REFLOW FURNACE
    2.
    发明申请
    REFLOW FURNACE 失效
    冷却炉

    公开(公告)号:US20080014542A1

    公开(公告)日:2008-01-17

    申请号:US11689156

    申请日:2007-03-21

    IPC分类号: F27B9/14

    CPC分类号: B23K1/008 B23K2101/42

    摘要: A reflow furnace comprises: a carrier device to carry a printed circuit board with electronic components mounted thereon; a heating chamber to heat through an ambient gas the printed circuit board carried therein to solder the electronic components on a surface of the printed circuit board; and an ambient gas purification equipment including a retrieving device to retrieve a part of the ambient gas containing vaporized flux component when soldering, a heating device to heat the retrieved ambient gas to a desired temperature, an oxidation catalyst to burn the flux component contained in the heated ambient gas, and a returning device to return a high temperature gas after being burned to the heating chamber.

    摘要翻译: 回流炉包括:载体装置,用于承载安装有电子部件的印刷电路板; 加热室,其通过环境气体加热承载在其中的印刷电路板,以将印刷电路板的表面上的电子部件焊接; 以及环境气体净化设备,其包括回收装置,用于在焊接时回收含有汽化助焊剂组分的环境气体的一部分,用于将回收的环境气体加热至所需温度的加热装置,用于燃烧所含有的助熔剂组分的氧化催化剂 加热环境气体和返回装置,以在燃烧到加热室之后返回高温气体。

    Apparatus for dissolving filth treatment bags formed by water soluble film
    7.
    发明申请
    Apparatus for dissolving filth treatment bags formed by water soluble film 审中-公开
    用于溶解由水溶性薄膜形成的污垢处理袋的装置

    公开(公告)号:US20070144951A1

    公开(公告)日:2007-06-28

    申请号:US11605518

    申请日:2006-11-28

    IPC分类号: B01D21/24 A47K11/02

    CPC分类号: A47K11/023 Y02A50/454

    摘要: An apparatus for dissolving filth treatment bags formed by hot water soluble films in a dissolving tub is disclosed. The apparatus includes a pipe for inputting hot water for dissolving the filth bag storing filth by stirring action of the hot water therefrom, a pipe for outputting vapor including odor generated by a mixture of the filth and the hot water in the dissolving tub, the vapor being generated on a shifting process from a state where the film is divided and collapsed to a stage where the film is dissolved, and a mechanism for cooling the heated wastewater including the dissolved filth bag and the hot water in the dissolving tub and outputting the wastewater into a sewer pipe from the dissolving tub.

    摘要翻译: 公开了一种将由热水溶性膜形成的污垢处理袋溶解在溶解桶中的装置。 该装置包括:用于输入热水的管道,用于溶解通过其热水的搅拌作用而贮存污物的热水;蒸汽,其包含由溶解桶中的污物和热水的混合物产生的气味,蒸气 在从薄膜被分解和塌陷的状态到薄膜溶解的阶段的移动过程中产生的机构,以及用于冷却包括溶解的浴槽中的溶解的污物袋和热水的加热废水并输出废水的机构 从溶解桶进入下水管。

    PIEZOELECTRIC CERAMIC COMPOSITION AND PIEZOELECTRIC ELEMENT MADE BY USING THE SAME
    9.
    发明申请
    PIEZOELECTRIC CERAMIC COMPOSITION AND PIEZOELECTRIC ELEMENT MADE BY USING THE SAME 有权
    压电陶瓷组合物和使用它的压电元件

    公开(公告)号:US20100264355A1

    公开(公告)日:2010-10-21

    申请号:US12747810

    申请日:2009-06-22

    IPC分类号: H01L41/187

    摘要: The present invention provides a piezoelectric ceramic composition having a high thermal resistance and a high piezoelectric distortion constant and a piezoelectric element using the piezoelectric ceramic composition. The piezoelectric ceramic composition of the present invention contains Na, Bi, Ti, Cr and O, wherein the content ratio of Na, Bi, Ti and Cr in terms of oxides thereof falls within the following composition range: aNa2O-bBi2O3-cTiO2-dCrO where a, b, c and d are mole fractions; 0.030≦a≦0.042; 0.330≦b≦0.370; 0.580≦c≦0.620; 0≦d≦0.017; and a+b+c+d=1. The piezoelectric ceramic composition preferably has a main crystal phase of bismuth layer-structured ferroelectric, more preferably Na0.5Bi4.5Ti4O15 crystal. The piezoelectric element of the present invention includes a piezoelectric body formed of the piezoelectric ceramic composition and at least a pair of electrodes held in contact with the piezoelectric body.

    摘要翻译: 本发明提供一种具有高热阻和高压电变形常数的压电陶瓷组合物和使用压电陶瓷组合物的压电元件。 本发明的压电陶瓷组合物含有Na,Bi,Ti,Cr和O,其中Na,Bi,Ti和Cr的氧化物含量在下列组成范围内:aNa2O-bBi2O3-cTiO2-dCrO 其中a,b,c和d是摩尔分数; 0.030≦̸ a≦̸ 0.042; 0.330≦̸ b≦̸ 0.370; 0.580≦̸ c≦̸ 0.620; 0≦̸ d≦̸ 0.017; 和a + b + c + d = 1。 压电陶瓷组合物优选具有铋层结构的铁电体的主晶相,更优选为Na 0.5 B 4 4.5 Ti 4 O 15晶体。 本发明的压电元件包括​​由压电陶瓷组合物形成的压电体和与压电体保持接触的至少一对电极。

    Reflow furnace
    10.
    发明授权
    Reflow furnace 失效
    回流炉

    公开(公告)号:US07766651B2

    公开(公告)日:2010-08-03

    申请号:US11689156

    申请日:2007-03-21

    IPC分类号: F27B9/04

    CPC分类号: B23K1/008 B23K2101/42

    摘要: A reflow furnace comprises: a carrier device to carry a printed circuit board with electronic components mounted thereon; a heating chamber to heat through an ambient gas the printed circuit board carried therein to solder the electronic components on a surface of the printed circuit board; and an ambient gas purification equipment including a retrieving device to retrieve a part of the ambient gas containing vaporized flux component when soldering, a heating device to heat the retrieved ambient gas to a desired temperature, an oxidation catalyst to burn the flux component contained in the heated ambient gas, and a returning device to return a high temperature gas after being burned to the heating chamber.

    摘要翻译: 回流炉包括:载体装置,用于承载安装有电子部件的印刷电路板; 加热室,其通过环境气体加热承载在其中的印刷电路板,以将印刷电路板的表面上的电子部件焊接; 以及环境气体净化设备,其包括回收装置,用于在焊接时回收含有汽化助焊剂组分的环境气体的一部分,用于将回收的环境气体加热至所需温度的加热装置,用于燃烧所含有的助熔剂组分的氧化催化剂 加热环境气体和返回装置,以在燃烧到加热室之后返回高温气体。