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公开(公告)号：US20130260534A1
公开(公告)日：2013-10-03
申请号：US13437309
申请日：2012-04-02
CPC分类号： H01L24/75 , H01L24/81 , H01L2224/131 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/75251 , H01L2224/75252 , H01L2224/75272 , H01L2224/75744 , H01L2224/75984 , H01L2224/81191 , H01L2224/81815 , H01L2225/06513 , H01L2225/06568 , H01L2924/12042 , H01L2924/1305 , H01L2924/1306 , H01L2924/15787 , H01L2924/351 , H01L2924/3511 , H01L2924/00 , H01L2924/00014 , H01L2924/014
摘要： A method is provided for bonding a semiconductor chip to a packaging substrate while minimizing the variation in the solder ball heights and controlling the stress in the solder balls and the stress in the packaging substrate. During the solder reflow, the warp of the packaging substrate, including the absolute warp, thermal warp, and substrate to substrate variations of the warp, is constrained at a minimal level by providing a clamping constraint to the packaging substrate. During cool down of the solder balls, the stresses and strains of the solder joints are maintained at levels that do not cause tear of the solder joints or breakage of the packaging substrate by removing the clamping constraint. Thus, the bonding process provides both uniform solder height with minimized solder non-wets and stress minimization of the solder balls and the packaging substrate.
摘要翻译： 提供了一种用于将半导体芯片接合到封装衬底同时最小化焊球高度的变化并控制焊球中的应力和封装衬底中的应力的方法。 在焊料回流期间，通过向包装衬底提供夹持约束，将包括绝对翘曲，热翘曲以及衬底与衬底对翘曲的变化的包装衬底的翘曲限制在最小水平。 在焊球冷却期间，焊接接头的应力和应变被保持在不会由于消除夹紧约束而引起焊点的撕裂或包装基板破裂的程度。 因此，接合过程提供均匀的焊料高度，并且使焊料球和封装衬底的最小化焊接非湿润和应力最小化。
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2.发明授权Method and system for real-time estimation and prediction of the thermal state of a microprocessor unit 有权用于实时估计和预测微处理器单元的热状态的方法和系统公开(公告)号：US08235593B2
公开(公告)日：2012-08-07
申请号：US12756781
申请日：2010-04-08
申请人： Sri M. Sri-Jayantha , Hien P. Dang , Arun Sharma
发明人： Sri M. Sri-Jayantha , Hien P. Dang , Arun Sharma
CPC分类号： G06F1/206
摘要： A method judging a temperature of a chip including using a limited set of temperature sensors and using a knowledge of a power dissipation, estimating a temperature on a surface of a chip and predicting a future temperature of the chip knowing the instruction stream characteristics to be processed by the chip.
摘要翻译： 一种判断芯片的温度的方法，包括使用有限的一组温度传感器并使用功耗知识，估计芯片表面的温度并预测芯片的未来温度，知道要处理的指令流特性 由芯片。
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3.发明授权Method and system for real-time estimation and prediction of the thermal state of a microprocessor unit 有权用于实时估计和预测微处理器单元的热状态的方法和系统公开(公告)号：US08096705B2
公开(公告)日：2012-01-17
申请号：US12756733
申请日：2010-04-08
申请人： Sri M. Sri-Jayantha , Hien P. Dang , Arun Sharma
发明人： Sri M. Sri-Jayantha , Hien P. Dang , Arun Sharma
CPC分类号： G06F1/206
摘要： A method of estimating temperature of a transient nature of a thermal system, including, without a temperature measurement being made available, determining a drive current and thermal parameters of the thermal system.
摘要翻译： 一种估计热系统的瞬态特性的温度的方法，包括在没有提供温度测量的情况下确定热系统的驱动电流和热参数。
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公开(公告)号：US20110123318A1
公开(公告)日：2011-05-26
申请号：US13015767
申请日：2011-01-28
CPC分类号： F04D25/04 , F04D29/582 , H01L23/467 , H01L2224/16 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/15311 , H01L2924/16152 , Y10T29/49236 , H01L2224/0401
摘要： A cooling system includes a moving rotor system which in turn includes: a rotating disk on which a plurality of heat conducting structures are distributed, the heat conducting structures including an inner arrangement of spiral blades; an air flow generating fan element; and an outer arrangement of heat transfer pins distributed along a perimeter of the rotating disk, the heat transfer pins having a high aspect ratio that maximizes a surface area to footprint area; wherein the spiral blades generate a mass fluid flow of ambient fluid toward the heat transfer pins such that the heat transfer pins are persistently cooled.
摘要翻译： 一种冷却系统，包括一个移动转子系统，该转动系统又包括：分配有多个导热结构的旋转盘，该导热结构包括螺旋叶片的内部装置; 气流发生风扇元件; 以及沿着旋转盘的周边分布的传热销的外部布置，传热销具有使表面积最大化到占地面积的高纵横比; 其中所述螺旋叶片产生朝向所述传热销的周围流体的质量流体流，使得所述传热销持续冷却。
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公开(公告)号：US07777301B2
公开(公告)日：2010-08-17
申请号：US12099412
申请日：2008-04-08
申请人： David Questad , Vijayeshwar D. Khanna , Jennifer V. Muncy , Arun Sharma , Sri M. Sri-Jayantha , Lorenzo Valdevit
发明人： David Questad , Vijayeshwar D. Khanna , Jennifer V. Muncy , Arun Sharma , Sri M. Sri-Jayantha , Lorenzo Valdevit
IPC分类号： H01L23/48
CPC分类号： H01L28/40 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/15174 , H01L2924/15311 , H05K1/0231 , H05K1/0271 , H05K1/111 , H05K3/3436 , H05K3/3442 , H05K2201/09036 , H05K2201/10015 , H05K2201/10727 , Y02P70/613 , Y10T29/4913 , Y10T428/24479 , H01L2224/0401 , H01L2924/00
摘要： A method of mounting an electronic component on a substrate includes forming at least one trench in a surface of the substrate. The trenches formed in the substrate reduce a stiffness of the substrate, which provides less resistance to shear. Accordingly, the trenches reduce the amount of strain on the joints, which mount the electronic component to the substrate, which enhances the life of the joints.
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公开(公告)号：US07759787B2
公开(公告)日：2010-07-20
申请号：US11935834
申请日：2007-11-06
IPC分类号： H01L23/053 , H01L23/12
CPC分类号： H05K1/0271 , H01L23/49833 , H01L23/49838 , H01L2924/0002 , H05K3/0005 , H05K3/4644 , H05K2201/09136 , H05K2201/09227 , H05K2203/1572 , Y10T29/49004 , Y10T29/49155 , H01L2924/00
摘要： A pattern matched pair of a front metal interconnect layer and a back metal interconnect layer having matched thermal expansion coefficients are provided for a reduced warp packaging substrate. Metal interconnect layers containing a high density of wiring and complex patterns are first developed so that interconnect structures for signal transmission are optimized for electrical performance. Metal interconnect layers containing a low density wiring and relatively simple patterns are then modified to match the pattern of a mirror image metal interconnect layer located on the opposite side of the core and the same number of metal interconnect layer away from the core. During this pattern-matching process, the contiguity of electrical connection in the metal layers with a low density wiring may become disrupted. The disruption is healed by an additional design step in which the contiguity of the electrical connection in the low density is reestablished.
摘要翻译： 提供具有匹配的热膨胀系数的前金属互连层和背金属互连层的图案匹配对，用于经缩短的经向包装基板。 首先开发了包含高密度布线和复杂图案的金属互连层，使得用于信号传输的互连结构被优化用于电性能。 然后修改包含低密度布线和相对简单图案的金属互连层，以匹配位于芯的相对侧上的镜像金属互连层的图案和与芯相距相同数量的金属互连层。 在这种模式匹配过程中，具有低密度布线的金属层中的电连接的连续性可能会被破坏。 通过额外的设计步骤来治愈中断，其中重新建立低密度电连接的邻接性。
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7.发明申请ELECTRONIC PACKAGE WITH A THERMAL INTERPOSER AND METHOD OF MANUFACTURING THE SAME 有权具有热插入器的电子封装及其制造方法公开(公告)号：US20100044856A1
公开(公告)日：2010-02-25
申请号：US12194448
申请日：2008-08-19
CPC分类号： H01L23/367 , H01L23/10 , H01L23/42 , H01L23/427 , H01L23/4338 , H01L23/49816 , H01L24/16 , H01L24/31 , H01L25/0657 , H01L2023/4081 , H01L2224/73253 , H01L2225/06517 , H01L2225/06589 , H01L2924/00011 , H01L2924/00014 , H01L2924/01019 , H01L2924/3512 , H01L2924/00 , H01L2224/0401
摘要： An electronic package includes a die including a thermal interface material through which a primary heat flux path is enabled for conducting heat from the die, an organic substrate, and a thermal interposer provided between the organic substrate and the die, the thermal interposer having an area extending beyond a footprint of the die, the area including the thermal interface material, the thermal interposer conducting heat generated by the die through the thermal interface material such that an auxiliary heat flux path for conducting heat generated in the die is enabled.
摘要翻译： 一种电子封装包括一个包含一个热界面材料的管芯，通过该管芯可以使一个主要的热通道用于从管芯传导热量，一个有机基板和一个设置在有机基板和管芯之间的热插入件，热插入件的面积 延伸超过管芯的覆盖区域，包括热界面材料的区域，热插入件传导由管芯通过热界面材料产生的热量，使得能够实现用于在管芯中产生的热的辅助热通路。
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公开(公告)号：US07667969B2
公开(公告)日：2010-02-23
申请号：US11686972
申请日：2007-03-16
IPC分类号： H05K7/20
CPC分类号： H01L23/473 , H01L23/42 , H01L23/433 , H01L2224/16 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/15311 , H01L2924/16152 , H01L2224/0401
摘要： Presented is a heat sink arrangement, incorporating a fluid media, which transfers heat between stationary and movable objects. Included are pump structures which are designed to be or operate integrally with the fluid-filled heat transfer apparatus, and are adapted to provide optimum and unique cooling flow paths for implementing the cooling of electronic devices, such as computer chips or the like, that require active cooling action. The pumps and heat sink arrangements selectively possess either rotating or stationary shafts, various types of impeller and fluid or cooling media circulation structures, which maximize both the convective and conductive cooling of the various components of the electronic devices or equipment by means of the circulating fluid.
摘要翻译： 提出了一种散热器装置，其包括在固定和可移动物体之间传递热量的流体介质。 包括被设计成与流体填充的传热装置一体地或与其一体操作的泵结构，并且适于提供最佳和唯一的冷却流动路径，用于实现诸如计算机芯片等的电子设备的冷却，其需要 主动冷却动作。 泵和散热器装置选择性地具有旋转或固定轴，各种类型的叶轮和流体或冷却介质循环结构，其通过循环流体使电子装置或设备的各种部件的对流和导电冷却最大化 。
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9.发明授权Method for manufacturing a shock absorber that allows a disk drive to move with respect to the chassis of a computer system 失效用于制造允许磁盘驱动器相对于计算机系统的机架移动的减震器的方法公开(公告)号：US07559132B2
公开(公告)日：2009-07-14
申请号：US10981844
申请日：2004-11-05
CPC分类号： G06F1/187 , G11B33/08 , Y10T29/49025 , Y10T29/49027 , Y10T29/4903
摘要： Embodiments of the present invention pertain to method for manufacturing a shock absorber that allows a disk drive to move with respect to the chassis of a computer system. In one embodiment, a flexure is formed that is capable of being coupled to an assembly joint. An assembly joint is formed so that the assembly joint is capable of being coupled to the flexure and the chassis of a computer system. A shock absorber is created by coupling the flexure to the assembly joint. The shock absorber has a form that can be used to flexibly couple the disk drive's enclosure with the computer system's chassis without requiring an increase in size of the chassis.
摘要翻译： 本发明的实施例涉及制造允许磁盘驱动器相对于计算机系统的机箱移动的减震器的方法。 在一个实施例中，形成能够联接到组装接头的挠曲。 组装接头形成为使得组装接头能够连接到计算机系统的挠曲件和底架。 通过将挠曲件联接到组装接头来产生减震器。 减震器具有可用于将磁盘驱动器的外壳与计算机系统的机架灵活耦合的形式，而不需要增加机箱尺寸。
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公开(公告)号：US20090114429A1
公开(公告)日：2009-05-07
申请号：US11935834
申请日：2007-11-06
CPC分类号： H05K1/0271 , H01L23/49833 , H01L23/49838 , H01L2924/0002 , H05K3/0005 , H05K3/4644 , H05K2201/09136 , H05K2201/09227 , H05K2203/1572 , Y10T29/49004 , Y10T29/49155 , H01L2924/00
摘要： A pattern matched pair of a front metal interconnect layer and a back metal interconnect layer having matched thermal expansion coefficients are provided for a reduced warp packaging substrate. Metal interconnect layers containing a high density of wiring and complex patterns are first developed so that interconnect structures for signal transmission are optimized for electrical performance. Metal interconnect layers containing a low density wiring and relatively simple patterns are then modified to match the pattern of a mirror image metal interconnect layer located on the opposite side of the core and the same number of metal interconnect layer away from the core. During this pattern-matching process, the contiguity of electrical connection in the metal layers with a low density wiring may become disrupted. The disruption is healed by an additional design step in which the contiguity of the electrical connection in the low density is reestablished.
摘要翻译： 提供具有匹配的热膨胀系数的前金属互连层和背金属互连层的图案匹配对，用于经缩短的经向包装基板。 首先开发了包含高密度布线和复杂图案的金属互连层，使得用于信号传输的互连结构被优化用于电性能。 然后修改包含低密度布线和相对简单图案的金属互连层，以匹配位于芯的相对侧上的镜像金属互连层的图案和与芯相距相同数量的金属互连层。 在这种模式匹配过程中，具有低密度布线的金属层中的电连接的连续性可能会被破坏。 通过额外的设计步骤来治愈中断，其中重新建立低密度电连接的邻接性。
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