公开(公告)号：US07977229B2

公开(公告)日：2011-07-12

申请号：US11976785

申请日：2007-10-29

申请人： Shinji Ohuchi ,  Yasushi Shiraishi ,  Yasuo Tanaka

发明人： Shinji Ohuchi ,  Yasushi Shiraishi ,  Yasuo Tanaka

IPC分类号： H01L21/66 ,  H01L21/00 ,  H01L21/44

CPC分类号： H01L24/13 ,  H01L21/563 ,  H01L23/3185 ,  H01L23/49838 ,  H01L24/11 ,  H01L24/28 ,  H01L24/94 ,  H01L2224/0231 ,  H01L2224/02379 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05553 ,  H01L2224/05647 ,  H01L2224/13027 ,  H01L2224/131 ,  H01L2224/1412 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/171 ,  H01L2224/274 ,  H01L2224/73203 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10157 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A semiconductor apparatus includes a semiconductor device to be mounted on a circuit board; a plurality of conductive posts electrically connected to the semiconductor device; and a plurality of conductive bumps each provided on an outer end of each of the conductive posts, so that the plurality of conductive bump is soldered onto the circuit board when the semiconductor device is mounted on the circuit board. A distance between a peripheral edge of the semiconductor device and an outer edge of the conductive post is determined to be narrow so that a solderbility or wetting condition of the conductive bumps can be visibly recognized easily.

摘要翻译： 一种半导体装置，包括：安装在电路板上的半导体装置; 电连接到所述半导体器件的多个导电柱; 以及多个导电凸块，每个导电凸块均设置在每个导电柱的外端上，使得当半导体器件安装在电路板上时，多个导电凸块焊接到电路板上。 半导体器件的外围边缘与导电柱的外边缘之间的距离被确定为窄，从而可以容易地明显地识别导电凸块的焊接性或润湿状态。

公开(公告)号：US07704801B2

公开(公告)日：2010-04-27

申请号：US12007874

申请日：2008-01-16

申请人： Shinji Ohuchi ,  Yasuo Tanaka

发明人： Shinji Ohuchi ,  Yasuo Tanaka

IPC分类号： H01L21/00

CPC分类号： H01L24/11 ,  H01L21/56 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05023 ,  H01L2224/05024 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01074 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2224/13099

摘要： A resin sealed semiconductor device includes a semiconductor chip having a main surface, a plurality of surface electrodes formed on the main surface of the chip, a plurality of projection electrodes formed the main surface, each projection electrode being connected to respective one surface electrodes, and a resin shield covering the main surface, the surface electrodes and side surfaces of the projection electrodes, the resin having a thermal expansion coefficient in the range of 8-10 ppm/° C. and a Young's modulus in the range of 1.8-2.0 Gpa.

摘要翻译： 树脂密封半导体器件包括具有主表面的半导体芯片，形成在芯片的主表面上的多个表面电极，形成主表面的多个突起电极，每个突起电极连接到相应的一个表面电极，以及 覆盖主表面，表面电极和突起电极的侧表面的树脂屏蔽，该树脂的热膨胀系数在8-10ppm /℃的范围内，杨氏模量在1.8-2.0Gpa的范围内 。

公开(公告)号：US07314779B2

公开(公告)日：2008-01-01

申请号：US10718549

申请日：2003-11-24

申请人： Shinji Ohuchi ,  Yasushi Shiraishi

发明人： Shinji Ohuchi ,  Yasushi Shiraishi

IPC分类号： H01L21/00

CPC分类号： H01L21/6835 ,  H01L21/56 ,  H01L21/6836 ,  H01L23/3114 ,  H01L24/27 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05026 ,  H01L2224/05569 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2224/274 ,  H01L2224/94 ,  H01L2924/00013 ,  H01L2924/01029 ,  H01L2924/14 ,  H01L2924/3511 ,  H01L2924/014 ,  H01L2224/13099 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/05647 ,  H01L2924/00014 ,  H01L2224/05124 ,  H01L2224/03 ,  H01L2224/11

摘要： A semiconductor device in accordance with the present invention reduces cracks occurring in a junction between a semiconductor device and a mounting substrate due to a heat stress when the semiconductor device is mounted on a printed circuit board or the like. The semiconductor device has a semiconductor element having a thickness of 200 μm or less, an electrode pad formed an the semiconductor element, a post electrically connected to the electrode pad, and a sealing resin for sealing a surface where circuitry is formed and the post. Furthermore, a manufacturing method for a semiconductor device in accordance with the present invention includes a step for forming an electrode pad on a main surface of a semiconductor wafer, a step for forming a post to be connected to the electrode pad, a step for resin-sealing the main surface of the semiconductor wafer and the post, a step for forming a groove from a surface of the resin to a predetermined depth of the semiconductor wafer, and a step for polishing a rear surface of the semiconductor wafer to a bottom of the groove and dividing the semiconductor wafer into individual semiconductor devices.

摘要翻译： 根据本发明的半导体器件，当将半导体器件安装在印刷电路板等上时，由于热应力，减少了在半导体器件和安装基板之间的接合处产生的裂纹。 半导体器件具有厚度为200μm或更小的半导体元件，形成半导体元件的电极焊盘，电连接到电极焊盘的柱，以及用于密封形成电路的表面的密封树脂和柱。 此外，根据本发明的半导体器件的制造方法包括在半导体晶片的主表面上形成电极焊盘的步骤，用于形成要连接到电极焊盘的柱的步骤，用于树脂的步骤 - 封装半导体晶片和柱的主表面，从树脂表面到半导体晶片的预定深度形成凹槽的步骤，以及将半导体晶片的背面抛光到底部的步骤 并将半导体晶片分成单独的半导体器件。

公开(公告)号：US07019397B2

公开(公告)日：2006-03-28

申请号：US09852847

申请日：2001-05-11

申请人： Shinji Ohuchi ,  Yasushi Shiraishi ,  Yasuo Tanaka

发明人： Shinji Ohuchi ,  Yasushi Shiraishi ,  Yasuo Tanaka

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L23/3114 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L25/0657 ,  H01L2224/13 ,  H01L2224/274 ,  H01L2224/29027 ,  H01L2224/30135 ,  H01L2224/32058 ,  H01L2224/32105 ,  H01L2224/32145 ,  H01L2224/32227 ,  H01L2224/83191 ,  H01L2224/83815 ,  H01L2225/06513 ,  H01L2225/06524 ,  H01L2225/06551 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor device capable mounting semiconductor elements having different functions without increasing the area of the semiconductor device, and its manufacturing method are presented. A part of wiring 104 is formed at the side surface of a semiconductor element 101, and bump electrodes 102 are formed so as to be nearly on a same plane as the wiring 104 formed at the side surface of the semiconductor element 101. At least a part of ball electrodes 103 is formed so as to connect electrically to the wiring 104 at the side surface of the semiconductor element, the side surface of the semiconductor element is sealed with resin exposing the wiring 104, and the confronting surface of the circuit forming surface is sealed with resin.

摘要翻译： 本发明提供一种能够安装具有不同功能的半导体元件而不增加半导体器件的面积的半导体器件及其制造方法。 布线104的一部分形成在半导体元件101的侧面，并且突起电极102形成为与形成在半导体元件101的侧面的布线104大致相同的平面。 至少一部分球形电极103被形成为与半导体元件的侧表面处的布线104电连接，半导体元件的侧表面用露出布线104的树脂密封，并且 电路形成表面用树脂密封。

公开(公告)号：US20050194682A1

公开(公告)日：2005-09-08

申请号：US11118440

申请日：2005-05-02

申请人： Shinji Ohuchi ,  Yasushi Shiraishi ,  Yasuo Tanaka

发明人： Shinji Ohuchi ,  Yasushi Shiraishi ,  Yasuo Tanaka

IPC分类号： H01L23/28 ,  H01L21/56 ,  H01L23/12 ,  H01L23/31 ,  H01L23/485 ,  H01L23/498 ,  H01L23/48 ,  H01L21/44

CPC分类号： H01L24/13 ,  H01L21/563 ,  H01L23/3185 ,  H01L23/49838 ,  H01L24/11 ,  H01L24/28 ,  H01L24/94 ,  H01L2224/0231 ,  H01L2224/02379 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05553 ,  H01L2224/05647 ,  H01L2224/13027 ,  H01L2224/131 ,  H01L2224/1412 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/171 ,  H01L2224/274 ,  H01L2224/73203 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10157 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A semiconductor apparatus includes a semiconductor device to be mounted on a circuit board; a plurality of conductive posts electrically connected to the semiconductor device; and a plurality of conductive bumps each provided on an outer end of each of the conductive posts, so that the plurality of conductive bump is soldered onto the circuit board when the semiconductor device is mounted on the circuit board. A distance between a peripheral edge of the semiconductor device and an outer edge of the conductive post is determined to be narrow so that a solderbility or wetting condition of the conductive bumps can be visibly recognized easily.

摘要翻译： 一种半导体装置，包括：安装在电路板上的半导体装置; 电连接到所述半导体器件的多个导电柱; 以及多个导电凸块，每个导电凸块均设置在每个导电柱的外端上，使得当半导体器件安装在电路板上时，多个导电凸块焊接到电路板上。 半导体器件的外围边缘与导电柱的外边缘之间的距离被确定为窄，从而可以容易地明显地识别导电凸块的焊接性或润湿状态。

公开(公告)号：US20050156298A1

公开(公告)日：2005-07-21

申请号：US11077145

申请日：2005-03-11

申请人： Shinji Ohuchi ,  Shigeru Yamada ,  Yasushi Shiraishi

发明人： Shinji Ohuchi ,  Shigeru Yamada ,  Yasushi Shiraishi

IPC分类号： H01L25/18 ,  H01L21/60 ,  H01L23/12 ,  H01L23/13 ,  H01L23/31 ,  H01L25/065 ,  H01L25/10 ,  H01L25/11 ,  H01L27/01

CPC分类号： H01L24/81 ,  H01L23/13 ,  H01L23/3128 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2221/6834 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05024 ,  H01L2224/05548 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81801 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/15156 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15321 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00015 ,  H01L2224/05599

摘要： The invention provides a semiconductor device and a method for manufacturing the same, enabling the semiconductor device to be high-densely packaged without lowering the final manufacturing yield of products. A semiconductor device 100 includes the first semiconductor device 110 having a plurality of bumps 3 which are formed on the backside surface thereof, and the second semiconductor device 120 having a plurality of terminals 2 which are formed on the front surface thereof and are to be electrically connected with the bumps, the second semiconductor device being mounted on an area which is located on the backside surface of the first semiconductor device 110 without having any bump formed therein. The height of the second semiconductor device measured from the backside surface of the first semiconductor device is made lower than the height of the bump. The second semiconductor device is mounted on the first semiconductor device such that the surface provided with no terminal of the second semiconductor device is joined to the backside surface of the first semiconductor device with the help of an adhesive 115.

摘要翻译： 本发明提供一种半导体器件及其制造方法，能够使半导体器件高密封地封装，而不降低产品的最终制造成品率。 半导体器件100包括第一半导体器件110，其具有形成在其背面上的多个凸块3，第二半导体器件120具有形成在其前表面上并且将被电连接的多个端子2 与所述凸块连接，所述第二半导体器件安装在位于所述第一半导体器件110的背面上的区域上，而不形成任何凸点。 从第一半导体器件的背面测量的第二半导体器件的高度被制成低于凸点的高度。 第二半导体器件安装在第一半导体器件上，使得没有第二半导体器件的端子的表面借助粘合剂115接合到第一半导体器件的背面。

公开(公告)号：US06911722B2

公开(公告)日：2005-06-28

申请号：US09843650

申请日：2001-04-27

申请人： Shinji Ohuchi ,  Yasushi Shiraishi ,  Yasuo Tanaka

发明人： Shinji Ohuchi ,  Yasushi Shiraishi ,  Yasuo Tanaka

IPC分类号： H01L23/28 ,  H01L21/56 ,  H01L23/12 ,  H01L23/31 ,  H01L23/485 ,  H01L23/498 ,  H01L23/04 ,  H01L23/06

CPC分类号： H01L24/13 ,  H01L21/563 ,  H01L23/3185 ,  H01L23/49838 ,  H01L24/11 ,  H01L24/28 ,  H01L24/94 ,  H01L2224/0231 ,  H01L2224/02379 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05553 ,  H01L2224/05647 ,  H01L2224/13027 ,  H01L2224/131 ,  H01L2224/1412 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/171 ,  H01L2224/274 ,  H01L2224/73203 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10157 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A semiconductor apparatus includes a semiconductor device to be mounted on a circuit board; a plurality of conductive posts electrically connected to the semiconductor device; and a plurality of conductive bumps each provided on an outer end of each of the conductive posts, so that the plurality of conductive bump is soldered onto the circuit board when the semiconductor device is mounted on the circuit board. A distance between a peripheral edge of the semiconductor device and an outer edge of the conductive post is determined to be narrow so that a solderbility or wetting condition of the conductive bumps can be visibly recognized easily.

摘要翻译： 一种半导体装置，包括：安装在电路板上的半导体装置; 电连接到所述半导体器件的多个导电柱; 以及多个导电凸块，每个导电凸块均设置在每个导电柱的外端上，使得当半导体器件安装在电路板上时，多个导电凸块焊接到电路板上。 半导体器件的外围边缘与导电柱的外边缘之间的距离被确定为窄，从而可以容易地明显地识别导电凸块的焊接性或润湿状态。

公开(公告)号：US06680535B2

公开(公告)日：2004-01-20

申请号：US10386490

申请日：2003-03-13

申请人： Shinji Ohuchi ,  Yasushi Shiraishi

发明人： Shinji Ohuchi ,  Yasushi Shiraishi

IPC分类号： H01L2348

CPC分类号： H01L21/6835 ,  H01L21/56 ,  H01L21/6836 ,  H01L23/3114 ,  H01L24/27 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05026 ,  H01L2224/05569 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2224/274 ,  H01L2224/94 ,  H01L2924/00013 ,  H01L2924/01029 ,  H01L2924/14 ,  H01L2924/3511 ,  H01L2924/014 ,  H01L2224/13099 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/05647 ,  H01L2924/00014 ,  H01L2224/05124 ,  H01L2224/03 ,  H01L2224/11

摘要： A semiconductor device in accordance with the present invention reduces cracks occurring in a junction between a semiconductor device and a mounting substrate due to a heat stress when the semiconductor device is mounted on a printed circuit board or the like. The semiconductor device has a semiconductor element having a thickness of 200 &mgr;m or less, an electrode pad formed on the semiconductor element, a post electrically connected to the electrode pad, and a sealing resin for sealing a surface where circuitry is formed and the post. Furthermore, a manufacturing method for a semiconductor device in accordance with the present invention includes a step for forming an electrode pad on a main surface of a semiconductor wafer, a step for forming a post to be connected to the electrode pad, a step for resin-sealing the main surface of the semiconductor wafer and the post, a step for forming a groove from a surface of the resin to a predetermined depth of the semiconductor wafer, and a step for polishing a rear surface of the semiconductor wafer to a bottom of the groove and dividing the semiconductor wafer into individual semiconductor devices.

摘要翻译： 根据本发明的半导体器件，当将半导体器件安装在印刷电路板等上时，由于热应力，减少了在半导体器件和安装基板之间的接合处产生的裂纹。 半导体器件具有厚度为200μm或更小的半导体元件，形成在半导体元件上的电极焊盘，电连接到电极焊盘的柱以及用于密封形成电路的表面的密封树脂和柱。 此外，根据本发明的半导体器件的制造方法包括在半导体晶片的主表面上形成电极焊盘的步骤，用于形成要连接到电极焊盘的柱的步骤，用于树脂的步骤 - 封装半导体晶片和柱的主表面，从树脂表面到半导体晶片的预定深度形成凹槽的步骤，以及将半导体晶片的背面抛光到底部的步骤 并将半导体晶片分成单独的半导体器件。

公开(公告)号：US06673651B2

公开(公告)日：2004-01-06

申请号：US09757663

申请日：2001-01-11

申请人： Shinji Ohuchi ,  Shigeru Yamada ,  Yasushi Shiraishi

发明人： Shinji Ohuchi ,  Shigeru Yamada ,  Yasushi Shiraishi

IPC分类号： H01L2144

CPC分类号： H01L24/81 ,  H01L23/13 ,  H01L23/3128 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2221/6834 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05024 ,  H01L2224/05548 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81801 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/15156 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15321 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00015 ,  H01L2224/05599

摘要： A method of manufacturing a semiconductor device includes mounting a first semiconductor element on a first surface of a base plate, wherein solder balls are formed on a second opposite surface of the base plate such that the second opposite surface includes an area without solder balls. At least one second semiconductor element is mounted to the base plate at the area of the second surface without solder balls. The at least one semiconductor element may be mounted to the base plate using low molecular adhesive, or in the alternative, high temperature solder.

摘要翻译： 一种制造半导体器件的方法包括将第一半导体元件安装在基板的第一表面上，其中焊球形成在基板的第二相对表面上，使得第二相对表面包括没有焊球的区域。 至少一个第二半导体元件在没有焊球的第二表面的区域处安装到基板。 可以使用低分子粘合剂或替代的高温焊料将至少一个半导体元件安装到基板。

公开(公告)号：US06476501B1

公开(公告)日：2002-11-05

申请号：US09460987

申请日：1999-12-15

申请人： Shinji Ohuchi ,  Yasushi Shiraishi

发明人： Shinji Ohuchi ,  Yasushi Shiraishi

IPC分类号： H01L2940

CPC分类号： H01L21/6835 ,  H01L21/56 ,  H01L21/6836 ,  H01L23/3114 ,  H01L24/27 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05026 ,  H01L2224/05569 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2224/274 ,  H01L2224/94 ,  H01L2924/00013 ,  H01L2924/01029 ,  H01L2924/14 ,  H01L2924/3511 ,  H01L2924/014 ,  H01L2224/13099 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/05647 ,  H01L2924/00014 ,  H01L2224/05124 ,  H01L2224/03 ,  H01L2224/11

摘要： A semiconductor device in accordance with the present invention reduces cracks occurring in a junction between a semiconductor device and a mounting substrate due to a heat stress when the semiconductor device is mounted on a printed circuit board or the like. The semiconductor device has a semiconductor element having a thickness of 200 &mgr;m or less, an electrode pad formed on the semiconductor element, a post electrically connected to the electrode pad, and a sealing resin for sealing a surface where circuitry is formed and the post. Furthermore, a manufacturing method for a semiconductor device in accordance with the present invention includes a step for forming an electrode pad on a main surface of a semiconductor wafer, a step for forming a post to be connected to the electrode pad, a step for resin-sealing the main surface of the semiconductor wafer and the post, a step for forming a groove from a surface of the resin to a predetermined depth of the semiconductor wafer, and a step for polishing a rear surface of the semiconductor wafer to a bottom of the groove and dividing the semiconductor wafer into individual semiconductor devices.

摘要翻译： 根据本发明的半导体器件，当将半导体器件安装在印刷电路板等上时，由于热应力，减少了在半导体器件和安装基板之间的接合处产生的裂纹。 半导体器件具有厚度为200μm或更小的半导体元件，形成在半导体元件上的电极焊盘，电连接到电极焊盘的柱以及用于密封形成电路的表面的密封树脂和柱。 此外，根据本发明的半导体器件的制造方法包括在半导体晶片的主表面上形成电极焊盘的步骤，用于形成要连接到电极焊盘的柱的步骤，用于树脂的步骤 - 封装半导体晶片和柱的主表面，从树脂表面到半导体晶片的预定深度形成凹槽的步骤，以及将半导体晶片的背面抛光到底部的步骤 并将半导体晶片分成单独的半导体器件。