公开(公告)号：US08790950B2

公开(公告)日：2014-07-29

申请号：US13211102

申请日：2011-08-16

Applicant: Takanori Suzuki ,  Tadashi Kosaka ,  Koji Tsuduki ,  Yasuhiro Matsuki ,  Shin Hasegawa ,  Akiya Nakayama

Inventor： Takanori Suzuki ,  Tadashi Kosaka ,  Koji Tsuduki ,  Yasuhiro Matsuki ,  Shin Hasegawa ,  Akiya Nakayama

IPC: H01L21/00 ,  H01L27/146

CPC classification number: H01L27/14618 ,  H01L27/14683 ,  H01L2224/13

Abstract: A method of manufacturing an optical sensor includes providing a semiconductor wafer including a plurality of pixel areas, providing a light transmissive substrate including a light transmissive wafer with a plurality of light transmissive members attached thereto, the plurality of light transmissive members being arranged on a first main surface of the light transmissive wafer and each of plurality of light transmissive members emitting α rays, an amount of the α rays being smaller than or equal to 0.05 c/cm2·h, fixing the light transmissive substrate onto the semiconductor wafer together by a fixing member, and dividing the semiconductor wafer and the light transmissive substrate that are fixed together into individual pieces.

Abstract translation: 一种制造光学传感器的方法，包括提供包括多个像素区域的半导体晶片，提供包括具有附接到其上的多个透光构件的透光晶片的透光基板，所述多个透光构件布置在第一 透光晶片的主表面和发射α射线的​​多个透光部件中的每一个，α射线的量小于或等于0.05c / cm 2·h，将透光基板固定在半导体晶片上一起由 固定部件，并且将固定在一起的半导体晶片和透光性基板分割成单独的片。

公开(公告)号：US20120052612A1

公开(公告)日：2012-03-01

申请号：US13211161

申请日：2011-08-16

Applicant: Yasuhiro Matsuki ,  Takanori Suzuki ,  Koji Tsuduki ,  Shin Hasegawa ,  Tadashi Kosaka ,  Akiya Nakayama

Inventor： Yasuhiro Matsuki ,  Takanori Suzuki ,  Koji Tsuduki ,  Shin Hasegawa ,  Tadashi Kosaka ,  Akiya Nakayama

IPC: H01L31/18

CPC classification number: H01L27/14618 ,  H01L27/14685 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method of manufacturing an optical sensor includes the steps of providing a semiconductor wafer having a plurality of pixel areas; forming a grid-like rib enclosing each pixel area on the semiconductor wafer, the grid-like rib having a predetermined width and being formed from a fixing member; providing a light-transmissive substrate having a gap portion on a main surface thereof, the gap portion having at least one of a groove having a width smaller than the grid-like rib and a plurality of through-holes; fixing the semiconductor wafer and the light-transmissive substrate such that the grid-like rib and the gap portion face each other; and cutting the fixed semiconductor wafer and light-transmissive substrate into pieces such that each piece includes one pixel area.

Abstract translation: 一种制造光学传感器的方法包括以下步骤：提供具有多个像素区域的半导体晶片; 形成包围所述半导体晶片上的每个像素区域的格栅状肋，所述格子状肋具有预定的宽度并由固定构件形成; 提供在其主表面上具有间隙部分的透光基板，所述间隙部分具有宽度小于所述格子状肋条的槽和多个通孔中的至少一个; 固定所述半导体晶片和所述透光基板，使得所述格子状肋和所述间隙部彼此面对; 并且将固定的半导体晶片和透光基板切割成片，使得每个片包括一个像素区域。

公开(公告)号：US20120050590A1

公开(公告)日：2012-03-01

申请号：US13211102

申请日：2011-08-16

Applicant: Takanori Suzuki ,  Tadashi Kosaka ,  Koji Tsuduki ,  Yasuhiro Matsuki ,  Shin Hasegawa ,  Akiya Nakayama

Inventor： Takanori Suzuki ,  Tadashi Kosaka ,  Koji Tsuduki ,  Yasuhiro Matsuki ,  Shin Hasegawa ,  Akiya Nakayama

IPC: H04N5/335 ,  H01L31/0232 ,  H01L31/18

CPC classification number: H01L27/14618 ,  H01L27/14683 ,  H01L2224/13

Abstract: A method of manufacturing an optical sensor includes providing a semiconductor wafer including a plurality of pixel areas, providing a light transmissive substrate including a light transmissive wafer with a plurality of light transmissive members attached thereto, the plurality of light transmissive members being arranged on a first main surface of the light transmissive wafer and each of plurality of light transmissive members emitting α rays, an amount of the α rays being smaller than or equal to 0.05 c/cm2·h, fixing the light transmissive substrate onto the semiconductor wafer together by a fixing member, and dividing the semiconductor wafer and the light transmissive substrate that are fixed together into individual pieces.

Abstract translation: 一种制造光学传感器的方法，包括提供包括多个像素区域的半导体晶片，提供包括具有附接到其上的多个透光构件的透光晶片的透光基板，所述多个透光构件布置在第一 透光晶片的主表面和发射α射线的​​多个透光部件中的每一个，α射线的量小于或等于0.05c / cm 2·h，将透光基板固定在半导体晶片上一起由 固定部件，并且将固定在一起的半导体晶片和透光性基板分割成单独的片。

公开(公告)号：US07026654B2

公开(公告)日：2006-04-11

申请号：US10406943

申请日：2003-04-03

Applicant: Masahiko Igaki ,  Makoto Ogura ,  Akio Atsuta ,  Tadashi Kosaka

Inventor： Masahiko Igaki ,  Makoto Ogura ,  Akio Atsuta ,  Tadashi Kosaka

IPC: H01L29/26 ,  H01L27/15 ,  H01L33/00 ,  H01L27/14 ,  H01L31/00

CPC classification number: H01L31/02325 ,  H01L31/167 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

Abstract: To provide a package for an optical semiconductor having a light-emitting device and a light-receiving device in one package, in which a groove is provided between the light-emitting device and the light-receiving device to thereby avoid rays of light from the light-emitting device to directly enter the light-receiving device.

公开(公告)号：US08823872B2

公开(公告)日：2014-09-02

申请号：US13212935

申请日：2011-08-18

Applicant: Koji Tsuduki ,  Shin Hasegawa ,  Tadashi Kosaka ,  Yasuhiro Matsuki ,  Takanori Suzuki ,  Akiya Nakayama

Inventor： Koji Tsuduki ,  Shin Hasegawa ,  Tadashi Kosaka ,  Yasuhiro Matsuki ,  Takanori Suzuki ,  Akiya Nakayama

IPC: H04N5/225

CPC classification number: H01L27/14618 ,  H01L27/14636 ,  H01L2224/13 ,  H04N5/2253

Abstract: An image pickup module includes a cover member, an image pickup device chip including photodiodes, a fixing member which is arranged around the image pickup device chip and which connects the cover member and the image pickup device chip together, a rewiring substrate arranged on the side opposite to the cover member of the image pickup device chip, connection members for connecting the image pickup device chip with the rewiring substrate, and a space surrounded by the cover member, the image pickup device chip, and the fixing member. The image pickup device chip includes a semiconductor substrate. The semiconductor substrate includes through-hole electrodes penetrating the substrate. When an area corresponding to the fixing member in the orthogonal projection of the image pickup module with respect to the cover module is defined as a fixed area, the through-hole electrodes and the connection members are arranged in the fixed area.

Abstract translation: 图像拾取模块包括盖构件，包括光电二极管的图像拾取装置芯片，布置在图像拾取装置芯片周围并将盖构件和图像拾取装置芯片连接在一起的固定构件，布置在侧面的重新布线基板 与图像拾取装置芯片的盖构件相对的连接构件，用于将图像拾取装置芯片与重新布线基板连接的连接构件以及由盖构件，图像拾取装置芯片和固定构件包围的空间。 图像拾取器件芯片包括半导体衬底。 半导体衬底包括穿透衬底的通孔电极。 当将图像拾取模块相对于盖模块的正交投影中的固定构件对应的区域定义为固定区域时，通孔电极和连接构件布置在固定区域中。

公开(公告)号：US5209978A

公开(公告)日：1993-05-11

申请号：US774325

申请日：1991-10-10

Applicant: Tadashi Kosaka ,  Kazuki Omata ,  Tatsuo Hashimoto ,  Teruaki Yamazaki ,  Kazuo Hayashi ,  Tomiya Hosoi ,  Kenichi Ikuta

Inventor： Tadashi Kosaka ,  Kazuki Omata ,  Tatsuo Hashimoto ,  Teruaki Yamazaki ,  Kazuo Hayashi ,  Tomiya Hosoi ,  Kenichi Ikuta

IPC: A61J3/07 ,  A61K9/64

CPC classification number: A61J3/07 ,  Y10S514/962 ,  Y10S514/963 ,  Y10T428/2984

Abstract: A soft capsule composed of a plurality of cells coalesced to each other and filling substances encapsulated in the individual cells, the wall of at least one of the cells being formed of a material different from a material forming the wall of at least one of the other cells, and said capsule being seamless. The soft capsule can be produced by(a) preparing a plurality of composite jet streams each consisting of a stream of a film-forming liquid substance for forming a cell wall and within said stream of a film-forming liquid substance a single stream, or a plurality of independent streams, of a filling substance having flowability, the film-forming liquid substance in at least one of the composite jet streams being different from the film-forming liquid substance in at least one of the other composite jet streams,(b) advancing the plurality of composite jet streams in closely spaced relationship into and through a stream of a liquid medium substantially incapable of dissolving the film-forming liquid substance in the flowing direction of the liquid medium stream,(c) coalescing the adjacent composite jet streams to each other to form a single composite jet stream in the liquid medium stream,(d) cutting the single composite jet stream to a predetermined length successively from its leading end in the liquid medium stream, and(e) solidifying the cell walls of the resulting soft capsule.

Abstract translation: 由多个细胞组成的软胶囊彼此聚结并填充包封在各个细胞中的物质，至少一个细胞的壁由不同于形成其它至少一个的壁的材料形成 细胞，并且所述胶囊是无缝的。 软胶囊可以通过以下方法制备：（a）制备多个复合喷射流，每个复合射流由用于形成细胞壁的成膜液体物质的流和成膜液体物质的单流内流组成，或 多个独立的流，具有流动性的填充物质，至少一个复合射流中的成膜液体物质与至少一个其它复合射流中的成膜液体物质不同（b ）将多个复合喷射流以紧密间隔的关系推进并通过基本上不能在液体介质流的流动方向上溶解成膜液体物质的液体介质流，（c）将相邻的复合射流 彼此在液体介质流中形成单一的复合喷射流，（d）将单个复合喷射流从其引导线连续地切割成预定长度 并且（e）固化所得软胶囊的细胞壁。

公开(公告)号：US08309433B2

公开(公告)日：2012-11-13

申请号：US13211161

申请日：2011-08-16

Applicant: Yasuhiro Matsuki ,  Takanori Suzuki ,  Koji Tsuduki ,  Shin Hasegawa ,  Tadashi Kosaka ,  Akiya Nakayama

Inventor： Yasuhiro Matsuki ,  Takanori Suzuki ,  Koji Tsuduki ,  Shin Hasegawa ,  Tadashi Kosaka ,  Akiya Nakayama

IPC: H01L21/30

CPC classification number: H01L27/14618 ,  H01L27/14685 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method of manufacturing an optical sensor includes the steps of providing a semiconductor wafer having a plurality of pixel areas; forming a grid-like rib enclosing each pixel area on the semiconductor wafer, the grid-like rib having a predetermined width and being formed from a fixing member; providing a light-transmissive substrate having a gap portion on a main surface thereof, the gap portion having at least one of a groove having a width smaller than the grid-like rib and a plurality of through-holes; fixing the semiconductor wafer and the light-transmissive substrate such that the grid-like rib and the gap portion face each other; and cutting the fixed semiconductor wafer and light-transmissive substrate into pieces such that each piece includes one pixel area.

Abstract translation: 一种制造光学传感器的方法包括以下步骤：提供具有多个像素区域的半导体晶片; 形成包围所述半导体晶片上的每个像素区域的格栅状肋，所述格子状肋具有预定的宽度并由固定构件形成; 提供在其主表面上具有间隙部分的透光基板，所述间隙部分具有宽度小于所述格子状肋条的槽和多个通孔中的至少一个; 固定所述半导体晶片和所述透光性基板，使得所述格子状肋和所述间隙部彼此面对; 并且将固定的半导体晶片和透光基板切割成片，使得每个片包括一个像素区域。

公开(公告)号：US20120044415A1

公开(公告)日：2012-02-23

申请号：US13212935

申请日：2011-08-18

Applicant: Koji Tsuduki ,  Shin Hasegawa ,  Tadashi Kosaka ,  Yasuhiro Matsuki ,  Takanori Suzuki ,  Akiya Nakayama

Inventor： Koji Tsuduki ,  Shin Hasegawa ,  Tadashi Kosaka ,  Yasuhiro Matsuki ,  Takanori Suzuki ,  Akiya Nakayama

IPC: H04N5/225 ,  H01L27/146

CPC classification number: H01L27/14618 ,  H01L27/14636 ,  H01L2224/13 ,  H04N5/2253

Abstract: An image pickup module includes a cover member, an image pickup device chip including photodiodes, a fixing member which is arranged around the image pickup device chip and which connects the cover member and the image pickup device chip together, a rewiring substrate arranged on the side opposite to the cover member of the image pickup device chip, connection members for connecting the image pickup device chip with the rewiring substrate, and a space surrounded by the cover member, the image pickup device chip, and the fixing member. The image pickup device chip includes a semiconductor substrate. The semiconductor substrate includes through-hole electrodes penetrating the substrate. When an area corresponding to the fixing member in the orthogonal projection of the image pickup module with respect to the cover module is defined as a fixed area, the through-hole electrodes and the connection members are arranged in the fixed area.

Abstract translation: 图像拾取模块包括盖构件，包括光电二极管的图像拾取装置芯片，布置在图像拾取装置芯片周围并将盖构件和图像拾取装置芯片连接在一起的固定构件，布置在侧面的重新布线基板 与图像拾取装置芯片的盖构件相对的连接构件，用于将图像拾取装置芯片与重新布线基板连接的连接构件以及由盖构件，图像拾取装置芯片和固定构件包围的空间。 图像拾取器件芯片包括半导体衬底。 半导体衬底包括穿透衬底的通孔电极。 当将图像拾取模块相对于盖模块的正交投影中的固定构件对应的区域定义为固定区域时，通孔电极和连接构件布置在固定区域中。

公开(公告)号：US06383835B1

公开(公告)日：2002-05-07

申请号：US08707046

申请日：1996-08-30

Applicant: Fumio Hata ,  Tadashi Kosaka ,  Hisatane Komori

Inventor： Fumio Hata ,  Tadashi Kosaka ,  Hisatane Komori

IPC: H01L2144

CPC classification number: H01L25/167 ,  H01L24/97 ,  H01L31/0203 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/97 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15313 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An IC package has a substrate having recesses formed on the side wall thereof, an insulating film for covering an opening of each recess on the side of a principal surface of the substrate, and an IC chip mounted on a mount surface side of the film on the substrate, wherein a conductive portion formed on each recess is used as an external connection terminal for the IC chip. A method of assembling an IC package has the steps of forming a substrate having a plurality of through holes each having an insulating film covering one of the openings of each through hole, mounting one or more IC chips on a principal surface of the substrate on the insulating film side, and electrically connecting the IC chip and the through holes, sealing the substrate with the IC chip mounted thereon with insulating resin, and cut the substrate with the IC chip mounted thereon to expose the side wall of each through hole.

Abstract translation: IC封装具有形成在其侧壁上的凹部的基板，用于覆盖基板的主表面侧的每个凹部的开口的绝缘膜和安装在膜的安装表面侧上的IC芯片 基板，其中形成在每个凹部上的导电部分用作IC芯片的外部连接端子。 一种组装IC封装的方法，具有以下步骤：形成具有多个通孔的基板，每个通孔具有覆盖每个通孔中的一个开口的绝缘膜，将一个或多个IC芯片安装在基板的主表面上 绝缘膜侧，并且将IC芯片和通孔电连接，用安装有绝缘树脂的IC芯片密封基板，并且用安装在其上的IC芯片切割基板以暴露每个通孔的侧壁。