095 ,  H05K2203/0769 ,  H05K2203/0783 ,  H05K2203/107 ,  H05K2203/108 ,  H05K2203/121 ,  H05K2203/173 ,  H05K2203/175 ,  H05K3/0017 ,  H05K3/027 ,  H05K3/102 ,  Y10T29/49124 ,  Y10T29/49718 ,  Y10T29/49732

摘要： A method of modifying an electronic circuit board by performing disconnection or connection of conductive lines at a specified or an arbitrary position of the conductive lines of the electronic circuit board thereby changing an electric circuit and of completely modifying an open pattern defect of the conductive lines or an insulator layer, and its device, wherein a first energy beam is irradiated to portions of repair terminals 9 and 9' which are intended to connect or disconnect, of conductive lines 5 and 5' in the electronic circuit board thereby removing a protection layer, making windows and exposing the terminals 9 and 9' for connection; a second energy beam is irradiated thereby disconnecting the repair terminals 9 and 9', or a metal piece for connecting is supplied to between the repair terminals 9 and 9' and applying an energy thereto thereby electrically connecting them; and the disconnected or connected windowed portion is locally coated with the insulator layer thereby modifying the conductive lines of the electronic circuit board. Further, windows 311 or 311' is formed in an insulating protection layer 310 on a conductive line connecting portion 308 formed in a couple or a conductive line disconnecting portion 309, a conductive line of the conductive line disconnecting portion is disconnected or a liquid material 312 for connecting conductive lines is supplied to the conductive line connecting portion 308, a metal layer 313 is precipitated by heating the liquid material 312 thereby connecting the conductive line connecting portion 308, and the window 311 or 311' is coated with an organic insulator layer.

摘要翻译： 通过在电子电路板的导线的指定或任意位置执行导线的断开或连接来改变电子电路板的方法，从而改变电路并完全改变导电线的开路图案缺陷，或 绝缘体层及其装置，其中第一能量束照射到旨在连接或断开电子电路板中的导线5和5'的修复端子9和9'的部分，从而去除保护层， 制造窗户并露出端子9和9'用于连接; 照射第二能量束，从而断开维修端子9和9'，或者用于连接的金属片供应到修理端子9和9'之间并向其施加能量，从而电连接它们; 并且断开或连接的窗口部分局部地涂覆有绝缘体层，从而修改电子电路板的导线。 此外，窗311或311'形成在形成在耦合或导线断路部分309中的导线连接部分308上的绝缘保护层310中，导线断开部分的导线被断开或液体材料312 用于连接导线的导线被提供给导线连接部分308，金属层313通过加热液体材料312而沉淀，从而连接导线连接部分308，并且窗311或311'被涂覆有机绝缘体层。

公开(公告)号：US5498109A

公开(公告)日：1996-03-12

申请号：US215054

申请日：1994-03-21

申请人： Toshihiro Mine ,  Shinichi Kazui ,  Kenji Morita ,  Hiroyuki Ogino ,  Takeji Shiokawa ,  Hideaki Sasaki

发明人： Toshihiro Mine ,  Shinichi Kazui ,  Kenji Morita ,  Hiroyuki Ogino ,  Takeji Shiokawa ,  Hideaki Sasaki

IPC分类号： B23Q11/10 ,  B23B31/00 ,  B23B31/20 ,  B23B47/24 ,  B23D59/00 ,  B23D59/02 ,  B23Q17/09 ,  B24D7/10 ,  B24D7/18 ,  B25B11/00 ,  B28D1/04 ,  B28D1/14 ,  B28D7/02 ,  B28D7/04 ,  B23B35/00 ,  B23B39/00

CPC分类号： B25B11/005 ,  B23B31/201 ,  B23D59/001 ,  B23D59/025 ,  B23Q17/0966 ,  B28D1/041 ,  B28D7/046 ,  Y10T279/17111 ,  Y10T408/03 ,  Y10T408/14 ,  Y10T408/45

摘要： A drilling method and a drilling apparatus of a hard brittle material in which a core drill is used for abrasive grinding of high accuracy and high durability. Therefore, the structure of this invention comprises: a tubular core drill; a collet chuck for holding the core drill, including a chuck main body of an integral shape which is hollow, a seal joint provided on the chuck at the inlet side of the lubricant, a slit portion of a pin vise type for holding the core drill, which slit portion is provided on the chuck at the outlet side of the lubricant, and a seal portion provided axially inside of the slit portion, which seal portion has an inner diameter substantially equal to an outer diameter of the core drill applied to the seal portion, and a threaded portion formed on the outer periphery of a portion further axially inside of the seal portion, so that after inserting the core drill into the seal portion, a fastening nut is engaged with and tightened on the threaded portion to thereby seal and fix the core drill, and that the lubricant at a high pressure can be supplied into a central space of the core drill; and a structure for delivering the lubricant through the inner passage of the core drill.

摘要翻译： 一种硬脆材料的钻孔方法和钻孔装置，其中使用芯钻进行高精度和高耐久性的研磨。 因此，本发明的结构包括：管状芯钻; 用于保持芯钻的夹头卡盘，包括中空的整体形状的卡盘主体，设置在润滑剂入口侧的卡盘上的密封接头，用于保持芯钻的针脚的狭缝部分 所述狭缝部设置在所述润滑剂的出口侧的所述卡盘上，以及密封部，其设置在所述狭缝部的轴向内侧，所述密封部的内径基本上等于施加于所述密封件的所述芯钻的外径 以及形成在密封部分的另外轴向内侧的一部分的外周上的螺纹部分，使得在将芯钻头插入密封部分之后，紧固螺母与螺纹部分接合并紧固，从而密封和 固定芯钻，高压润滑剂可以供应到钻芯的中心空间; 以及用于通过芯钻的内部通道输送润滑剂的结构。

公开(公告)号：US5150274A

公开(公告)日：1992-09-22

申请号：US727042

申请日：1991-07-09

申请人： Kenichi Okada ,  Kyoko Amemiya ,  Takao Terabayashi ,  Hideaki Sasaki ,  Kuninori Imai ,  Shinichi Kazui

发明人： Kenichi Okada ,  Kyoko Amemiya ,  Takao Terabayashi ,  Hideaki Sasaki ,  Kuninori Imai ,  Shinichi Kazui

IPC分类号： H01L23/373 ,  H01L23/433 ,  H01L23/473

CPC分类号： H01L23/3733 ,  H01L23/4338 ,  H01L23/473 ,  H01L2224/16 ,  H01L2224/73253

摘要： A multi-channel module with a plurality of chips is mounted on a multilayer circuit board and has a simple and highly reliable structure cooling system for cooling the heat generated by the chips consuming a large amount of electric power. The cooling system uses in the horizontal direction a coolant supply pipe having straight tube sections and flexible bellows sections alternately disposed in the axial direction of the pipe. The straight tube sections of the aforesaid coolant supply pipe are brought into contact with the upper faces of the chips by a spring force so as to cool continuously the plurality of chips with the coolant flowing in one coolant supply pipe thereby providing a simply structured cooling system for chips. Such a structured cooling system enables the collective assembly of cooling parts for a plurality of chips with only a small number of parts and produces highly reliable effects thereby being able to implement the miniaturization of a main frame computer.

摘要翻译： 具有多个芯片的多通道模块安装在多层电路板上，并且具有简单且高度可靠的结构冷却系统，用于冷却由消耗大量电力的芯片产生的热量。 冷却系统在水平方向上使用具有直管段的冷却剂供应管和沿管的轴向交替设置的柔性波纹管部。 上述冷却剂供给管的直管段通过弹簧力与芯片的上表面接触，以便冷却剂在一个冷却剂供应管中流动而连续地冷却多个芯片，从而提供简单的结构化冷却系统 用于芯片 这种结构化的冷却系统使得能够将多个芯片的冷却部件集中组装，仅具有少量的部件，并且产生高度可靠的效果，从而能够实现主机计算机的小型化。

公开(公告)号：US20060086777A1

公开(公告)日：2006-04-27

申请号：US10547905

申请日：2004-03-08

申请人： Motoyuki Itoh ,  Masanori Ochiai ,  Shinichi Kazui

发明人： Motoyuki Itoh ,  Masanori Ochiai ,  Shinichi Kazui

IPC分类号： B31B1/60

CPC分类号： H01L24/11 ,  B23K3/0623 ,  H01L21/4853 ,  H01L24/742 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/11005 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K3/3478 ,  H05K2203/041 ,  H05K2203/0485 ,  H05K2203/0557 ,  H05K2203/104 ,  Y10T29/49204 ,  Y10T156/10 ,  H01L2924/00 ,  H01L2224/05599

摘要： Improved placing method and apparatus are provided for placing conductive balls in a predetermined pattern onto one surface of a base unit. An arrangement member is provided to have one surface, another surface opposite to the one surface of the arrangement member and positioning openings. The positioning openings are arranged corresponding to the pattern so that the balls are inserted therein. The another surface of the arrangement member is opposite to the one surface of the base unit. The arrangement member has two or more line members whose core axes are substantially aligned. The transfer device is arranged so that the line members are substantially in a horizontal position to contact with the balls, and then the transfer device is horizontally moved with respect to the one surface of the arrangement member. Then, the balls are placed on the one surface of the base unit through the positioning openings.

摘要翻译： 提供了改进的放置方法和装置，用于将预定图案中的导电球放置在基座单元的一个表面上。 布置构件设置成具有一个表面，与布置构件的一个表面相对的另一表面和定位开口。 定位孔对应于图案布置，使球插入其中。 布置构件的另一个表面与基座单元的一个表面相对。 布置构件具有两个或更多个线构件，其芯轴基本上对准。 传送装置被布置成使得线构件基本处于与球接触的水平位置，然后传送装置相对于布置构件的一个表面水平移动。 然后，通过定位孔将球放置在基座单元的一个表面上。

公开(公告)号：US06551449B2

公开(公告)日：2003-04-22

申请号：US09753671

申请日：2001-01-04

申请人： Keiji Fujikawa ,  Yutaka Hashimoto ,  Isamu Takaoka ,  Shinichi Kazui ,  Hideaki Sasaki ,  Hitoshi Odashima ,  Mitsugu Shirai

发明人： Keiji Fujikawa ,  Yutaka Hashimoto ,  Isamu Takaoka ,  Shinichi Kazui ,  Hideaki Sasaki ,  Hitoshi Odashima ,  Mitsugu Shirai

IPC分类号： B32B3120

CPC分类号： G06K19/0775 ,  G06K19/07749 ,  H01L23/49855 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/45144 ,  H01L2224/83192 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K3/284 ,  Y10T156/1089 ,  H01L2924/00

摘要： Electric conductor patterns including antenna coils are formed on one surface of a film. Electronic components are fixed onto the film by a temporary fixing material. A cover film is laminated on the film so that the electrically conductive patterns and the electronic components are covered with the cover film. Simultaneously with the lamination, the electronic components are connected to the electric conductor patterns.

摘要翻译： 在膜的一个表面上形成包括天线线圈的电导体图案。 电子部件通过临时固定材料固定在膜上。 覆盖膜层压在膜上，使得导电图案和电子部件被覆盖膜覆盖。 与层压同时，电子部件连接到电导体图案。