公开(公告)号：US06527861B2

公开(公告)日：2003-03-04

申请号：US09908889

申请日：2001-07-20

申请人： Takashi Takekuma

发明人： Takashi Takekuma

IPC分类号： B05C1100

CPC分类号： H01L21/67126 ,  B05B1/20 ,  B05C5/002 ,  B05C11/025 ,  B05C11/08

摘要： In a solution treatment apparatus, a nozzle for discharging a treatment solution toward a substrate held by a spin chuck includes a discharge opening for discharging the treatment solution on a surface of the substrate. A collision body against which the treatment solution discharged from the nozzle collides is disposed between the discharge opening of the nozzle and the substrate. Since the collision body is disposed between the discharge opening and the substrate, even when the discharge pressure of the treatment solution is high, the discharged treatment solution once collides against the collision body so that the discharge speed on reaching the substrate is reduced, damage to the substrate is eased, and the amount of air entering into the discharged treatment solution is decreased. Accordingly, no micro-bubble occurs.

摘要翻译： 在固溶处理装置中，将处理液朝向由旋转卡盘保持的基板排出的喷嘴包括用于将处理液排出到基板的表面上的排出口。 从喷嘴排出的处理液碰撞的碰撞体配置在喷嘴的排出口与基板之间。 由于碰撞体设置在排出口和基板之间，所以即使处理液的排出压力高，排出的处理液一旦与碰撞体碰撞，使得到达基板的排出速度降低， 使基板松弛，进入排出的处理液的空气量减少。 因此，不会发生微气泡。

公开(公告)号：US5665200A

公开(公告)日：1997-09-09

申请号：US524528

申请日：1995-09-07

申请人： Akihiro Fujimoto ,  Takashi Takekuma ,  Kiyomi Sonobe

发明人： Akihiro Fujimoto ,  Takashi Takekuma ,  Kiyomi Sonobe

IPC分类号： G03F7/20 ,  H01L21/00

CPC分类号： H01L21/6715 ,  G03F7/70691

摘要： The present invention provides a substrate processing method including the coating step of coating a processing liquid on an object to be processed in a first processing unit of a processing chamber having first and second processing units, the step of conveying the object from the first processing unit to the second processing unit, the rinse step of rinsing an unnecessary processing liquid remaining on a peripheral portion of the object in the second processing unit to remove the unnecessary processing liquid, and the exposure step of conveying the rinsed object to an exposure apparatus to perform exposure processing for the object, wherein a time from the end of the rinse step for one object to be processed to the end of the rinse step for a next object to be processed is shorter than a time required for the exposure step for the one object.

摘要翻译： 本发明提供了一种基板处理方法，其特征在于，包括在具有第一处理单元和第二处理单元的处理室的第一处理单元中对被处理物体涂布处理液的涂布工序，从所述第一处理单元 在所述第二处理单元中，冲洗残留在所述第二处理单元中的所述物体的周边部分上的不必要的处理液以除去不需要的处理液的所述冲洗步骤，以及将所清洗的物体输送到曝光装置以进行曝光的曝光步骤 曝光处理，其中从待处理对象的冲洗步骤结束到下一个待处理对象的冲洗步骤结束的时间比一个物体的曝光步骤所需的时间短 。

公开(公告)号：US5416047A

公开(公告)日：1995-05-16

申请号：US93699

申请日：1993-07-20

申请人： Nobuo Konishi ,  Hideyuki Takamori ,  Masami Akimoto ,  Kiyohisa Tateyama ,  Masaaki Murakami ,  Norimitsu Morioka ,  Takashi Takekuma

发明人： Nobuo Konishi ,  Hideyuki Takamori ,  Masami Akimoto ,  Kiyohisa Tateyama ,  Masaaki Murakami ,  Norimitsu Morioka ,  Takashi Takekuma

IPC分类号： H01L21/00 ,  H01L21/30

CPC分类号： H01L21/67173 ,  H01L21/6715 ,  H01L21/6719 ,  Y10S430/136

摘要： A substrate solution-processing method comprising the steps of preparing a pair of spin chucks by which semiconductor wafers are supported, a housing by which the wafers supported by the spin chucks are enclosed, motor for rotating the spin chucks, a nozzle through which developing or resist solution is applied to each wafer, means for moving the nozzle between the wafers, and a waiting trench at which the nozzle is kept waiting, setting substantially same the times needed to finish the cycles of processing the wafers supported on at least two spin chucks and delaying one process cycle from the other, and keeping the nozzle waiting at the waiting trench unless developing or resist solution is applied to each wafer through the nozzle.

摘要翻译： 一种基板溶液处理方法，包括以下步骤：准备一对支撑半导体晶片的旋转卡盘，包围由旋转卡盘支撑的晶片的壳体，用于旋转旋转卡盘的马达，用于旋转旋转卡盘的马达， 将抗蚀剂溶液施加到每个晶片，用于在晶片之间移动喷嘴的装置以及喷嘴保持等待的等待沟槽，其设置与完成在至少两个旋转夹头上支撑的晶片的处理循环所需的时间基本相同 并且从另一个延迟一个处理周期，并且保持喷嘴等待在等待沟槽，除非通过喷嘴对每个晶片施加显影和抗蚀剂溶液。

公开(公告)号：US20060144330A1

公开(公告)日：2006-07-06

申请号：US11362105

申请日：2006-02-27

申请人： Takashi Takekuma ,  Yasuyuki Kometani ,  Yoshiteru Fukuda ,  Junya Minamida

发明人： Takashi Takekuma ,  Yasuyuki Kometani ,  Yoshiteru Fukuda ,  Junya Minamida

IPC分类号： B05C11/00 ,  B05D3/12 ,  C23C16/52 ,  B05C13/02

CPC分类号： H01L21/67253 ,  H01L21/6715

摘要： A coating process method in which a coating liquid is discharged onto the surface of a target substrate to be processed while rotating the target substrate so as to expand the coating liquid radially outward on the target substrate and, thus, to form a coated film comprises the step of detecting that the actual discharging of a coating liquid from a coating liquid discharging nozzle is started, and the step of controlling based on a signal of the detection at least one of the driving timing of a pump for allowing the coating liquid to be discharged from the coating liquid discharging nozzle, the operation timing of a valve mounted to a pipe for supplying the coating liquid into the coating liquid discharging nozzle, and the rotation starting or stopping timing of the target substrate.

公开(公告)号：US06432199B1

公开(公告)日：2002-08-13

申请号：US09553889

申请日：2000-04-20

申请人： Takashi Takekuma

发明人： Takashi Takekuma

IPC分类号： B05D102

CPC分类号： H01L21/67051 ,  B05C11/08 ,  B05D1/005 ,  B05D3/104 ,  Y10S438/905

摘要： An apparatus for processing a substrate by supplying a process liquid to a substrate to be processed in a photolithographic process, comprises a cup, a washing control plate for washing an inner surface of the cup, a spin chuck for rotating the washing control plate or the substrate while holding the washing control plate or the substrate substantially horizontally in the cup, a solvent supply mechanism for supplying a solvent capable of dissolving the process liquid, onto the washing control plate or the substrate held by the spin chuck, a process liquid supply mechanism for supplying the process liquid onto the substrate held by the spin chuck, and a control section for selecting either a solvent to be supplied to the substrate or a solvent to be supplied to the washing control plate and controlling the solvent supply mechanism in accordance with the solvent selected.

摘要翻译： 一种用于通过在光刻工艺中将待处理液体加工到处理液中的处理液体的装置，包括杯子，用于清洗杯内表面的洗涤控制板，用于使洗涤控制板或 基板，同时将洗涤控制板或基板基本上水平地保持在杯中;溶剂供应机构，用于将能够溶解处理液体的溶剂供应到洗涤控制板或由旋转卡盘保持的基板上;处理液供给机构 用于将工艺液体供给到由旋转卡盘保持的基板上;以及控制部，用于选择供给到基板的溶剂或要供给到洗涤控制板的溶剂，并根据该控制部分控制溶剂供给机构 溶剂选择。

公开(公告)号：US5725664A

公开(公告)日：1998-03-10

申请号：US692436

申请日：1996-08-05

申请人： Mitsuhiro Nanbu ,  Naruaki Iida ,  Hideaki Gotou ,  Masanori Tateyama ,  Yuji Yoshimoto ,  Tomoko Ishimoto ,  Hidetami Yaegashi ,  Yasunori Kawakami ,  Takahide Fukuda ,  Akihiro Fujimoto ,  Takashi Takekuma ,  Hiroyuki Matsukawa

发明人： Mitsuhiro Nanbu ,  Naruaki Iida ,  Hideaki Gotou ,  Masanori Tateyama ,  Yuji Yoshimoto ,  Tomoko Ishimoto ,  Hidetami Yaegashi ,  Yasunori Kawakami ,  Takahide Fukuda ,  Akihiro Fujimoto ,  Takashi Takekuma ,  Hiroyuki Matsukawa

IPC分类号： H01L21/00 ,  H01L21/677 ,  B05C5/00

CPC分类号： H01L21/67265 ,  H01L21/67173 ,  H01L21/67766 ,  H01L21/67778 ,  Y10S134/902 ,  Y10S414/135 ,  Y10S414/136 ,  Y10S414/137 ,  Y10S414/141

摘要： An apparatus for subjecting a plurality of wafers to coating and heating treatments, including a coating section for subjecting the wafers to a coating treatment one by one, a heating section for subjecting wafers which have undergone the coating treatment to a heating treatment all together, and an interface section arranged between the coating section and the heating section. The wafers are heat-treated in the heat treatment section while the wafers are stacked at intervals in a vertical direction in a boat. The wafers which have undergone the coating treatment are loaded into the boat by a conveying member in the interface section. The conveying member and the boat are surrounded by a surrounding space formed by a casing at the interface section. A circulation line is combined with an air supply and exhaust system, for circulating air in the surrounding space. A dehumidifier is arranged on the circulation line for dehumidifying air in the circulation line to provide localized dehumidification of the surrounding space formed by the casing.

摘要翻译： 一种用于对多个晶片进行涂覆和加热处理的设备，包括用于对晶片进行一次涂覆处理的涂布部分，将经过涂覆处理的晶片全部进行加热处理的加热部分一起进行加热处理;以及 布置在涂覆部分和加热部分之间的界面部分。 在热处理部分中对晶片进行热处理，同时晶片在船上沿垂直方向间隔堆叠。 已经经过涂覆处理的晶片通过接口部分中的传送部件装载到船中。 输送构件和舟皿由在界面部分处由壳体形成的周围空间包围。 循环管线与供气和排气系统结合，用于在周围空间循环空气。 在循环管线上设置除湿器，用于对循环管线中的空气进行除湿，以提供由壳体形成的周围空间的局部除湿。

公开(公告)号：US5686143A

公开(公告)日：1997-11-11

申请号：US597536

申请日：1996-02-02

申请人： Hiroyuki Matsukawa ,  Akira Yonemizu ,  Michiaki Matsushita ,  Akihiro Fujimoto ,  Takashi Takekuma ,  Hidetami Yaegashi ,  Takahide Fukuda

发明人： Hiroyuki Matsukawa ,  Akira Yonemizu ,  Michiaki Matsushita ,  Akihiro Fujimoto ,  Takashi Takekuma ,  Hidetami Yaegashi ,  Takahide Fukuda

IPC分类号： H01L21/304 ,  B08B1/04 ,  B08B3/04 ,  B08B3/12 ,  H01L21/00 ,  H01L21/311 ,  H01L21/677 ,  B05D3/00

CPC分类号： H01L21/67173 ,  B08B1/007 ,  B08B1/04 ,  B08B3/04 ,  B08B3/12 ,  H01L21/31116 ,  H01L21/67028 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/6715 ,  H01L21/67178 ,  B08B2203/0288 ,  Y10S134/902 ,  Y10S414/136 ,  Y10S414/141

摘要： There is provided a double-sided substrate cleaning apparatus including a carrier station for loading/unloading a carrier in which objects to be processed are stored, a convey mechanism for conveying an object taken out from the carrier station, at least one cleaning mechanism, arranged along a convey path on which the convey mechanism conveys the object, for cleaning the object, and an object reversing mechanism, arranged along the convey path, for reversing the object.

摘要翻译： 提供了一种双面基板清洁装置，包括用于装载/卸载其中存储有待处理物体的载体的承载站，用于传送从承载站取出的物体的传送机构，至少一个清洁机构，布置 沿着传送机构传送物体的传送路径，用于清洁物体，以及沿着传送路径布置的用于反转物体的物体反转机构。

公开(公告)号：US5070813A

公开(公告)日：1991-12-10

申请号：US472813

申请日：1990-01-31

申请人： Hiroyuki Sakai ,  Eiichi Shirakawa ,  Chizo Yamaguchi ,  Takashi Takekuma

发明人： Hiroyuki Sakai ,  Eiichi Shirakawa ,  Chizo Yamaguchi ,  Takashi Takekuma

IPC分类号： G01F5/00 ,  G05D7/06 ,  H01L21/00

CPC分类号： H01L21/6715 ,  G01F5/00 ,  G05D7/0635 ,  Y10T137/2564

摘要： Disclosed is a coating apparatus, comprising a gas exhaust rate controller disposed within an exhaust pipe connected to a cup which houses a substance to be treated, and a branch pipe connected to the exhaust pipe. The flow speed of the fluid within the branch pipe is measured, and the driving of the exhaust rate controller is controlled based on the measured value of the flow speed in accordance with the state of treatment of the object to be treated.

摘要翻译： 公开了一种涂布装置，其包括排气速率控制器，其布置在连接到容纳待处理物质的杯的排气管内，以及连接到排气管的分支管。 测量分支管内的流体的流速，根据被处理物的处理状态，根据流速的测定值来控制排气速度控制器的驱动。

公开(公告)号：US06284043B1

公开(公告)日：2001-09-04

申请号：US09109104

申请日：1998-07-02

申请人： Takashi Takekuma

发明人： Takashi Takekuma

IPC分类号： B05C502

CPC分类号： H01L21/67126 ,  B05B1/20 ,  B05C5/002 ,  B05C11/025 ,  B05C11/08

摘要： In a solution treatment apparatus, a nozzle for discharging a treatment solution toward a substrate held by a spin chuck includes a discharge opening for discharging the treatment solution on a surface of the substrate. A collision body against which the treatment solution discharged from the nozzle collides is disposed between the discharge opening of the nozzle and the substrate. Since the collision body is disposed between the discharge opening and the substrate, even when the discharge pressure of the treatment solution is high, the discharged treatment solution once collides against the collision body so that the discharge speed on reaching the substrate is reduced, damage to the substrate is eased, and the amount of air entering into the discharged treatment solution is decreased. Accordingly, no micro-bubble occurs.

摘要翻译： 在固溶处理装置中，将处理液朝向由旋转卡盘保持的基板排出的喷嘴包括用于将处理液排出到基板的表面上的排出口。 从喷嘴排出的处理液碰撞的碰撞体配置在喷嘴的排出口与基板之间。 由于碰撞体设置在排出口和基板之间，所以即使处理液的排出压力高，排出的处理液一旦与碰撞体碰撞，使得到达基板的排出速度降低， 使基板松弛，进入排出的处理液的空气量减少。 因此，不会发生微气泡。

公开(公告)号：US06258167B1

公开(公告)日：2001-07-10

申请号：US09334272

申请日：1999-06-16

申请人： Yukihiro Kawano ,  Takashi Takekuma

发明人： Yukihiro Kawano ,  Takashi Takekuma

IPC分类号： B05C502

CPC分类号： H01L21/6715 ,  B05B15/50 ,  B05C5/001 ,  B05C5/004 ,  B05C5/005 ,  B05C5/0254 ,  B05C11/08 ,  B05C11/1039

摘要： An apparatus for forming a film of a process liquid, comprising a mounting table for supporting the substrate to be processed substantially horizontally, a process liquid supply device for supplying a process liquid for processing the substrate, a linear nozzle having a header space which has a length substantially corresponding to a diameter of the substrate and a liquid discharge portion, the header space mutually communicating with the liquid discharge portion, a liquid inlet port which communicates with the process liquid supply device and whose opening is formed above the header space, a moving device for relatively moving the linear nozzle and the mounting table while the liquid discharge portion faces the substrate on the mounting table, and a control device for controlling a viscosity of the photoresist solution within the header space or controlling a temperature of the developing liquid in the header space.

摘要翻译： 一种用于形成工艺液体膜的设备，包括：用于基本上水平地支撑待加工的基板的安装台，用于供应处理基板的处理液的处理液供给装置，具有头部空间的线性喷嘴， 长度基本上对应于基板的直径和液体排出部分，与液体排出部分相互连通的集管空间，与处理液体供应装置连通并且其开口形成在集管空间上方的液体入口端口，移动 用于在液体排出部分面向安装台上的基板时相对移动线性喷嘴和安装台的装置，以及用于控制在集管空间内的光致抗蚀剂溶液的粘度或控制显影液体的温度的控制装置 标题空间。