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16 条记录 (耗时 0.018 秒)

    Hybrid sensor including electrostatic capacitance sensor
    3.
    发明授权
    Hybrid sensor including electrostatic capacitance sensor 有权
    混合传感器包括静电电容传感器

    公开(公告)号：US07337681B2

    公开(公告)日：2008-03-04

    申请号：US11121930

    申请日：2005-05-05

    申请人： Shinichi Nikaido ,  Akira Kamijima ,  Yasushi Nakamura ,  Nobumasa Misaki

    发明人： Shinichi Nikaido ,  Akira Kamijima ,  Yasushi Nakamura ,  Nobumasa Misaki

    IPC分类号： G03G15/00

    CPC分类号： B60N2/002 ,  B60N2/58 ,  H01H3/141 ,  H01H2203/02 ,  H01H2239/006

    摘要： A hybrid sensor is formed by stacking a plurality of flexible sheets each provided with electrode patterns. The hybrid sensor includes a contact pressure sensor which has switches turning on or off by a pressure load, and an electrostatic capacitance sensor which detects a nearby object without contacting the object. The electrode patterns include a switching electrode pattern as the switch of the contact pressure sensor and a detecting electrode pattern as the detecting electrode of the electrostatic capacitance sensor. The detecting electrode is formed to cover substantially the entire area other than the area on which the switching electrode pattern is formed.

    摘要翻译： 混合传感器通过堆叠各自设置有电极图案的多个柔性片而形成。 混合传感器包括具有通过压力负载打开或关闭的开关的接触压力传感器，以及静电电容传感器，其在不接触物体的情况下检测附近的物体。 电极图案包括作为接触压力传感器的开关的开关电极图案和作为静电电容传感器的检测电极的检测电极图案。 检测电极形成为基本上覆盖除了形成开关电极图案的区域之外的整个区域。

    PARTIALLY MULTILAYERED WIRING BOARD AND METHOD OF MANUFACTURING PARTIALLY MULTILAYERED WIRING BOARD
    4.
    发明申请
    PARTIALLY MULTILAYERED WIRING BOARD AND METHOD OF MANUFACTURING PARTIALLY MULTILAYERED WIRING BOARD 审中-公开
    部分多层接线板及制造部分多层接线板的方法

    公开(公告)号：US20120222887A1

    公开(公告)日：2012-09-06

    申请号：US13474423

    申请日：2012-05-17

    申请人： Shinichi NIKAIDO ,  Toshiyuki HAYAMI

    发明人： Shinichi NIKAIDO ,  Toshiyuki HAYAMI

    IPC分类号： H05K1/02 ,  B32B38/10

    CPC分类号： H05K3/4652 ,  H05K3/281 ,  H05K3/386 ,  H05K3/4694 ,  H05K2201/0195 ,  H05K2201/09972

    摘要： In order to provide a partially multilayered wiring board without exposing circuits of a mother board printed board even if not separately performing protection process, such as gold plating, a partially multilayered wiring board 1 has a first insulating base material 11 having one main surface formed thereon with first conductive circuit patterns 21 and a second insulating base material 12 laminated on the one main surface of the first insulating base material 11 and having one main surface formed thereon with second conductive circuit patterns 22 smaller than a region where the first conductive circuit patterns 21 are formed, wherein the first conductive circuit patterns 21 are covered by other main surface of the second insulating base material 22.

    摘要翻译： 即使没有单独执行保护处理（例如镀金），也可以在不暴露母板印刷电路板的电路的情况下提供部分多层布线板，部分多层布线板1具有在其上形成有一个主表面的第一绝缘基材11 在第一绝缘基体材料11的一个主表面层叠有第一导电电路图案21和第二绝缘基底材料12，并且其上形成有一个主表面的第二导电电路图案22比第一导电电路图案21 其中第一导电电路图案21被第二绝缘基材22的其它主表面覆盖。

    Socket contact terminal and semiconductor device
    5.
    发明授权
    Socket contact terminal and semiconductor device 失效
    插座接触端子和半导体器件

    公开(公告)号：US08177561B2

    公开(公告)日：2012-05-15

    申请号：US12302867

    申请日：2007-05-23

    申请人： Yasuhiro Ouchi ,  Shinichi Nikaido ,  Haruo Miyazawa ,  Hirohito Watanabe ,  Katsuya Yamagami

    发明人： Yasuhiro Ouchi ,  Shinichi Nikaido ,  Haruo Miyazawa ,  Hirohito Watanabe ,  Katsuya Yamagami

    IPC分类号： H05K1/00

    CPC分类号： H05K7/1069 ,  H01L2924/3511 ,  H01R12/52 ,  H01R12/714 ,  H01R13/2485 ,  Y10T29/53209

    摘要： A socket contact terminal for electrical connection between a connection portion formed of a metal conductor on a printed circuit board and a connection terminal of an IC package. The contact terminal comprises a metal terminal composed of a main columnar portion and arm portions on both sides and having an angular U shape and an elastomeric member attached to the metal terminal. A metal surface is exposed from the outer surface of each arm portion. The elastomeric member is firmly held between the arm portions of the metal terminal and exhibits a repulsive force when the arm portions are pressed in the direction that the arm portions approach each other.

    摘要翻译： 一种插座接触端子，用于在由印刷电路板上的金属导体形成的连接部分和IC封装的连接端子之间进行电连接。 接触端子包括由主柱状部分和两侧的臂部分组成的并具有角度U形的金属端子和附接到金属端子的弹性体部件。 金属表面从每个臂部分的外表面露出。 弹性构件牢固地保持在金属端子的臂部之间，并且当臂部沿着臂部彼此接近的方向被按压时呈现排斥力。

    Connector and electronic component provided with same
    6.
    发明授权
    Connector and electronic component provided with same 失效
    连接器和电子元器件相同

    公开(公告)号：US08109768B2

    公开(公告)日：2012-02-07

    申请号：US12512399

    申请日：2009-07-30

    申请人： Shinichi Nikaido ,  Haruo Miyazawa

    发明人： Shinichi Nikaido ,  Haruo Miyazawa

    IPC分类号： H05K1/00

    CPC分类号： H01R12/57 ,  H01R12/7082 ,  H01R13/2435

    摘要： A connector is provided that includes: a molded base part having a substrate and elastomers arranged on both sides of the substrate; a plurality of through holes in the molded base part, which pass through the molded base part in a stacked direction of the substrate and the elastomers, and are arranged in parallel at predetermined spacing; and L-shaped contacts arranged via the through holes from one surface side of the molded base part to another surface side, wherein: the elastomers incorporate a plurality of first protruding parts whose top faces are inclined, and second protruding parts that protrude from top faces of the first protruding parts in a dome shape; said contact has dome shaped convex parts whose insides are hollow, and said convex parts are formed at two ends of the contact, and the convex parts are arranged such that they cover the respective second protruding parts. Also provided is an electronic component provided with this connector.

    摘要翻译： 提供了一种连接器，其包括：具有基板的模制基部和布置在基板两侧的弹性体; 所述模制基部中的多个通孔沿着所述基板和所述弹性体的层叠方向穿过所述模制基部，并且以预定间隔平行布置; 以及从成型基部的一个表面侧经由所述通孔配置到另一个表面侧的L字状的触点，其中：所述弹性体包括多个顶面倾斜的第一突出部，以及从所述顶面突出的第二突出部 的第一突出部分为圆顶形状; 所述接触件具有其内部是中空的圆顶形凸部，并且所述凸部形成在接触件的两端，并且凸部被布置成使得它们覆盖相应的第二突出部分。 还提供有设置有该连接器的电子部件。

    Connection configuration for rigid substrates
    8.
    发明授权
    Connection configuration for rigid substrates 失效
    刚性基板的连接配置

    公开(公告)号：US07642466B2

    公开(公告)日：2010-01-05

    申请号：US11679733

    申请日：2007-02-27

    申请人： Shinichi Nikaido ,  Hiroki Maruo

    发明人： Shinichi Nikaido ,  Hiroki Maruo

    IPC分类号： H05K1/00

    CPC分类号： B32B27/38 ,  B32B3/06 ,  B32B3/18 ,  B32B7/045 ,  B32B7/12 ,  B32B15/08 ,  B32B15/20 ,  B32B27/281 ,  B32B27/36 ,  B32B2262/062 ,  B32B2262/101 ,  B32B2457/08 ,  H05K1/148 ,  H05K3/305 ,  H05K3/361 ,  H05K2201/091 ,  H05K2201/09109 ,  H05K2203/1572 ,  Y10T428/24802

    摘要： There is provided a configuration in which rigid substrates are connected via flexible substrates, the connection configuration having a pair of rigid substrates each having a predetermined circuit pattern on a front and a reverse surface thereof, a first flexible substrate attached on the front surfaces of the pair of the rigid substrates so as to electrically connect the circuit patterns provided respectively on the front surfaces, a second flexible substrate attached on the reverse surfaces of the pair of the rigid substrates so as to electrically connect the circuit patterns provided respectively on the reverse surfaces. The first and the second substrate have a gap therebetween smaller than a thickness of the pair of the rigid substrates.

    摘要翻译： 提供了一种结构，其中刚性基板通过柔性基板连接，该连接结构具有一对刚性基板，每个刚性基板在其前表面和后表面上均具有预定的电路图案，第一柔性基板安装在 一对刚性基板，以便电连接分别在前表面上设置的电路图形，第二柔性基板安装在该对刚性基板的相反表面上，以便电连接分别设置在反面上的电路图案 。 第一和第二基板之间的间隙小于一对刚性基板的厚度。

    IC socket and IC package mounting device
    9.
    发明授权
    IC socket and IC package mounting device 失效
    IC插座和IC封装安装装置

    公开(公告)号：US07635268B2

    公开(公告)日：2009-12-22

    申请号：US11781052

    申请日：2007-07-20

    申请人： Shinichi Nikaido ,  Haruo Miyazawa ,  Katsuya Yamagami

    发明人： Shinichi Nikaido ,  Haruo Miyazawa ,  Katsuya Yamagami

    IPC分类号： H01R12/00

    CPC分类号： H01R13/2421 ,  H01R12/714 ,  H05K7/1069

    摘要： An IC socket includes a plurality of contacts each including a spring formed by winding a conductive material around a winding axis with an effective winding number of at least 1 round, and arms provided on both ends of the spring, and a housing including the same number of holes as the plurality of contacts, the holes each having one of the contacts inserted therein in a state in which the spring is compressed in a direction of the winding axis so as to allow adjacent coil portions in the spring to come into contact with each other and to be electrically conductive.

    摘要翻译： IC插座包括多个触点，每个触头包括弹簧，弹簧通过围绕绕线轴线缠绕导电材料而形成，有效绕组数量至少为1圈，并且臂设置在弹簧的两端，以及包括相同数量的壳体 作为多个触点的孔，在弹簧沿着卷绕轴线的方向被压缩的状态下，每个具有插入其中一个触头的孔，以使得弹簧中的相邻线圈部分能够与每个触点接触 另一个并且是导电的。

    IC SOCKET AND MANUFACTURING METHOD FOR THE SAME
    10.
    发明申请
    IC SOCKET AND MANUFACTURING METHOD FOR THE SAME 失效
    IC插座及其制造方法

    公开(公告)号：US20080020624A1

    公开(公告)日：2008-01-24

    申请号：US11781018

    申请日：2007-07-20

    申请人： Shinichi NIKAIDO ,  Haruo Miyazawa ,  Katsuya Yamagami

    发明人： Shinichi NIKAIDO ,  Haruo Miyazawa ,  Katsuya Yamagami

    IPC分类号： H01R4/50

    CPC分类号： H05K7/1069 ,  H01R12/52 ,  H01R13/24 ,  H05K3/326 ,  H05K3/4092 ,  H05K3/42 ,  H05K2201/0367 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/10378 ,  H05K2201/10719

    摘要： An aspect of the present invention inheres in an IC socket includes a plate-like socket base body which includes through hole forming portions having a plurality of contact housing holes formed so as to penetrate the plate-like socket base in a front-to-back direction, and having through holes formed around the respective contact housing holes so as to penetrate the plate-like socket base in the front-to-back direction, and a plated layer formed continuously on an inner wall of the through hole, on the front and back surfaces of the through hole forming portion, and on a surface of the contact piece.

    摘要翻译： 本发明的集成电路插座的一个方面包括一个板状插座底座本体，它包括通孔形成部分，该通孔形成部分具有多个接触容纳孔，该多个接触容纳孔形成为以前后方式穿过该板状插座底座 方向，并且具有围绕各个接触容纳孔形成的通孔，以便沿着前后方向穿透板状插座基座，以及在前面的通孔的内壁上连续形成的镀层 和通孔形成部分的后表面以及接触片的表面上。