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    Electronic device cooling with autonomous fluid routing and method of assembly
    1.
    发明授权
    Electronic device cooling with autonomous fluid routing and method of assembly 有权
    具有自主流体路线的电子设备冷却和组装方法

    公开(公告)号：US09035452B2

    公开(公告)日：2015-05-19

    申请号：US13568667

    申请日：2012-08-07

    申请人： Stanton Earl Weaver ,  Hendrik Pieter Jacobus De Bock

    发明人： Stanton Earl Weaver ,  Hendrik Pieter Jacobus De Bock

    IPC分类号： H01L23/473 ,  H01L23/38 ,  B23P15/26

    CPC分类号： B23P15/26 ,  F28F2260/02 ,  H01L23/473 ,  H01L2924/0002 ,  Y10T29/4935 ,  H01L2924/00

    摘要： An integrated circuit device is provided. The integrated circuit device includes a die having a first surface and a second surface opposite the first surface. The die has at least one circuit element positioned on its first surface. At least one micro-channel is defined in the second surface of the die. The integrated circuit device includes a cooling substrate attached to the second surface of the die. At least one fluid routing channel is defined in the cooling substrate. The at least one fluid routing channel is connected to the at least one micro-channel defined in the die. Additionally, the cooling substrate has at least one valve positioned within the at least one fluid routing channel. The at least one valve is configured to autonomously regulate a flow rate of a cooling fluid flowing through the at least one fluid routing channel.

    摘要翻译： 提供集成电路装置。 集成电路器件包括具有第一表面和与第一表面相对的第二表面的管芯。 模具具有至少一个位于其第一表面上的电路元件。 在模具的第二表面中限定至少一个微通道。 集成电路装置包括附接到模具的第二表面的冷却基板。 在冷却衬底中限定至少一个流体路线通道。 所述至少一个流体路由通道连接到在所述管芯中限定的所述至少一个微通道。 另外，冷却基板具有位于至少一个流体路由通道内的至少一个阀。 所述至少一个阀被配置为自主地调节流过所述至少一个流体路由通道的冷却流体的流量。

    Systems and methods for defect detection using exoelectrons
    2.
    发明授权
    Systems and methods for defect detection using exoelectrons 有权
    使用外电子进行缺陷检测的系统和方法

    公开(公告)号：US08829886B2

    公开(公告)日：2014-09-09

    申请号：US13325731

    申请日：2011-12-14

    申请人： Stanton Earl Weaver ,  Joseph Darryl Michael

    发明人： Stanton Earl Weaver ,  Joseph Darryl Michael

    IPC分类号： G01N27/00

    CPC分类号： G01N23/227

    摘要： An defect detection system includes an exoemission sensor having a conductive layer and an insulating layer. The exoemission sensor is mountable to a material of interest and configured to receive exoemissions from the material while in an atmosphere. The exoemission sensor outputs a signal based upon the received emissions. An analysis device is configured to receive the signal from the exoemission sensor and determine whether a defect is present in the material based upon the signal.

    摘要翻译： 缺陷检测系统包括具有导电层和绝缘层的外切传感器。 外切换传感器可安装到感兴趣的材料上并且被配置为在大气中接收材料的排出物。 外切换传感器基于接收到的发射输出信号。 分析装置被配置为从外切换传感器接收信号，并且基于该信号来确定材料中是否存在缺陷。

    THERMAL MANAGEMENT IN OPTICAL AND ELECTRONIC DEVICES
    4.
    发明申请
    THERMAL MANAGEMENT IN OPTICAL AND ELECTRONIC DEVICES 有权
    光学和电子设备的热管理

    公开(公告)号：US20140002990A1

    公开(公告)日：2014-01-02

    申请号：US13538746

    申请日：2012-06-29

    申请人： Rajdeep Sharma ,  Stanton Earl Weaver, JR.

    发明人： Rajdeep Sharma ,  Stanton Earl Weaver, JR.

    IPC分类号： H05K7/20 ,  F28D15/00

    CPC分类号： F21V29/76 ,  F21K9/23 ,  F21K9/238 ,  F21V23/004 ,  F21V23/006 ,  F21V29/74

    摘要： A thermal management system for electronic devices is provided. The thermal management system includes a plurality of synthetic jets provided in a stacked arrangement and separated by respective spacers within the stacked arrangement. The stack of synthetic jets may be used to facilitate airflow in the thermal management system, such as to facilitate air flow over a heat sink in one implementation.

    摘要翻译： 提供了一种用于电子设备的热管理系统。 热管理系统包括以层叠的方式设置的多个合成射流，并且在堆叠结构内由相应的间隔件隔开。 合成射流的堆叠可以用于促进热管理系统中的气流，例如在一个实施方案中促进空气流过散热器。

    HEAT EXCHANGE ASSEMBLY FOR USE WITH ELECTRICAL DEVICES AND METHODS OF ASSEMBLING AN ELECTRICAL DEVICE
    5.
    发明申请
    HEAT EXCHANGE ASSEMBLY FOR USE WITH ELECTRICAL DEVICES AND METHODS OF ASSEMBLING AN ELECTRICAL DEVICE 有权
    与电气设备一起使用的热交换器组件和组装电气设备的方法

    公开(公告)号：US20130170142A1

    公开(公告)日：2013-07-04

    申请号：US13340309

    申请日：2011-12-29

    申请人： Stanton Earl Weaver, JR. ,  Tao Deng ,  Hendrik Pieter Jacobus de Bock ,  Shakti Singh Chauhan

    发明人： Stanton Earl Weaver, JR. ,  Tao Deng ,  Hendrik Pieter Jacobus de Bock ,  Shakti Singh Chauhan

    IPC分类号： H05K7/20 ,  H05K13/00 ,  F28F9/00

    CPC分类号： H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

    摘要： An electrical device is described herein. The electrical device includes a housing that includes an inner surface that defines a cavity, a heat sink that is coupled to the housing and oriented along a first plane, and at least one electrical component positioned within the housing cavity and oriented along a second plane that is different than the first plane. A heat exchange assembly is coupled to the electrical component and the heat sink for adjusting a temperature of the electrical component. The heat exchange assembly includes an evaporator section, a condenser section, and a transport section extending between the evaporator section and the condenser section for channeling a working fluid between the evaporator section and the condenser section. The heat exchange assembly is configured to bend along at least one bending axis oriented with respect to the transport section.

    摘要翻译： 这里描述了一种电气设备。 电气设备包括壳体，其包括限定空腔的内表面，联接到壳体并沿着第一平面定向的散热器，以及定位在壳体空腔内并沿着第二平面定向的至少一个电气部件， 与第一架飞机不同。 热交换组件耦合到电气部件和散热器，用于调节电气部件的温度。 热交换组件包括蒸发器部分，冷凝器部分和在蒸发器部分和冷凝器部分之间延伸的输送部分，用于在蒸发器部分和冷凝器部分之间引导工作流体。 热交换组件构造成沿着相对于输送部分定向的至少一个弯曲轴线弯曲。

    LED lighting system with reflective board
    8.
    发明授权
    LED lighting system with reflective board 有权
    LED照明系统带反光板

    公开(公告)号：US07431479B2

    公开(公告)日：2008-10-07

    申请号：US11725410

    申请日：2007-03-19

    申请人： Stanton Earl Weaver, Jr. ,  Thomas Elliot Stecher

    发明人： Stanton Earl Weaver, Jr. ,  Thomas Elliot Stecher

    IPC分类号： F21V7/00

    CPC分类号： H05K1/181 ,  F21K9/00 ,  H01L25/0753 ,  H01L2924/0002 ,  H01S5/005 ,  H01S5/02216 ,  H01S5/02292 ,  H01S5/4025 ,  H05K1/0274 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/2054 ,  Y02P70/611 ,  Y10S362/80 ,  H01L2924/00

    摘要： A light emitting apparatus (8) includes one or more light emitting chips (10) that are disposed on a printed circuit board (12) and emit light predominantly in a wavelength range between about 400 nanometers and about 470 nanometers. The printed circuit board includes: (i) an electrically insulating board (14); (ii) electrically conductive printed circuitry (20); and (iii) an electrically insulating solder mask (22) having vias (24) through which the one or more light emitting chips electrically contact the printed circuitry. The solder mask (22) has a reflectance of greater than 60% at least between about 400 nanometers and about 470 nanometers.

    摘要翻译： 发光装置（8）包括设置在印刷电路板（12）上的一个或多个发光芯片（10），并且发射主要在约400纳米至约470纳米的波长范围内。 印刷电路板包括：（i）电绝缘板（14）; （ii）导电印刷电路（20）; 和（iii）具有通孔（24）的电绝缘的焊接掩模（22），所述一个或多个发光芯片通过该通孔与印刷电路电接触。 焊料掩模（22）具有大于60％的反射率，至少在约400纳米和约470纳米之间。