公开(公告)号：US09706608B2

公开(公告)日：2017-07-11

申请号：US13807039

申请日：2011-06-10

申请人： Satoshi Fukano ,  Nobumichi Nishihama ,  Tadashi Yamanaka ,  Fumihiko Masuko ,  Takeshi Saito ,  Hiroki Nakagawa ,  Masanao Hieda ,  Kenichi Ito ,  Naoki Sugishita ,  Keisuke Ono ,  Keiichi Shimizu ,  Shinichi Kumashiro ,  Takeshi Osada

发明人： Satoshi Fukano ,  Nobumichi Nishihama ,  Tadashi Yamanaka ,  Fumihiko Masuko ,  Takeshi Saito ,  Hiroki Nakagawa ,  Masanao Hieda ,  Kenichi Ito ,  Naoki Sugishita ,  Keisuke Ono ,  Keiichi Shimizu ,  Shinichi Kumashiro ,  Takeshi Osada

IPC分类号： H05B37/00 ,  H05B33/06 ,  H01R13/717 ,  H01R33/08 ,  H01J5/50 ,  H05B33/08 ,  F21V14/02 ,  F21V29/50 ,  F21K9/27 ,  H01R33/02 ,  F21Y103/10 ,  F21Y115/10

CPC分类号： H05B33/06 ,  F21K9/27 ,  F21K9/272 ,  F21V14/02 ,  F21V29/50 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01J5/50 ,  H01R13/7175 ,  H01R33/02 ,  H01R33/0854 ,  H05B33/0803

摘要： A straight tube LED lamp includes: a straight tube in which a plurality of light emitting diodes is housed; a first cap for forming a power feeding connection to the plurality of light emitting diodes, provided on one axial direction end side of the straight tube; and a second cap for grounding, provided on another axial direction end side of the straight tube. A first terminal for forming an electrical connection to a power feeding terminal of a first lamp socket is provided in the first cap. A second terminal for forming an electrical connection to a grounding terminal of a second lamp socket is provided in the second cap.

公开(公告)号：US09422462B2

公开(公告)日：2016-08-23

申请号：US14128493

申请日：2012-05-28

申请人： Takeshi Saito ,  Tomomichi Takatsu

发明人： Takeshi Saito ,  Tomomichi Takatsu

IPC分类号： B32B27/08 ,  B32B27/22 ,  B32B27/30 ,  C09J7/02 ,  C09J133/06 ,  C09J133/08 ,  H01L21/683 ,  C08L33/08 ,  C08K5/00 ,  C08K5/11 ,  C08K5/12

CPC分类号： C09J7/0278 ,  B32B27/08 ,  B32B27/22 ,  B32B27/30 ,  C08K5/0016 ,  C08K5/11 ,  C08K5/12 ,  C08L33/08 ,  C08L2205/02 ,  C09J7/22 ,  C09J7/245 ,  C09J7/38 ,  C09J133/062 ,  C09J133/08 ,  C09J2201/622 ,  C09J2203/326 ,  C09J2205/106 ,  C09J2427/006 ,  C09J2433/00 ,  H01L21/6836 ,  H01L2221/68327 ,  Y10T428/2891

摘要： An adhesive sheet of the invention includes a substrate and an adhesive composition laminated thereon, the substrate including polyvinyl chloride and a polyester-based plasticizer, wherein the adhesive composition includes two different (meth)acrylate copolymer components (A) and (B) in a mass ratio ranging from 10:90 to 90:10, wherein a content of a cross-linking agent which reacts with functional groups of the component (A) and the component (B) is in a range of 0.5 to 20 mass parts with respect to 100 mass parts of a sum of the component (A) and the component (B), and wherein 10 to 95 mass % of the monomer unit composing the component (A) is 2-ethylhexyl acrylate, and 10 to 95 mass % of the monomer unit composing the component (B) is butyl acrylate.

摘要翻译： 本发明的粘合片包括基材和层压在其上的粘合剂组合物，所述基材包括聚氯乙烯和聚酯类增塑剂，其中粘合剂组合物包含两种不同的（甲基）丙烯酸酯共聚物组分（A）和（B） 质量比范围为10:90〜90:10，其中与成分（A）和成分（B）的官能团反应的交联剂的含量相对于0.5〜20质量份的范围为 至100质量份组分（A）和组分（B）的总和，其中构成组分（A）的单体单元的10至95质量％为丙烯酸2-乙基己酯，和10至95质量％的 构成组分（B）的单体单元是丙烯酸丁酯。

公开(公告)号：US08758986B2

公开(公告)日：2014-06-24

申请号：US12874755

申请日：2010-09-02

申请人： Takeshi Saito ,  Kazunori Kitamura ,  Yukihiro Koga

发明人： Takeshi Saito ,  Kazunori Kitamura ,  Yukihiro Koga

IPC分类号： G03F7/26

CPC分类号： G03F7/168 ,  H05K3/28 ,  H05K3/3452 ,  H05K2203/0278

摘要： A method produces an undercoat-covered smoothed printed wiring board, requiring no step of polishing the surface of the printed wiring board. A method for producing a solder-resist-covered printed wiring board causes no depression in an area between circuit traces. A printed wiring board so produced is also described. The method for producing a printed wiring board includes applying a photo- and heat-curable resin composition onto at least a part of a surface of a printed wiring substrate; placing an optically transparent smoothing member on the resin layer; moving a hard roller on the smoothing member to thin the applied resin layer to a thickness of interest; placing a negative-image mask on the smoothing member; exposing the applied resin layer to light via the negative-image mask; removing the optically transparent smoothing member; removing a light-unexposed portion of the applied resin layer through development; and completely heat-curing the cured light-exposed portion.

摘要翻译： 一种方法产生底漆覆盖的平滑印刷线路板，不需要抛光印刷线路板的表面的步骤。 用于制造阻焊覆盖印刷线路板的方法不会在电路迹线之间的区域中产生凹陷。 还描述了如此制造的印刷线路板。 印刷电路板的制造方法包括将光固化树脂组合物和热固化性树脂组合物涂布在印刷布线基板的表面的至少一部分上; 将光学透明的平滑部件放置在树脂层上; 在平滑构件上移动硬辊以将所施加的树脂层稀薄至感兴趣的厚度; 在平滑构件上放置负像掩模; 将所施加的树脂层经由负像掩模曝光; 去除光学透明平滑件; 通过显影去除涂布的树脂层的未曝光部分; 并使固化的光照部分完全热固化。

公开(公告)号：US08638930B2

公开(公告)日：2014-01-28

申请号：US11226515

申请日：2005-09-13

申请人： Takeshi Saito

发明人： Takeshi Saito

IPC分类号： H04L9/00

CPC分类号： G06F7/58

摘要： Disclosed is a random number verification method and apparatus capable of quickly detecting the fact that a random number generation device designed to generate substantially authentic random numbers has become unable to generate authentic random numbers due to a malfunction, wrongful manipulation or the like. When random numbers randomly generated as n kinds of values are verified, a random number verification method according to one aspect of the present invention comprises a random number acquisition step of selecting a number m of the values, a counting step of counting the number of ones occurring p times (0≦p

摘要翻译： 公开了一种随机数验证方法和装置，其能够快速检测由于故障，错误操作等而设计成生成实质上可靠的随机数的随机数生成装置不能生成正确的随机数的事实。 当随机生成的n种值的随机数被验证时，根据本发明的一个方面的随机数验证方法包括：随机数获取步骤，选择数值m，计数步数 在n种值中发生p次（0 @ p

公开(公告)号：US08606990B2

公开(公告)日：2013-12-10

申请号：US13039803

申请日：2011-03-03

申请人： Takeshi Saito

发明人： Takeshi Saito

IPC分类号： G06F13/00

CPC分类号： G06F13/1678 ,  G06F13/1684

摘要： An electronic apparatus includes a memory control circuit that controls a first memory and a second memory, the first memory is connected to the memory control circuit through a first data bus, the second memory is connected to the memory control circuit through the first data bus and a second data bus, and a sum of bus widths of the first data bus and the second data bus is larger than the bus width of the first data bus by a times. When the memory control circuit receives an access request for the second memory, the memory control circuit generates a command for accessing the second memory b times on the basis of an address of the access request point and accesses the second memory.

摘要翻译： 一种电子设备包括：控制第一存储器和第二存储器的存储器控​​制电路，第一存储器通过第一数据总线连接到存储器控制电路，第二存储器通过第一数据总线连接到存储器控制电路;以及 第二数据总线以及第一数据总线和第二数据总线的总线宽度之和大于第一数据总线的总线宽度一次。 当存储器控制电路接收到第二存储器的访问请求时，存储器控制电路基于访问请求点的地址生成用于访问第二存储器b次的命令，并访问第二存储器。

公开(公告)号：US20130293949A1

公开(公告)日：2013-11-07

申请号：US13996911

申请日：2011-12-13

申请人： Takeshi Saito ,  Masashi Shinagawa ,  Tetsurou Ikeda ,  Tatsuya Yamasaki ,  Toshiki Oomine ,  Masayuki Satake ,  Shusaku Goto ,  Takeharu Kitagawa ,  Minoru Miyatake ,  Tomohiro Mori ,  Takashi Kamijo

发明人： Takeshi Saito ,  Masashi Shinagawa ,  Tetsurou Ikeda ,  Tatsuya Yamasaki ,  Toshiki Oomine ,  Masayuki Satake ,  Shusaku Goto ,  Takeharu Kitagawa ,  Minoru Miyatake ,  Tomohiro Mori ,  Takashi Kamijo

IPC分类号： G02B1/10

CPC分类号： G02B1/14 ,  C09J4/00 ,  G02B1/105 ,  G02F2202/28

摘要： An adhesive composition curable with an active energy ray includes radical polymerizable compounds (A), (B) and (C) as curable components. The composition includes the radical polymerizable compound (A) having an SP value of 29.0 to 32.0 (kJ/m3)1/2 both inclusive in a proportion of 20 to 60% by weight, the radical polymerizable compound (B) having an SP value of 18.0 (kJ/m3)1/2 or more, and less than 21.0 (kJ/m3)1/2 in a proportion of 10 to 30% by weight, and the radical polymerizable compound (C) having an SP value of 21.0 to 23.0 (kJ/m3)1/2 both inclusive in a proportion of 20 to 60% by weight, when the total amount of the adhesive composition is regarded as 100% by weight, and a homopolymer made from each of the radical polymerizable compounds (A), (B) and (C) has a glass transition temperature (Tg) of 60° C. or higher.

摘要翻译： 可用活性能量射线固化的粘合剂组合物包括可自由基聚合的化合物（A），（B）和（C）作为可固化组分。 该组合物包含SP值为29.0〜32.0（kJ / m3）1/2的自由基聚合性化合物（A），其比例为20〜60重量％，具有SP值的自由基聚合性化合物（B） 18.0（kJ / m3）1/2以上，小于21.0（kJ / m 3）1/2，比例为10〜30重量％，SP自由基聚合性化合物（C）为21.0 至23.0（kJ / m 3）1/2，当粘合剂组合物的总量为100重量％时，其比例为20〜60重量％，由各自由基聚合性化合物 （A），（B）和（C）的玻璃化转变温度（Tg）为60℃以上。

公开(公告)号：US08575857B2

公开(公告)日：2013-11-05

申请号：US13159777

申请日：2011-06-14

申请人： Hiroyuki Sako ,  Katsunobu Hamamoto ,  Takeshi Saito ,  Hiroki Nakagawa ,  Hiroshi Terasaka

发明人： Hiroyuki Sako ,  Katsunobu Hamamoto ,  Takeshi Saito ,  Hiroki Nakagawa ,  Hiroshi Terasaka

IPC分类号： H05B37/02

CPC分类号： H05B33/089 ,  H05B33/0815 ,  Y02B20/347 ,  Y02B20/348

摘要： The LED lighting device includes a lighting circuit unit, a current detecting unit, a voltage detecting unit, and a control unit. The lighting circuit unit is adapted in use to be connected to a lamp socket to be connected to a LED lamp, and is configured to provide an output voltage in the form of a DC voltage to the lamp socket in a manner to turn on the LED lamp. The current detecting unit is configured to detect an output current which is caused by the output voltage and is supplied from said lighting circuit unit to said lamp socket. The voltage detecting unit is configured to detect the output voltage of said lighting circuit unit. The control unit configured to control the lighting circuit unit. The control unit is configured to perform constant-current control of control the lighting circuit unit in a manner to regulate the output voltage such that the output current is identical to a target value while keeping the output voltage not higher than a maximum-load voltage, when the output current detected by the current detecting unit is not less than a predetermined threshold value, and is configured to perform no-load control of controlling the lighting circuit unit in a manner to regulate the output voltage such that the output voltage is kept identical to a no-load voltage higher than the maximum-load voltage, when the output current detected by the current detecting unit is less than the predetermined threshold value.

摘要翻译： LED照明装置包括照明电路单元，电流检测单元，电压检测单元和控制单元。 照明电路单元适于连接到要连接到LED灯的灯座，并且被配置为以将LED的形式的DC电压的形式的LED输出电压提供给灯插座 灯。 电流检测单元被配置为检测由输出电压引起的并从所述点亮电路单元提供给所述灯座的输出电流。 电压检测单元被配置为检测所述点亮电路单元的输出电压。 所述控制单元被配置为控制所述点亮电路单元。 控制单元被配置为以保持输出电压不高于最大负载电压的方式对调节输出电压进行控制的恒流控制，使得输出电流与目标值相同， 当由电流检测单元检测到的输出电流不小于预定阈值时，并且被配置为以调节输出电压的方式执行控制点亮电路单元的空载控制，使得输出电压保持相同 当由电流检测单元检测到的输出电流小于预定阈值时，该空载电压高于最大负载电压。

公开(公告)号：US20130183812A1

公开(公告)日：2013-07-18

申请号：US13825673

申请日：2011-09-14

申请人： Takeshi Saito ,  Tomomichi Takatsu

发明人： Takeshi Saito ,  Tomomichi Takatsu

IPC分类号： H01L21/78

CPC分类号： H01L21/78 ,  C08G18/6229 ,  C08G18/8029 ,  C08L2312/06 ,  C09D4/06 ,  C09D133/04 ,  C09J175/04 ,  H01L21/67132 ,  H01L23/293 ,  H01L23/295 ,  H01L23/296 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method for manufacturing electronic parts, which is characteristic in that it permits reduction of contamination to the semi-cured adhesive layer formed on semiconductor wafer and the cohesive sheet used therein is superior in adhesiveness for example to the lead frame, the method comprising a semi-cured adhesive layer-forming step of forming a semi-cured adhesive layer by coating a pasty adhesive entirely over the rear face of a wafer and curing the pasty adhesive partially by radiation-ray irradiation or heating into the sheet shape, a fixing step of fixing the semi-cured adhesive layer formed on a wafer and a ring frame by bonding them to the cohesive layer of a cohesive sheet, a dicing step of dicing the wafer together with the semi-cured adhesive layer with a dicing blade into semiconductor chips, and a pick-up step of picking up the chips carrying the semi-cured adhesive layer from the cohesive layer of the cohesive sheet after radiation-ray irradiation, wherein the photopolymerization initiator in the cohesive layer of the cohesive sheet has a particular property.

摘要翻译： 一种电子部件的制造方法，其特征在于，能够减少对形成在半导体晶片上的半固化粘合剂层的污染物，并且其中使用的粘合片材例如与引线框架的粘合性优异，该方法包括半 固化粘合剂层形成步骤，通过将糊状粘合剂整体地涂覆在晶片的背面上并将糊状粘合剂部分地通过辐射线照射或加热固化成片状形成半固化粘合剂层，固定步骤 通过将形成在晶片和环形框架上的半固化粘合剂层通过粘合到粘合片材的内聚层来固定半固化粘合剂层，将切割刀片与半固化粘合剂层一起切割成半导体芯片的切割步骤， 以及拾取步骤，在放射线照射之后从粘合片的内聚层拾取携带半固化粘合剂层的芯片，其中光聚合 粘合片的内聚层中的接合引发剂具有特定的性质。

公开(公告)号：US20130171804A1

公开(公告)日：2013-07-04

申请号：US13820871

申请日：2011-09-14

申请人： Takeshi Saito ,  Tomomichi Takatsu

发明人： Takeshi Saito ,  Tomomichi Takatsu

IPC分类号： C09J11/06 ,  H01L21/78

CPC分类号： C09J11/06 ,  C08G18/673 ,  C08G18/792 ,  C08G18/8175 ,  C09D133/066 ,  C09J143/04 ,  C09J175/16 ,  H01L21/67132 ,  H01L21/78 ,  Y10T156/1052 ,  Y10T428/239 ,  Y10T428/24273 ,  Y10T428/24364 ,  Y10T428/28 ,  Y10T428/2809 ,  Y10T428/2891 ,  Y10T428/2907 ,  Y10T428/31855

摘要： Provided is a method for manufacturing electronic component improved in chip-holding efficiency, pickup efficiency and contamination resistance in a well-balanced manner, the method comprising a semi-cured adhesive layer-forming step of forming a semi-cured adhesive layer on the rear face of a wafer, a fixing step of fixing the semi-cured adhesive layer of the wafer on a ring frame with a cohesive sheet, a dicing step of dicing the wafer into semiconductor chips, a UV-irradiating step of irradiating ultraviolet ray, and a pick-up step of picking up the chips and semi-cured adhesive layers from the cohesive layer, wherein the cohesive sheet has a cohesive layer of a cohesive agent having a particular composition formed on one face of its base film.

摘要翻译： 提供一种以均衡的方式制造提高了芯片保持效率，拾取效率和耐污染性的电子部件的方法，所述方法包括在后部形成半固化粘合剂层的半固化粘合剂层形成步骤 将晶片的半固化粘合剂层固定在具有粘结片的环形框架上的定影步骤，将晶片切割成半导体芯片的切割步骤，照射紫外线的紫外线照射步骤和 从内聚层拾取芯片和半固化粘合剂层的拾取步骤，其中粘合片材具有在其基膜的一个表面上形成的具有特定组成的粘结剂的内聚层。

公开(公告)号：US08449154B2

公开(公告)日：2013-05-28

申请号：US13144681

申请日：2010-09-28

申请人： Takaari Uemoto ,  Yasuyuki Ueda ,  Mitsuko Shuto ,  Masahiro Miki ,  Makoto Inoue ,  Hideo Nagai ,  Kenji Takahashi ,  Takeshi Saito

发明人： Takaari Uemoto ,  Yasuyuki Ueda ,  Mitsuko Shuto ,  Masahiro Miki ,  Makoto Inoue ,  Hideo Nagai ,  Kenji Takahashi ,  Takeshi Saito

IPC分类号： F21V21/00 ,  F21V19/00 ,  F21S8/00

CPC分类号： F21V23/009 ,  F21K9/232 ,  F21V19/0055 ,  F21Y2115/10

摘要： A mount member (5) has a contact surface (27a) touching the bottom surface of an LED module (3) and protrusions (5a) protruding from the periphery of the contact surface (27a) in the thickness direction of the LED module (3) and regulating sliding motions thereof. A fixing member (6) made of a resilient, plate-like member comprises an opposing pair of flat portions (43) near the contact surface (27a) of the mount member (5) and flat tabs (44) projecting from the flat portions (43) toward the contact surface (27a) touching the upper surface of a substrate (17). The flat portions (43) of the fixing member (6) are fastened to be lower than the top surface of the substrate (17) of the LED module (3). Thus, elastically deformed areas extending from the fastened parts of the flat portions (43) through the flat tabs (44) press the substrate (17) into the mount member (5).

摘要翻译： 安装构件（5）具有接触LED模块（3）的底面的接触表面（27a）和在LED模块（3）的厚度方向上从接触表面（27a）的周边突出的突起（5a） ）并调节其滑动运动。 由弹性的板状构件制成的固定构件（6）包括在安装构件（5）的接触表面（27a）附近的相对的一对平坦部分（43）和从平坦部分突出的平坦突片（44） （43）朝向接触基板（17）的上表面的接触表面（27a）。 固定部件（6）的平坦部（43）被固定成比LED模块（3）的基板（17）的上表面低。 因此，从扁平部分43的紧固部分延伸穿过平板突起44的弹性变形区域将基板17压入安装部件5。