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1.发明申请MICROELECTRONIC COMPONENT ASSEMBLIES HAVING LEAD FRAMES ADAPTED TO REDUCE PACKAGE BOW 有权具有适用于减少包装袋的引线框架的微电子组件组件公开(公告)号：US20070128770A1
公开(公告)日：2007-06-07
申请号：US11672297
申请日：2007-02-07
Applicant: Steven Groothuis , Steven Smith , Steve Baughman , Bernard Ball , T. O'Connor
Inventor： Steven Groothuis , Steven Smith , Steve Baughman , Bernard Ball , T. O'Connor
IPC: H01L21/00
CPC classification number: H01L23/4951 , H01L23/3107 , H01L23/49544 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/05599 , H01L2224/32245 , H01L2224/45099 , H01L2224/4826 , H01L2224/49171 , H01L2224/73215 , H01L2224/85399 , H01L2924/00014 , H01L2924/14 , H01L2924/1433 , H01L2924/181 , H01L2224/45015 , H01L2924/207 , H01L2924/00 , H01L2924/00012
Abstract: The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, the invention provides a microelectronic component assembly that includes spaced-apart first and second lead frame members. A packaged element is disposed between the lead frame members and attached thereto only by a plurality of elongate, flexible links that permit the packaged element to accommodate thermally induced stresses by floating with respect to the first and second lead frame members.
Abstract translation: 本公开提出了用于制造微电子部件组件的各种微电子部件组件设计和方法。 在一个具体实施方式中，本发明提供一种微电子部件组件，其包括间隔开的第一和第二引线框架部件。 封装元件设置在引线框架构件之间并且仅通过多个细长的柔性连接件连接，其允许封装元件通过相对于第一引线框架构件和第二引线框架构件浮动来适应热引起的应力。
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2.发明授权Semiconductor device packages including thermally insulating materials and methods of making and using such semiconductor packages 有权包括绝热材料的半导体器件封装以及制造和使用这种半导体封装的方法
公开(公告)号：US08816494B2
公开(公告)日：2014-08-26
申请号：US13547296
申请日：2012-07-12
Applicant: Steven Groothuis , Jian Li , Shijian Luo
Inventor： Steven Groothuis , Jian Li , Shijian Luo
CPC classification number: H01L23/367 , H01L23/3128 , H01L23/3135 , H01L23/3185 , H01L23/34 , H01L23/433 , H01L25/0657 , H01L25/18 , H01L2224/131 , H01L2224/16146 , H01L2224/16225 , H01L2224/16227 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06562 , H01L2225/06568 , H01L2225/06589 , H01L2924/15311 , H01L2924/00014
Abstract: Semiconductor device packages comprise a first semiconductor device comprising a heat-generating region located on at least one end thereof. A second semiconductor device is attached to the first semiconductor device. At least a portion of the heat-generating region extends laterally beyond at least one corresponding end of the second semiconductor device. A thermally insulating material at least partially covers the end of the second semiconductor device. Methods of forming a semiconductor device packages comprise attaching a second semiconductor device to a first semiconductor device. The first semiconductor device comprises a heat-generating region at an end thereof. At least a portion of the heat-generating region extends laterally beyond an end of the second semiconductor device. The end of the second semiconductor device is at least partially covered with a thermally insulating material.
Abstract translation: 半导体器件封装包括第一半导体器件，其包括位于其至少一端上的发热区域。 第二半导体器件附接到第一半导体器件。 发热区域的至少一部分横向延伸超过第二半导体器件的至少一个对应的端部。 绝热材料至少部分地覆盖第二半导体器件的端部。 形成半导体器件封装的方法包括将第二半导体器件附接到第一半导体器件。 第一半导体器件在其末端包括发热区域。 发热区域的至少一部分横向延伸超过第二半导体器件的端部。 第二半导体器件的端部至少部分地被绝热材料覆盖。
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3.发明申请SEMICONDUCTOR DEVICE PACKAGES INCLUDING THERMALLY INSULATING MATERIALS AND METHODS OF MAKING AND USING SUCH SEMICONDUCTOR PACKAGES 有权包括热绝缘材料的半导体器件封装及其制造和使用这种半导体封装的方法
公开(公告)号：US20140015598A1
公开(公告)日：2014-01-16
申请号：US13547296
申请日：2012-07-12
Applicant: Steven Groothuis , Jian Li , Shijian Luo
Inventor： Steven Groothuis , Jian Li , Shijian Luo
CPC classification number: H01L23/367 , H01L23/3128 , H01L23/3135 , H01L23/3185 , H01L23/34 , H01L23/433 , H01L25/0657 , H01L25/18 , H01L2224/131 , H01L2224/16146 , H01L2224/16225 , H01L2224/16227 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06562 , H01L2225/06568 , H01L2225/06589 , H01L2924/15311 , H01L2924/00014
Abstract: Semiconductor device packages comprise a first semiconductor device comprising a heat-generating region located on at least one end thereof. A second semiconductor device is attached to the first semiconductor device. At least a portion of the heat-generating region extends laterally beyond at least one corresponding end of the second semiconductor device. A thermally insulating material at least partially covers the end of the second semiconductor device. Methods of forming a semiconductor device packages comprise attaching a second semiconductor device to a first semiconductor device. The first semiconductor device comprises a heat-generating region at an end thereof. At least a portion of the heat-generating region extends laterally beyond an end of the second semiconductor device. The end of the second semiconductor device is at least partially covered with a thermally insulating material.
Abstract translation: 半导体器件封装包括第一半导体器件，其包括位于其至少一端上的发热区域。 第二半导体器件附接到第一半导体器件。 发热区域的至少一部分横向延伸超过第二半导体器件的至少一个对应的端部。 绝热材料至少部分地覆盖第二半导体器件的端部。 形成半导体器件封装的方法包括将第二半导体器件附接到第一半导体器件。 第一半导体器件在其末端包括发热区域。 发热区域的至少一部分横向延伸超过第二半导体器件的端部。 第二半导体器件的端部至少部分地被绝热材料覆盖。
