公开(公告)号：US6150255A

公开(公告)日：2000-11-21

申请号：US373868

申请日：1999-08-13

申请人： Francis Joseph Downes, Jr. ,  Stephen Joseph Fuerniss ,  Gary Ray Hill ,  Anthony Paul Ingraham ,  Voya Rista Markovich ,  Jaynal Abedin Molla

发明人： Francis Joseph Downes, Jr. ,  Stephen Joseph Fuerniss ,  Gary Ray Hill ,  Anthony Paul Ingraham ,  Voya Rista Markovich ,  Jaynal Abedin Molla

IPC分类号： H01L21/60 ,  H01L23/13 ,  H01L23/498 ,  H05K1/03 ,  H05K1/11 ,  H05K3/00 ,  H05K3/34 ,  H05K3/46 ,  H01L21/44

CPC分类号： H01L23/49833 ,  H01L23/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/0401 ,  H01L2224/05557 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/81052 ,  H01L2224/81191 ,  H01L2224/81385 ,  H01L2224/81801 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15312 ,  H01L2924/15787 ,  H05K1/0306 ,  H05K1/112 ,  H05K3/0023 ,  H05K3/3436 ,  H05K3/4644

摘要： According to the present invention a technique for providing a planarized substrate with dendritic connections of solder balls, especially a multi-layer ceramic substrate is provided. In the case where the substrate has a raised central portion on the top surface on which are disposed top surface metallurgy pads, a layer of conformable photoimagable material is placed over the top surface.The photoimagable material is exposed and developed in a pattern corresponding to the pattern of the top surface metallurgy pads to form vias in the photoimagable material. Copper is plated in the vias in contact with the top surface metallurgy pads. The exposed surface of the photoimagable surface is then planarized, preferably by mechanical polishing to form a flat planar surface, with the ends of the vias exposed. Dendritic connector pads are then grown on the exposed ends of the vias to which solder ball connections of an I/C chip are releasably connected.

摘要翻译： 根据本发明，提供了一种用于为平坦化基板提供焊球，特别是多层陶瓷基板的树枝状连接的技术。 在衬底在顶表面上具有凸起的中心部分的情况下，其上设置有顶表面冶金衬垫，一层适形的可光成像材料放置在顶表面上。 可光成像材料以对应于顶表面冶金垫的图案的图案曝光和显影，以在可光成像材料中形成通孔。 将铜镀在与顶部表面冶金垫接触的通孔中。 然后将光致变形表面的暴露表面平坦化，优选通过机械抛光以形成平坦的平坦表面，其中通孔的端部暴露。 然后，树枝状连接器焊盘在I / C芯片的焊球连接可释放地连接到的通孔的暴露端上生长。

公开(公告)号：US6015520A

公开(公告)日：2000-01-18

申请号：US857188

申请日：1997-05-15

申请人： Bernd Karl-Heinz Appelt ,  Christina Marie Boyko ,  Donald Seton Farquhar ,  Stephen Joseph Fuerniss ,  Michael Joseph Klodowski

发明人： Bernd Karl-Heinz Appelt ,  Christina Marie Boyko ,  Donald Seton Farquhar ,  Stephen Joseph Fuerniss ,  Michael Joseph Klodowski

IPC分类号： H05K3/28 ,  B29C35/08 ,  B29C61/00 ,  B29C67/00 ,  H05K1/11 ,  H05K3/00 ,  H05K3/34 ,  H05K3/40 ,  H05K3/46 ,  B29C37/02

CPC分类号： B29C61/006 ,  B29C67/004 ,  H05K3/0094 ,  B29C2035/0827 ,  B29C2791/001 ,  H05K1/112 ,  H05K2201/0959 ,  H05K2203/0278 ,  H05K3/3452 ,  H05K3/4602

摘要： A method for filling a hole in a printed wiring board (PWB) and the resultant PWB. During an intermediate stage in fabrication, a PWB comprises a lamination of dielectric sheets with metalizations on various layers and a plated through hole (PTH). A photoimageable material is formed on a surface of the laminate and covers the PTH. The photoimageable material in a region covering the PTH is partially cured by exposure to light. The remainder of the photoimageable material is developed away. Then, the partially cured photoimageable material in the region of the PTH is pressed into the PTH to form a plug. By application of heat during or after the forcing step, the plug is further cured to a hard condition. For some applications, the plug is mechanically abraded to be flush with one or both surfaces of the laminate. The plug can serve as a solder mask or permit another layer of low viscosity photoimageable material to be formed over the laminate such that the hole, now plugged, will not interfere with the formation of such additional layer.

摘要翻译： 一种用于在印刷电路板（PWB）中填充孔的方法和所得的PWB。 在制造的中间阶段期间，PWB包括在各种层上具有金属化的电介质片层压和电镀通孔（PTH）。 在该层叠体的表面上形成可光成象的材料并覆盖PTH。 覆盖PTH的区域中的可光成像材料通过曝光而部分固化。 剩余的可光成像材料被开发出来。 然后，将PTH区域中的部分固化的可光成像材料压入PTH中以形成塞子。 通过在强迫步骤期间或之后施加热量，塞子进一步固化到硬的状态。 对于一些应用，插塞被机械磨损以与层压板的一个或两个表面齐平。 塞子可以用作焊接掩模或允许在层压板上形成另一层低粘度可光成像材料层，使得现在堵塞的孔不会干扰这种附加层的形成。

公开(公告)号：US5940729A

公开(公告)日：1999-08-17

申请号：US633984

申请日：1996-04-17

申请人： Francis Joseph Downes, Jr. ,  Stephen Joseph Fuerniss ,  Gary Ray Hill ,  Anthony Paul Ingraham ,  Voya Rista Markovich ,  Jaynal Abedin Molla

发明人： Francis Joseph Downes, Jr. ,  Stephen Joseph Fuerniss ,  Gary Ray Hill ,  Anthony Paul Ingraham ,  Voya Rista Markovich ,  Jaynal Abedin Molla

IPC分类号： H01L21/60 ,  H01L23/13 ,  H01L23/498 ,  H05K1/03 ,  H05K1/11 ,  H05K3/00 ,  H05K3/34 ,  H05K3/46 ,  H01L21/44

CPC分类号： H01L23/49833 ,  H01L23/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/0401 ,  H01L2224/05557 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/81052 ,  H01L2224/81191 ,  H01L2224/81385 ,  H01L2224/81801 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15312 ,  H01L2924/15787 ,  H05K1/0306 ,  H05K1/112 ,  H05K3/0023 ,  H05K3/3436 ,  H05K3/4644

摘要： According to the present invention a technique for providing a planarized substrate with dendritic connections of solder balls, especially a multi-layer ceramic substrate is provided. In the case where the substrate has a raised central portion on the top surface on which are disposed top surface metallurgy pads, a layer of conformable photoimagable material is placed over the top surface.The photoimagable material is exposed and developed in a pattern corresponding to the pattern of the top surface metallurgy pads to form vias in the photoimagable material. Copper is plated in the vias in contact with the top surface metallurgy pads. The exposed surface of the photoimagable surface is then planarized, preferably by mechanical polishing to form a flat planar surface, with the ends of the vias exposed. Dendritic connector pads are then grown on the exposed ends of the vias to which solder ball connections of an I/C chip are releasably connected.

公开(公告)号：US06730409B1

公开(公告)日：2004-05-04

申请号：US09322132

申请日：1999-05-27

申请人： Anastasios P. Angelopoulos ,  Stephen Joseph Fuerniss ,  Joseph Alphonse Kotylo ,  Luis Jesus Matienzo ,  Norman L. Shaver

发明人： Anastasios P. Angelopoulos ,  Stephen Joseph Fuerniss ,  Joseph Alphonse Kotylo ,  Luis Jesus Matienzo ,  Norman L. Shaver

IPC分类号： B32B1508

CPC分类号： B32B15/08 ,  B32B15/085 ,  B32B15/088 ,  B32B15/092 ,  B32B2311/04 ,  B32B2311/12 ,  B32B2311/18 ,  B32B2311/24 ,  B32B2323/10 ,  B32B2355/02 ,  B32B2369/00 ,  C08J5/124 ,  G03F7/11 ,  H05K3/0079 ,  H05K3/064 ,  H05K3/108 ,  H05K3/28 ,  H05K2203/0577 ,  H05K2203/0786 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31692

摘要： A structure comprising a metallic surface, a layer of a polymeric material and a water soluble polymeric material located between the metallic surface and the layer of polymeric material, and process of fabricating such are provided. The structure exhibits enhanced adhesion between the metallic surface and the polymeric material.

摘要翻译： 提供了包括金属表面，聚合物材料层和位于金属表面和聚合物材料层之间的水溶性聚合材料的结构以及其制造方法。 该结构在金属表面和聚合物材料之间表现出增强的粘合性。

公开(公告)号：US6156484A

公开(公告)日：2000-12-05

申请号：US21758

申请日：1998-02-11

申请人： Ernest Bassous ,  Gobinda Das ,  Frank Daniel Egitto ,  Natalie Barbara Feilchenfeld ,  Elizabeth F. Foster ,  Stephen Joseph Fuerniss ,  James Steven Kamperman ,  Donald Joseph Mikalsen ,  Michael Roy Scheuermann ,  David Brian Stone

发明人： Ernest Bassous ,  Gobinda Das ,  Frank Daniel Egitto ,  Natalie Barbara Feilchenfeld ,  Elizabeth F. Foster ,  Stephen Joseph Fuerniss ,  James Steven Kamperman ,  Donald Joseph Mikalsen ,  Michael Roy Scheuermann ,  David Brian Stone

IPC分类号： G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  G03F7/00

CPC分类号： G01R1/06738 ,  G01R1/07314 ,  G01R3/00

摘要： Disclosed is a sculpted probe pad and a gray scale etching process for making arrays of such probe pads on a thin flexible interposer for testing the electrical integrity of microelectronic devices at terminal metallurgy. Also used in the etching process is a novel fixture for holding the substrate and a novel mask for 1-step photolithographic exposure. The result of the invention is an array of test probes of preselected uniform topography, which make ohmic contact at all points to be tested simultaneously and nondestructively.

摘要翻译： 公开了一种雕刻的探针焊盘和灰度蚀刻工艺，用于在薄的柔性插入件上制造这种探针焊盘的阵列，用于测试终端冶金时的微电子器件的电气完整性。 用于蚀刻工艺中的还有一种用于保持衬底的新型夹具和用于1步光刻曝光的新型掩模。 本发明的结果是预选的均匀地形的测试探针的阵列，其在所有点上进行欧姆接触以同时且非破坏性地测试。

公开(公告)号：US6150726A

公开(公告)日：2000-11-21

申请号：US88834

申请日：1998-06-02

申请人： Natalie Barbara Feilchenfeld ,  Stephen Joseph Fuerniss ,  Michael Anthony Gaynes ,  Mark Vincent Pierson ,  Pat Hoontrakul

发明人： Natalie Barbara Feilchenfeld ,  Stephen Joseph Fuerniss ,  Michael Anthony Gaynes ,  Mark Vincent Pierson ,  Pat Hoontrakul

IPC分类号： G03F7/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L23/498 ,  H05K3/12 ,  H05K3/28 ,  H05K3/32 ,  H05K3/34 ,  H05K1/11 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L29/62

CPC分类号： H01L24/16 ,  G03F7/00 ,  G03F7/0035 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/4867 ,  H01L21/563 ,  H01L23/49816 ,  H01L24/12 ,  H01L24/29 ,  H01L24/83 ,  H05K3/321 ,  H05K3/3484 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/3025 ,  H05K2201/0218 ,  H05K2201/0245 ,  H05K2201/10674 ,  H05K2201/10984 ,  H05K2203/0568 ,  H05K2203/0577 ,  H05K2203/0769 ,  H05K3/1216 ,  H05K3/28 ,  H05K3/3463

摘要： Chip carrier packages, integrated circuits, wiring boards, and assemblies in computer systems are made having conductive adhesive interconnections. Electrically conductive polymer paste with metal particles and powders are used with photoimagable polymer films to form the interconnection structure. These articles are produced with screening and printing processes using a screening head and printing machine.

摘要翻译： 计算机系统中的芯片载体封装，集成电路，布线板和组件被制成具有导电粘合剂互连。 具有金属颗粒和粉末的导电聚合物浆料与光可塑聚合物膜一起使用以形成互连结构。 这些物品使用筛选头和印刷机进行筛选和印刷。

公开(公告)号：US5919596A

公开(公告)日：1999-07-06

申请号：US798592

申请日：1997-02-11

申请人： Jeffrey C. Hedrick ,  Konstantinos Papathomas ,  Stephen L. Tisdale ,  Alfred Viehbeck ,  Jeffrey D. Gelorme ,  Voya Rista Markovich ,  Thomas H. Lewis ,  Stephen Joseph Fuerniss

发明人： Jeffrey C. Hedrick ,  Konstantinos Papathomas ,  Stephen L. Tisdale ,  Alfred Viehbeck ,  Jeffrey D. Gelorme ,  Voya Rista Markovich ,  Thomas H. Lewis ,  Stephen Joseph Fuerniss

IPC分类号： G03F7/027 ,  C08L79/00 ,  G03F7/029 ,  G03F7/38 ,  H01L21/027 ,  G03F7/26

CPC分类号： G03F7/38 ,  Y10S430/106

摘要： Disclosed is an admixture which is curable to form a crack resistant, photosensitive polycyanurate resist. Also disclosed is a structure for its use and process of making. The resist can be tailored to be either positively or negatively sensitive to actinic radiation. Because of its improved thermal and mechanical properties, the cured resist is suitable for use at high temperature, such as in electronic packaging applications.

摘要翻译： 公开了一种可固化以形成耐裂纹的光敏聚氰化脲抗蚀剂的混合物。 还公开了其使用和制造过程的结构。 抗蚀剂可以被定制为对光化辐射是积极或消极敏感的。 由于其热和机械性能的改善，固化的抗蚀剂适合在高温下使用，例如在电子封装应用中。

公开(公告)号：US5872337A

公开(公告)日：1999-02-16

申请号：US711240

申请日：1996-09-09

申请人： Donald Seton Farquhar ,  Stephen Joseph Fuerniss ,  Charles Robert Davis ,  David Lee Questad ,  Darbha Suryanarayana ,  Jeffrey Alan Zimmerman

发明人： Donald Seton Farquhar ,  Stephen Joseph Fuerniss ,  Charles Robert Davis ,  David Lee Questad ,  Darbha Suryanarayana ,  Jeffrey Alan Zimmerman

IPC分类号： H01L23/538 ,  H05K1/00 ,  H05K3/00

CPC分类号： H05K1/0281 ,  H01L23/5387 ,  H05K3/4691 ,  H01L2924/0002 ,  H05K2201/09109 ,  H05K2201/2009

摘要： Reinforcement members are disposed along only the transverse edge regions of selected flexible cables of an integral chip carrier and cable assembly, and along only the respectively aligned end areas of the chip carrier portion of the assembly. The reinforcement members may be disposed along all of the flexible cables and end areas of the assembly, or on only selected cable and end area portions of the assembly. The reinforcement members are formed of a tough tear resistant polymer material, such as a hot melt adhesive or polymer tape or film.

摘要翻译： 加强构件仅沿着整体芯片载体和电缆组件的选定柔性电缆的横向边缘区域布置，并且仅沿着组件的芯片承载部分的相应对准的端部区域布置。 加强构件可以沿着组件的所有柔性电缆和端部区域，或仅在组件的所选择的电缆和端部区域部分设置。 加强构件由坚韧的抗撕裂聚合物材料形成，例如热熔粘合剂或聚合物带或膜。

公开(公告)号：US6129955A

公开(公告)日：2000-10-10

申请号：US874219

申请日：1997-06-13

申请人： Konstantinos I. Papathomas ,  Stephen Joseph Fuerniss ,  Deborah Lynn Dittrich ,  David Wei Wang

发明人： Konstantinos I. Papathomas ,  Stephen Joseph Fuerniss ,  Deborah Lynn Dittrich ,  David Wei Wang

IPC分类号： C08G59/18 ,  C08F2/48 ,  C08G59/00 ,  C08G59/68 ,  C08G73/02 ,  H01L23/29 ,  H01L23/31 ,  H05K3/28 ,  H05K3/34 ,  C08F2/50 ,  H01L21/56

CPC分类号： H05K3/284 ,  H01L2224/48091 ,  H01L2224/48472 ,  H05K3/3421

摘要： An electronic package assembly where a low profile integrated circuit chip package is soldered to an organic (e.g., epoxy resin) substrate, e.g., a printed circuit board or card, the projecting conductive leads of the integrated circuit chip package and the solder which substantially covers these leads (and respective conductors on the substrate) having been substantially covered with ultraviolet photocured encapsulant material (e.g., an epoxy resin or a cyanate with a photoinitiator and silica) to provide reinforcement for the solder-lead connections. The encapsulant material is dispensed about the solder and lead joints following solder reflow and solidification so as to substantially surround the solder and any portions of the leads not covered with solder.

摘要翻译： 一种电子封装组件，其中将低剖面集成电路芯片封装焊接到有机（例如环氧树脂）衬底（例如印刷电路板或卡）上，集成电路芯片封装的突出导电引线和基本覆盖的焊料 这些引线（以及基板上的相应导体）基本上被紫外光固化的密封剂材料（例如，环氧树脂或具有光引发剂和二氧化硅的氰酸酯）覆盖，以为焊锡引线连接提供增强。 在焊料回流和固化之后，密封剂材料围绕焊料和引线接头分配，以便基本上围绕焊料，并且引线的任何部分未被焊料覆盖。

公开(公告)号：US5759737A

公开(公告)日：1998-06-02

申请号：US709375

申请日：1996-09-06

申请人： Natalie Barbara Feilchenfeld ,  Stephen Joseph Fuerniss ,  Michael Anthony Gaynes ,  Mark Vincent Pierson ,  Pat Hoontrakul

发明人： Natalie Barbara Feilchenfeld ,  Stephen Joseph Fuerniss ,  Michael Anthony Gaynes ,  Mark Vincent Pierson ,  Pat Hoontrakul

IPC分类号： G03F7/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L23/498 ,  H05K3/12 ,  H05K3/28 ,  H05K3/32 ,  H05K3/34 ,  G03C5/00

CPC分类号： H01L24/16 ,  G03F7/00 ,  G03F7/0035 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/4867 ,  H01L21/563 ,  H01L23/49816 ,  H01L24/12 ,  H01L24/29 ,  H01L24/83 ,  H05K3/321 ,  H05K3/3484 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/3025 ,  H05K2201/0218 ,  H05K2201/0245 ,  H05K2201/10674 ,  H05K2201/10984 ,  H05K2203/0568 ,  H05K2203/0577 ,  H05K2203/0769 ,  H05K3/1216 ,  H05K3/28 ,  H05K3/3463

摘要： Chip carrier packages, integrated circuits, wiring boards, and assemblies in computer systems are made having conductive adhesive interconnections. Electrically conductive polymer paste with metal particles and powders are used with photoimagable polymer films to form the interconnection structure. These articles are produced with screening and printing processes using a screening head and printing machine.

摘要翻译： 计算机系统中的芯片载体封装，集成电路，布线板和组件被制成具有导电粘合剂互连。 具有金属颗粒和粉末的导电聚合物浆料与光可塑聚合物膜一起使用以形成互连结构。 这些物品使用筛选头和印刷机进行筛选和印刷。