Print system printer driver and printer
    1.
    发明授权
    Print system printer driver and printer 有权
    打印系统,打印机驱动程序和打印机

    公开(公告)号:US06665081B1

    公开(公告)日:2003-12-16

    申请号:US09167734

    申请日:1998-10-07

    IPC分类号: G06F1500

    摘要: A printer driver is provided in a host computer. When a print job occurs, the printer driver automatically selects the format of a plotting command to be output to a printer. As the command format, there are available two kinds of formats: a high-level printer control language format (for example, PDL), and an intermediate code format expressed in an intermediate language. When the latter format is selected, the printer driver converts a plotting command from an application to an intermediate code and then outputs the intermediate code to the printer. The printer converts the intermediate code to another intermediate code specific to the printer by a very simple processing, and then develops the intermediate code to a bit image, thereby enabling high speed printing.

    摘要翻译: 在主机中提供打印机驱动程序。 当打印作业发生时,打印机驱动程序自动选择要输出到打印机的绘图命令的格式。 作为命令格式,有两种格式:高级打印机控制语言格式(例如,PDL)和以中间语言表示的中间代码格式。 当选择后一格式时,打印机驱动程序将绘图命令从应用程序转换为中间代码,然后将中间代码输出到打印机。 打印机通过非常简单的处理将中间代码转换成打印机特有的中间代码,然后将中间代码开发成位图,从而实现高速打印。

    Fabrication method of multilayer printed wiring board
    2.
    发明授权
    Fabrication method of multilayer printed wiring board 失效
    多层印刷线路板的制作方法

    公开(公告)号:US5979044A

    公开(公告)日:1999-11-09

    申请号:US45797

    申请日:1998-03-23

    摘要: A fabrication method of a multilayer PWB is provided, which realizes a satisfactorily-high adhesion strength between a mounting pad and a cured resin of a prepreg layer located in a surface via hole. A first surface via hole is formed in a first subboard, and a second surface via hole is formed in a second subboard. Then, the first and second subboards are laminated together while placing an inner structure including a prepreg layer between the first and second subboards. The first and second surface via holes are filled with a resin contained in the prepreg layer. Filler particles are buried into first and second surface regions of the resin which are located in the first and second surface via holes, respectively. The filler particles buried into the first and second surface regions of the resin are removed by dissolving the filler particles, thereby roughening the first and second surface regions of the resin. First and second mounting pads are formed to be contacted with the roughened first and second surface regions of the resin, respectively.

    摘要翻译: 提供了一种多层PWB的制造方法,其实现了安装焊盘和位于表面通孔中的预浸料层的固化树脂之间令人满意的粘附强度。 第一表面通孔形成在第一子板中,第二表面通孔形成在第二子板中。 然后,将第一和第二子板层叠在一起,同时将包括预浸料层的内部结构放置在第一和第二底板之间。 第一和第二表面通孔填充有预浸料层中所含的树脂。 填料颗粒被埋在分别位于第一和第二表面通孔中的树脂的第一和第二表面区域中。 通过溶解填料颗粒来除去掩埋在树脂的第一和第二表面区域中的填料颗粒,从而使树脂的第一和第二表面区域变粗糙。 第一和第二安装垫分别形成为与树脂的粗糙化的第一和第二表面区域接触。