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    Method for bonding heatsink to multiple-height chip
    1.
    发明授权
    Method for bonding heatsink to multiple-height chip 失效
    将散热片连接到多芯片芯片的方法

    公开(公告)号：US06214647B1

    公开(公告)日：2001-04-10

    申请号：US09159239

    申请日：1998-09-23

    申请人： Giulio Di Giacomo ,  Stephen S. Drofitz, Jr. ,  David L. Edwards ,  Sushumna Iruvanti ,  David J. Womac

    发明人： Giulio Di Giacomo ,  Stephen S. Drofitz, Jr. ,  David L. Edwards ,  Sushumna Iruvanti ,  David J. Womac

    IPC分类号： H01L2144

    CPC分类号： H01L23/4338 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/09701

    摘要： A method and structure for thermally connecting a thermal conductor to at least one chip, the thermal conductor including a lower surface and at least one piston extending from the lower surface corresponding to each of the chips, each of the chips having an upper surface opposing each of the pistons, the chips being mounted on a substrate, the method comprising steps of metalizing the lower surface of the thermal conductor and the pistons, applying a solder to the lower surface of the thermal conductor, applying a thermal paste between the upper surface of the chips and the pistons, positioning the substrate and the thermal conductor such that the substrate is aligned with the thermal conductor, biasing the thermal conductor toward the substrate, biasing the pistons toward the chips such that the thermal paste has a consistent thickness between each of the chips and the pistons, reflowing the solder, such that the solder bonds the substrate to the thermal conductor and the pistons form a metallurgical bond with the thermal conductor, wherein after the reflowing step, the pistons and the thermal conductor form a unitary structure for maintaining the consistent thickness of the thermal paste between each of the chips and the pistons which achieves a considerably thinner thermal paste layer and greater thermal conduction.

    摘要翻译： 一种用于将热导体热连接到至少一个芯片的方法和结构，所述热导体包括下表面和从与每个芯片对应的下表面延伸的至少一个活塞，每个芯片具有与每个芯片相对的上表面 的活塞，所述芯片安装在基板上，所述方法包括以下步骤：使所述导热体和所述活塞的下表面金属化，向所述导热体的下表面施加焊料，在所述导热体的上表面 芯片和活塞，定位衬底和热导体，使得衬底与热导体对准，将热导体偏压朝向衬底，将活塞偏压到芯片，使得热膏在每个之间具有一致的厚度 芯片和活塞，回流焊料，使得焊料将基板粘合到热导体和活塞上 与热导体进行冶金结合，其中在回流步骤之后，活塞和热导体形成整体结构，用于保持每个芯片和活塞之间的热粘合剂的厚度一致，其实现相当薄的热糊层，并且 更大的热传导。

    Determination of electric current flow patterns
    5.
    发明授权
    Determination of electric current flow patterns 失效
    电流流动模式的确定

    公开(公告)号：US4272722A

    公开(公告)日：1981-06-09

    申请号：US26491

    申请日：1979-04-03

    申请人： Armando S. Cammarano ,  Giulio DiGiacomo ,  Stephen S. Drofitz, Jr.

    发明人： Armando S. Cammarano ,  Giulio DiGiacomo ,  Stephen S. Drofitz, Jr.

    IPC分类号： G01R19/00 ,  G01R19/08 ,  G01R19/15 ,  G01R31/302 ,  H01L21/66

    CPC分类号： G01R19/15 ,  G01R19/0092 ,  G01R19/08

    摘要： A method for determining the paths of current flow in an irregularly shaped conductor. A metal is plated onto a substrate in the desired geometric pattern. The metal is then brought to within about 4 percent of its melting point and a current is put through it. After an amount of time that depends upon the temperature and current utilized, there will have been a mass migration in the metal resulting in a corrugated surface having ridges and valleys that are parallel to the current flow. The ridges and valleys may be observed optically or by scanning electron microscope.

    摘要翻译： 一种用于确定不规则形状导体中的电流流动路径的方法。 以期望的几何图案将金属镀在基底上。 然后将金属置于其熔点的约4％内，并通过电流。 在取决于所使用的温度和电流的一段时间之后，在金属中将存在质量迁移，导致波纹表面具有平行于电流的脊和谷。 可以光学地或通过扫描电子显微镜观察脊和谷。