摘要:
This application relates to a semiconductor device comprising multiple separate leads molded in a molded structure, and a chip attached to the molded structure over at least two of the multiple separate leads.
摘要:
A connector module (31, 71) has a base body (21) having a first contact (27) for electrically contacting an optoelectronic module (72) to be positioned into a depression (36) in the base body, a second contact (25) for electronically contacting a board, and a conductive trace (23) for electrically connecting the first (27) and second (25) contacts on a surface of the base body (21), and a molded part (33), the molded part (33) being cast onto the base body (21) across a first part of the surface, and the base body (21) and/or the molded part (33) defining a through-opening (13, 19, 37) for introducing a fiber (73). The base body (21) and the molded part (33) form two jaws for gripping the fiber (73).
摘要:
A semiconductor device includes semiconductor device components, an adhesion promoter structure and a plastic housing composition. The semiconductor device components are embedded in the plastic housing composition with the adhesion promoter structure being disposed between the device components and the housing composition. The adhesion promoter structure includes first and second adhesion promoter layers. The first layer includes metal oxides. The metal oxides being silicates of a reactive compound composed of oxygen and organometallic molecules. The second layer includes at least one polymer.
摘要:
An optocoupler, for converting optical signals into electrical signals and vice versa, includes a package with a jack connector for receiving an optical waveguide. On a lower side of the package, surface-mountable outer contacts are arranged on an interconnection film. A mounting position for semiconductor chips, including one optical semiconductor chip and one application-specific semiconductor chip, is provided in the package on the optical axis of the optical waveguide. The optical semiconductor chip is aligned with the optical axis inside the package. The outer contacts are arranged outside the package on the flexible interconnection film. Between the mounting position and the outer contacts, the interconnection film includes a curved region which is embedded in the package material such that the surface-mountable outer contacts on the lower side of the package are freely accessible.
摘要:
A semiconductor having a leadframe is disclosed. In one embodiment, a leadframe is disclosed to be fitted with a semiconductor chip and is to be encapsulated with a plastic compound has a metallic single-piece base body, to which an interlayer is applied. The interlayer has a surface including a matrix of islands of remaining material of substantially uniform height, with voids extending between said islands.
摘要:
The invention relates to a radiofrequency power semiconductor module having a cavity housing constructed from three modules, a 1st module, which has an upwardly and downwardly open housing frame with horizontally arranged flat conductors, a 2nd module, which has the chip island as a heat sink with at least one radiofrequency semiconductor component, the 2nd module forming the bottom of the cavity housing, and a 3rd module, which has the housing cover.
摘要:
A leadframe for semiconductor chips and electronic devices produced on the leadframe includes providing the leadframe with a basic substrate, on which are disposed external contact elements exhibiting a rivet-shaped cross-section with a rivet head region, a rivet shank region, and a rivet foot region, as a result of which, the external contact elements are securely anchored in the housing made of a plastics compound.
摘要:
The invention relates to a method for producing an optical or electronic module provided with a plastic package. The method includes provision of at least one optical or electronic component, the component having an operative region via which it is in operative connection with the surroundings in the finished module, and application to the component of a protective layer which covers at least the operative region of the component. The method further includes encapsulation of the at least one component with at least one polymer compound to form the package, and partial removal of the polymer compound from the outside by a laser ablation device such that the polymer compound between the protective layer of the component and the outer side of the plastic package is removed. The protective layer is, in this case, not transparent with respect to the radiation emitted by the laser ablation device. The invention relates furthermore to an optical or electronic module with at least one optical or electronic component, to which a protective layer is applied.
摘要:
A semiconductor component has a housing with a first main area and a second main area opposite to the first main area, which surrounds at least one semiconductor chip. The semiconductor chip has a first metallization layer on a first main side. A second main side of the semiconductor chip borders the second main area of the semiconductor component. The first metallization layer of the semiconductor chip is connected via electrical conductors to contacts that are likewise surrounded by the housing and border the second main area. The semiconductor chip furthermore has, on the second main side, a second metallization layer for carrying signals.
摘要:
An electronic device, including a radiofrequency power module, includes a cavity housing including a housing frame with plastic walls and with a metal frame including a top side and a rear side, a metallic housing bottom including at least one chip island, and at least one semiconductor chip. Each semiconductor chip is arranged on each chip island and includes a top side and a rear side. The plastic walls of the cavity housing are connected to the metal frame in a positively locking manner with anchoring elements, and the housing bottom is connected to the rear side of the metal frame in a thermostable manner with a solder joint.