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    Integrated circuit package having stacked integrated circuits and method therefor
    4.
    发明申请
    Integrated circuit package having stacked integrated circuits and method therefor 审中-公开
    具有堆叠集成电路的集成电路封装及其方法

    公开(公告)号：US20060267173A1

    公开(公告)日：2006-11-30

    申请号：US11140608

    申请日：2005-05-26

    申请人： Hem Takiar ,  Shrikar Bhagath ,  Ken Ming Wang

    发明人： Hem Takiar ,  Shrikar Bhagath ,  Ken Ming Wang

    IPC分类号： H01L23/02

    CPC分类号： H01L25/0657 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48147 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/06562 ,  H01L2924/01004 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

    摘要： Improved techniques for stacking integrated circuit dies within an integrated circuit package are disclosed. These improved techniques allow greater stacking density of integrated circuit dies within an integrated circuit package. Additionally, the improved stacking techniques permit conventional bonding techniques for electrical connection of the various integrated circuit dies to each other or to a substrate. These improved approaches are particularly useful for stacking same size (and often same function) integrated circuit dies within integrated circuit packages. One example of such an integrated circuit package is a non-volatile memory integrated circuit package that contains multiple, like-sized memory storage integrated circuit dies arranged in a stack.

    摘要翻译： 公开了用于在集成电路封装内堆叠集成电路管芯的改进的技术。 这些改进的技术允许集成电路封装内的集成电路管芯的堆叠密度更高。 此外，改进的堆叠技术允许用于将各种集成电路管芯彼此或与衬底电连接的常规焊接技术。 这些改进的方法对于在集成电路封装内堆叠相同尺寸（并且通常是相同功能的）集成电路管芯特别有用。 这种集成电路封装的一个例子是非易失性存储器集成电路封装，其包含堆叠地布置的多个相同大小的存储器集成电路管芯。

    Heat sink grounded to a grounded package lid
    5.
    发明授权
    Heat sink grounded to a grounded package lid 有权
    散热器接地到接地的封装盖上

    公开(公告)号：US06512675B1

    公开(公告)日：2003-01-28

    申请号：US09764132

    申请日：2001-01-19

    申请人： Thomas S. Tarter ,  Eric S. Tosaya ,  Tom J. Ley ,  Shrikar Bhagath ,  Nhon T. Do

    发明人： Thomas S. Tarter ,  Eric S. Tosaya ,  Tom J. Ley ,  Shrikar Bhagath ,  Nhon T. Do

    IPC分类号： H05K720

    CPC分类号： H01L23/3675 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/00

    摘要： An intregrated circuit package, which has an intregrated circuit die thereto, is mounted to a system board. The ground trace of the system board is connected to the package, which has a pluality of ground leads on its surface. An electrically conductive epoxy is placed on the ground leads and adheres the package lid to the package board and ground the package lid. A heat sink is mounted to the package lid with an electrically conductive adhesive or electrically conductive slips that extend from a flange of the package lid to a flange of the heat sink to ground the heat sink.

    摘要翻译： 具有集成电路的集成电路封装被安装到系统板上。 系统板的接地线连接到封装，其表面具有接地引线。 将导电环氧树脂放置在接地引线上，并将封装盖粘合到封装板上并将封装盖接地。 散热器通过导电粘合剂或导电滑块安装到封装盖上，导电滑块从封装盖的凸缘延伸到散热器的凸缘以将散热器接地。