公开(公告)号：US06922119B2

公开(公告)日：2005-07-26

申请号：US10338459

申请日：2003-01-07

申请人： Shigetoshi Matsuta ,  Shoji Kai ,  Hideki Kondo ,  Akihiko Inoue

发明人： Shigetoshi Matsuta ,  Shoji Kai ,  Hideki Kondo ,  Akihiko Inoue

IPC分类号： H03H9/64 ,  H03H9/05 ,  H03H9/25 ,  H03H9/10

CPC分类号： H03H9/1071 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H03H9/0585 ,  H01L2924/00014 ,  H01L2924/00

摘要： A surface acoustic wave (SAW) filter includes a SAW chip mounted in a recession of a multi-layer substrate, a sealing plate covering the recession, an end surface electrode that is provided on the outer surface of the substrate and is in conduction with the SAW chip, a metal conductor for radiating heat that is provided on the surface at the opposite side from the sealing plate of the multi-layer substrate, and a through hole provided in the substrate, one end thereof being connected to the metal conductor. The other end of the through hole is connected with the SAW chip through the intermediary of a metal constituent, such as an electrically conductive adhesive layer.

摘要翻译： 表面声波（SAW）滤波器包括安装在多层基板的凹部中的SAW芯片，覆盖该凹部的密封板，设置在该基板的外表面上并与该基板导通的端面电极 SAW芯片，用于散热的金属导体，其设置在与多层基板的密封板相反的一侧的表面上，以及设置在基板中的通孔，其一端连接到金属导体。 通孔的另一端通过诸如导电粘合剂层的金属成分的介质与SAW芯片连接。