公开(公告)号：US08180686B2

公开(公告)日：2012-05-15

申请号：US12614227

申请日：2009-11-06

申请人： Gung-seon Ryu ,  Jung-wook Shin ,  Su-jin Lim

发明人： Gung-seon Ryu ,  Jung-wook Shin ,  Su-jin Lim

IPC分类号： G06Q30/00

CPC分类号： G06Q30/00 ,  G06Q20/32 ,  G06Q20/385 ,  G06Q20/40 ,  G06Q30/0609 ,  G06Q30/0635 ,  G06Q30/0637 ,  H04L9/3228 ,  H04L63/0838 ,  H04L2209/56 ,  H04L2209/80 ,  H04W12/06

摘要： Disclosed herein is a multi-step authentication-based electronic payment method using a mobile terminal. Order request information of a product is sequentially transmitted to an affiliated store server and a PG company server, and the product and a relevant affiliated store are verified. A mobile communication company server primarily authenticates the user, and the PG company server generates an OTP. The OTP is transmitted to allow the PG company server to secondarily authenticate the user using the OTP. The affiliated store server requests the PG company server to confirm information about a payment for the product and information about authentication of the user, and the PG company server confirms payment and authentication information. The affiliated store server requests the PG company server to process payment for the product, the PG company server requests the mobile communication company server to process payment, and the mobile communication company server processes requested payment.

摘要翻译： 本文公开了使用移动终端的基于多步骤认证的电子支付方法。 产品的订单请求信息被顺序地发送到附属的商店服务器和PG公司服务器，并且产品和相关的附属商店被验证。 移动通信公司服务器主要认证用户，PG公司服务器生成OTP。 发送OTP以允许PG公司服务器使用OTP二次认证用户。 附属店服务器要求PG公司服务器确认产品付款信息和用户认证信息，PG公司服务器确认付款和认证信息。 附属店服务器要求PG公司服务器处理产品的付款，PG公司服务器请求移动通信公司服务器处理付款，移动通信公司服务器处理所请求的付款。

公开(公告)号：US20110082767A1

公开(公告)日：2011-04-07

申请号：US12614227

申请日：2009-11-06

申请人： Gung-seon Ryu ,  Jung-wook Shin ,  Su-jin Lim

发明人： Gung-seon Ryu ,  Jung-wook Shin ,  Su-jin Lim

IPC分类号： G06Q30/00 ,  G06Q20/00 ,  H04L9/32 ,  G06F21/00

CPC分类号： G06Q30/00 ,  G06Q20/32 ,  G06Q20/385 ,  G06Q20/40 ,  G06Q30/0609 ,  G06Q30/0635 ,  G06Q30/0637 ,  H04L9/3228 ,  H04L63/0838 ,  H04L2209/56 ,  H04L2209/80 ,  H04W12/06

摘要： Disclosed herein is a multi-step authentication-based electronic payment method using a mobile terminal. Order request information of a product is sequentially transmitted to an affiliated store server and a PG company server, and the product and a relevant affiliated store are verified. A mobile communication company server primarily authenticates the user, and the PG company server generates an OTP. The OTP is transmitted to allow the PG company server to secondarily authenticate the user using the OTP. The affiliated store server requests the PG company server to confirm information about a payment for the product and to information about authentication of the user, and the PG company server confirms payment and authentication information. The affiliated store server requests the PG company server to process payment for the product, the PG company server requests the mobile communication company server to process payment, and the mobile communication company server processes requested payment.

摘要翻译： 本文公开了使用移动终端的基于多步骤认证的电子支付方法。 产品的订单请求信息被顺序地发送到附属的商店服务器和PG公司服务器，并且产品和相关的附属商店被验证。 移动通信公司服务器主要认证用户，PG公司服务器生成OTP。 发送OTP以允许PG公司服务器使用OTP二次认证用户。 附属店服务器要求PG公司服务器确认有关产品付款的信息以及关于用户认证的信息，PG公司服务器确认付款和认证信息。 附属店服务器要求PG公司服务器处理产品的付款，PG公司服务器请求移动通信公司服务器处理付款，移动通信公司服务器处理所请求的付款。

公开(公告)号：US20070176281A1

公开(公告)日：2007-08-02

申请号：US11698884

申请日：2007-01-29

申请人： Ki-Don Kim ,  Jae-Seon An ,  Seong-Chul Choi ,  Seong-Eun Sim ,  Hyun-Kyu Lee ,  Su-Jin Lim

发明人： Ki-Don Kim ,  Jae-Seon An ,  Seong-Chul Choi ,  Seong-Eun Sim ,  Hyun-Kyu Lee ,  Su-Jin Lim

IPC分类号： H01L23/12

CPC分类号： H01L23/49827 ,  H01L23/3128 ,  H01L23/552 ,  H01L24/48 ,  H01L24/97 ,  H01L25/0655 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48235 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16151 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package includes a substrate having a plurality of through holes for interconnecting electrically conductive traces formed on upper and lower surfaces of the substrate. The through holes are classified into a first set of through holes and a second set of through holes. The second set of through holes is located exterior of the first set of through holes, and surrounds the first set of through holes. A die is mounted on the upper surface of the substrate and is connected electrically to the first set of through holes. A metal shield is disposed on the substrate for enclosing the die therein and is connected electrically to the second set of through holes. A molding resin encapsulates the metal shield, the die on the substrate and fills a gap confined between the metal shield and the die.

摘要翻译： 半导体封装包括具有多个通孔的衬底，用于互连形成在衬底的上表面和下表面上的导电迹线。 通孔分为第一组通孔和第二组通孔。 第二组通孔位于第一组通孔的外部，并且包围第一组通孔。 模具安装在基板的上表面上并与第一组通孔电连接。 金属屏蔽件设置在基板上，用于将管芯封装在其中并与第二组通孔电连接。 模塑树脂将金属屏蔽件，模具封装在基板上，并填充限定在金属屏蔽件和模具之间的间隙。