公开(公告)号：US06885522B1

公开(公告)日：2005-04-26

申请号：US09548313

申请日：2000-04-12

申请人： Hidehiko Kira ,  Shunji Baba ,  Norio Kainuma ,  Toru Okada ,  Takatoyo Yamakami ,  Yasunori Sasaki ,  Takeshi Komiyama ,  Kenji Kobae ,  Hiroshi Kobayashi

发明人： Hidehiko Kira ,  Shunji Baba ,  Norio Kainuma ,  Toru Okada ,  Takatoyo Yamakami ,  Yasunori Sasaki ,  Takeshi Komiyama ,  Kenji Kobae ,  Hiroshi Kobayashi

IPC分类号： G11B5/48 ,  H01L21/56 ,  H01L21/60 ,  H01L21/68 ,  H01L23/31 ,  H01L29/06

CPC分类号： H01L21/568 ,  B29C2043/5825 ,  G11B5/4806 ,  G11B5/486 ,  H01L21/56 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/3107 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/75 ,  H01L24/81 ,  H01L24/94 ,  H01L29/0657 ,  H01L2223/54426 ,  H01L2223/5448 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/749 ,  H01L2224/75 ,  H01L2224/7515 ,  H01L2224/75302 ,  H01L2224/7565 ,  H01L2224/75745 ,  H01L2224/75753 ,  H01L2224/81801 ,  H01L2224/83194 ,  H01L2224/83856 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/10158 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19042 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/13111

摘要： A head assembly is provided with a mounting surface, and an integrated circuit chip which is mounted on the mounting surface and processes signals. The integrated circuit chip is covered by a layer which prevents generation of foreign particles from the integrated circuit chip by the provision of the layer.

摘要翻译： 头组件设置有安装表面，以及安装在安装表面上并处理信号的集成电路芯片。 集成电路芯片由防止由集成电路芯片产生异物的层所覆盖。

公开(公告)号：US5590388A

公开(公告)日：1996-12-31

申请号：US299306

申请日：1994-09-01

申请人： Mitsuo Kuwabara ,  Kiyoshi Ikegami ,  Teruaki Yoshida ,  Koji Takahashi ,  Tamotsu Harada ,  Takeshi Komiyama ,  Fumio Hirai ,  Masamichi Hayashi

发明人： Mitsuo Kuwabara ,  Kiyoshi Ikegami ,  Teruaki Yoshida ,  Koji Takahashi ,  Tamotsu Harada ,  Takeshi Komiyama ,  Fumio Hirai ,  Masamichi Hayashi

IPC分类号： B22F3/22 ,  B23K35/02 ,  B23K35/22 ,  B23K35/40 ,  C04B35/622 ,  C22C1/04 ,  C22C1/10 ,  C22C32/00 ,  B22F3/12

CPC分类号： B22F3/225 ,  B23K35/222 ,  B23K35/402 ,  C04B35/622 ,  C22C1/0425 ,  C22C1/1078 ,  C22C32/00 ,  B22F2998/00 ,  B23K35/0205

摘要： A method of producing a molded ceramic article comprises the first step mixing powdery raw materials and a liquid additive, thereby obtaining a mixed raw material, the second step press-molding the mixed raw material obtained in the first step in a hydrostatically applied condition of pressure, thereby removing an excess of the liquid additive to obtain a preform, and the third step calcining the preform obtained in the second step to obtain a molded ceramic article. The molded ceramic article comprises, as a principal component, copper and, as essential components, Cr and Ni within composition ranges of 0.1.ltoreq.Cr

摘要翻译： 制造模制陶瓷制品的方法包括：将粉末原料和液体添加剂混合的第一步骤，从而获得混合原料，第二步骤是将第一步骤中获得的混合原料在压力下的压力下施加压力 从而除去过量的液体添加剂以获得预成型体，并且第三步骤煅烧在第二步骤中获得的预成型体以获得模制的陶瓷制品。 模制的陶瓷制品以0.1重量％的组成范围内包含铜和作为必要组分的Cr和Ni作为主要组分。 ％和0.1

公开(公告)号：US6109507A

公开(公告)日：2000-08-29

申请号：US79521

申请日：1998-05-15

申请人： Harumi Yagi ,  Noritsugu Ozaki ,  Tsuyoshi Yamamoto ,  Toshiyuki Nakada ,  Takeshi Komiyama ,  Yoshihito Okuwaki

发明人： Harumi Yagi ,  Noritsugu Ozaki ,  Tsuyoshi Yamamoto ,  Toshiyuki Nakada ,  Takeshi Komiyama ,  Yoshihito Okuwaki

IPC分类号： H01L23/12 ,  H01L21/60 ,  H05K3/12 ,  H05K3/34 ,  B23K31/02 ,  H05K3/32

CPC分类号： H05K3/3484 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1184 ,  H01L2224/11849 ,  H01L2224/11901 ,  H01L2224/11903 ,  H01L2224/13019 ,  H01L2924/00013 ,  H01L2924/00014 ,  H05K2201/035 ,  H05K2203/0278 ,  H05K2203/043 ,  H05K3/1216 ,  Y10T29/49144

摘要： A method of forming solder bumps on pads provided on a board, wherein a plurality of solder bump layer forming cycles are repeatedly implemented. Each of the solder bump layer forming cycles includes the steps of printing solder paste on the board using a mask having mask openings and heating the solder paste so as to fuse the solder paste for forming solder bumps.

摘要翻译： 一种在设置在板上的焊盘上形成焊料凸块的方法，其中重复地实现多个焊料凸块层形成循环。 每个焊料凸块层形成循环包括以下步骤：使用具有掩模开口的掩模将焊膏印刷在板上，并加热焊膏，以熔化用于形成焊料凸块的焊膏。

公开(公告)号：US5956317A

公开(公告)日：1999-09-21

申请号：US686836

申请日：1996-07-26

申请人： Takeshi Komiyama ,  Makoto Hamamura

发明人： Takeshi Komiyama ,  Makoto Hamamura

IPC分类号： B29D17/00 ,  G11B7/24 ,  G11B7/26

CPC分类号： G11B7/24 ,  B29D17/005 ,  G11B7/26 ,  B29C2045/2659

摘要： A composite optical disk structure includes a first transparent disk plate having a first center hole, a first stamper clamp groove and a first information recording area on its one main surface; a second transparent disk plate having a second center hole having a diameter equal to that of the first center hole, a second stamper clamp groove and a second information recording area on its one main surface; a transparent adhesive sandwiched between the first and second transparent disk plates to bond the one main surfaces of them; and a mechanism formed between the one main surfaces for preventing the transparent adhesive from leaking our into the center holes.

摘要翻译： 复合光盘结构包括在其一个主表面上具有第一中心孔的第一透明盘片，第一压模钳槽和第一信息记录区域; 具有与第一中心孔的直径相等的第二中心孔的第二透明盘片，在其一个主表面上具有第二压模夹持槽和第二信息记录区域; 夹在第一和第二透明盘板之间以将其一个主表面粘合的透明粘合剂; 以及在一个主表面之间形成的用于防止透明粘合剂泄漏到中心孔中的机构。

公开(公告)号：US5443615A

公开(公告)日：1995-08-22

申请号：US965085

申请日：1992-10-22

申请人： Mitsuo Kuwabara ,  Kiyoshi Ikegami ,  Teruaki Yoshida ,  Koji Takahashi ,  Tamotsu Harada ,  Takeshi Komiyama ,  Fumio Hirai ,  Masamichi Hayashi

发明人： Mitsuo Kuwabara ,  Kiyoshi Ikegami ,  Teruaki Yoshida ,  Koji Takahashi ,  Tamotsu Harada ,  Takeshi Komiyama ,  Fumio Hirai ,  Masamichi Hayashi

IPC分类号： B23K35/02 ,  B23K35/22 ,  C22C32/00 ,  B22F7/00

CPC分类号： C22C32/00 ,  B23K35/222 ,  B23K35/0205 ,  Y10T428/12014 ,  Y10T428/12493 ,  Y10T428/29

摘要： A method of producing a molded ceramic article comprises the first step mixing powdery raw materials and a liquid additive, thereby obtaining a mixed raw material, the second step press-molding the mixed raw material obtained in the first step in a hydrostatically applied condition of pressure, thereby removing an excess of the liquid additive to obtain a preform, and the third step calcining the preform obtained in the second step to obtain a molded ceramic article. The molded ceramic article comprises, as a principal component, copper and, as essential components, Cr and Ni within composition ranges of 0.1.ltoreq.Cr

摘要翻译： 制造模制陶瓷制品的方法包括：将粉末原料和液体添加剂混合的第一步骤，从而获得混合原料，第二步骤是将第一步骤中获得的混合原料在压力下的压力下施加压力 从而除去过量的液体添加剂以获得预成型体，并且第三步骤煅烧在第二步骤中获得的预成型体以获得模制的陶瓷制品。 模制的陶瓷制品以0.1重量％的组成范围内包含铜和作为必要组分的Cr和Ni作为主要组分。 ％和0.1

公开(公告)号：US07347347B2

公开(公告)日：2008-03-25

申请号：US10972440

申请日：2004-10-26

申请人： Hidehiko Kira ,  Shunji Baba ,  Norio Kainuma ,  Toru Okada ,  Takatoyo Yamakami ,  Yasunori Sasaki ,  Takeshi Komiyama ,  Kenji Kobae ,  Hiroshi Kobayashi

发明人： Hidehiko Kira ,  Shunji Baba ,  Norio Kainuma ,  Toru Okada ,  Takatoyo Yamakami ,  Yasunori Sasaki ,  Takeshi Komiyama ,  Kenji Kobae ,  Hiroshi Kobayashi

IPC分类号： B23K1/06 ,  B23K37/00

CPC分类号： H01L21/568 ,  B29C2043/5825 ,  G11B5/4806 ,  G11B5/486 ,  H01L21/56 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/3107 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/75 ,  H01L24/81 ,  H01L24/94 ,  H01L29/0657 ,  H01L2223/54426 ,  H01L2223/5448 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/749 ,  H01L2224/75 ,  H01L2224/7515 ,  H01L2224/75302 ,  H01L2224/7565 ,  H01L2224/75745 ,  H01L2224/75753 ,  H01L2224/81801 ,  H01L2224/83194 ,  H01L2224/83856 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/10158 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19042 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/13111

摘要： A head assembly is provided with a mounting surface, and an integrated circuit chip which is mounted on the mounting surface and processes signals. The integrated circuit chip is covered by a layer which prevents generation of foreign particles from the integrated circuit chip by the provision of the layer.

摘要翻译： 头组件设置有安装表面，以及安装在安装表面上并处理信号的集成电路芯片。 集成电路芯片由防止由集成电路芯片产生异物的层所覆盖。

公开(公告)号：US20050057856A1

公开(公告)日：2005-03-17

申请号：US10972440

申请日：2004-10-26

申请人： Hidehiko Kira ,  Shunji Baba ,  Norio Kainuma ,  Toru Okada ,  Takatoyo Yamakami ,  Yasunori Sasaki ,  Takeshi Komiyama ,  Kenji Kobae ,  Hiroshi Kobayashi

发明人： Hidehiko Kira ,  Shunji Baba ,  Norio Kainuma ,  Toru Okada ,  Takatoyo Yamakami ,  Yasunori Sasaki ,  Takeshi Komiyama ,  Kenji Kobae ,  Hiroshi Kobayashi

IPC分类号： G11B5/48 ,  H01L21/56 ,  H01L21/60 ,  H01L21/68 ,  H01L23/31 ,  H01L29/06 ,  G11B21/20

CPC分类号： H01L21/568 ,  B29C2043/5825 ,  G11B5/4806 ,  G11B5/486 ,  H01L21/56 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/3107 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/75 ,  H01L24/81 ,  H01L24/94 ,  H01L29/0657 ,  H01L2223/54426 ,  H01L2223/5448 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/749 ,  H01L2224/75 ,  H01L2224/7515 ,  H01L2224/75302 ,  H01L2224/7565 ,  H01L2224/75745 ,  H01L2224/75753 ,  H01L2224/81801 ,  H01L2224/83194 ,  H01L2224/83856 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/10158 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19042 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/13111

摘要： A head assembly is provided with a mounting surface, and an integrated circuit chip which is mounted on the mounting surface and processes signals. The integrated circuit chip is covered by a layer which prevents generation of foreign particles from the integrated circuit chip by the provision of the layer.

摘要翻译： 头组件设置有安装表面，以及安装在安装表面上并处理信号的集成电路芯片。 集成电路芯片由防止由集成电路芯片产生异物的层所覆盖。

公开(公告)号：US5374391A

公开(公告)日：1994-12-20

申请号：US76500

申请日：1993-06-09

申请人： Mitsuo Kuwabara ,  Kiyoshi Ikegami ,  Teruaki Yoshida ,  Koji Takahashi ,  Tamotsu Harada ,  Takeshi Komiyama ,  Fumio Hirai ,  Masamichi Hayashi

发明人： Mitsuo Kuwabara ,  Kiyoshi Ikegami ,  Teruaki Yoshida ,  Koji Takahashi ,  Tamotsu Harada ,  Takeshi Komiyama ,  Fumio Hirai ,  Masamichi Hayashi

IPC分类号： B22F3/22 ,  B23K35/02 ,  B23K35/22 ,  B23K35/40 ,  C04B35/622 ,  C22C1/04 ,  C22C1/10 ,  C22C32/00 ,  B22F3/02

CPC分类号： B22F3/225 ,  B23K35/222 ,  B23K35/402 ,  C04B35/622 ,  C22C1/0425 ,  C22C1/1078 ,  C22C32/00 ,  B22F2998/00 ,  B23K35/0205

摘要： A method of producing a molded ceramic article comprises the first step mixing powdery raw materials and a liquid additive, thereby obtaining a mixed raw material, the second step press-molding the mixed raw material obtained in the first step in a hydrostatically applied condition of pressure, thereby removing an excess of the liquid additive to obtain a preform, and the third step calcining the preform obtained in the second step to obtain a molded ceramic article. The molded ceramic article comprises, as a principal component, copper and, as essential components, Cr and Ni within composition ranges of 0.1.ltoreq. Cr

摘要翻译： 制造模制陶瓷制品的方法包括：将粉末原料和液体添加剂混合的第一步骤，从而获得混合原料，第二步骤在第一步骤中获得的混合原料在压力下的静压施加条件下 从而除去过量的液体添加剂以获得预成型体，并且第三步骤煅烧在第二步骤中获得的预成型体以获得模制的陶瓷制品。 模制的陶瓷制品以0.1重量％的组成范围内包含铜和作为必要组分的Cr和Ni作为主要组分。 ％和0.1

公开(公告)号：US5034855A

公开(公告)日：1991-07-23

申请号：US542105

申请日：1990-06-22

申请人： Takeshi Komiyama

发明人： Takeshi Komiyama

IPC分类号： H05K1/02 ,  H05K1/18

CPC分类号： H05K1/181 ,  H05K1/0231 ,  H05K1/0269 ,  H05K2201/10515 ,  H05K2201/10636 ,  H05K2201/10689 ,  Y02P70/611

摘要： On a printed circuit board, according to the present invention, IC packages are arranged in a matrix layout. The IC packages are soldered to the printed circuit board via their lead wires provided on the package sides along row and column lines of the matrix chip components are soldered to the printed circuit board, under each of the IC packages along lines angularly deviated from the row lines or the column lines of the matrix. Thus, the soldered portion of a chip component behind its adjacent chip component can be visually inspected along a view line parallel to the row line or the column line on a highly integrated printed circuit board.