公开(公告)号：US09206308B2

公开(公告)日：2015-12-08

申请号：US13637629

申请日：2011-03-22

申请人： Tomoaki Iwami ,  Masaaki Matsumoto ,  Tomoyuki Abe ,  Tatsuo Yonemoto ,  Hiroaki Fujiwara

发明人： Tomoaki Iwami ,  Masaaki Matsumoto ,  Tomoyuki Abe ,  Tatsuo Yonemoto ,  Hiroaki Fujiwara

IPC分类号： H05K1/03 ,  B32B27/04 ,  B32B27/20 ,  B32B27/26 ,  B32B27/38 ,  C08K3/10 ,  C08K3/22 ,  C08L63/00 ,  C08G59/22 ,  C08G59/30 ,  C08G59/38 ,  C08G59/62 ,  C08G59/40 ,  C08J5/24 ,  C08K9/02 ,  C08K5/5313 ,  C08K5/5397

CPC分类号： C08L63/00 ,  C08G59/4021 ,  C08G59/621 ,  C08J5/24 ,  C08J2363/00 ,  C08K3/10 ,  C08K3/22 ,  C08K5/5313 ,  C08K5/5397 ,  C08K9/02 ,  H05K1/0326 ,  H05K1/0353 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0209 ,  H05K2201/0227 ,  H05K2201/0263

摘要： The problem to be solved by the invention is to provide an epoxy resin composition for a prepreg, which is used in the manufacture of a printed circuit board containing a multilayer printed circuit board, wherein the epoxy resin composition for a prepreg is characterized by containing as essential components, a phosphorus compound that has 1.8 or more and less than 3 on average of a phenolic hydroxyl group that is reactive to an epoxy resin in the molecule, and that has 0.8 or more on average of a phosphorus element; a bifunctional epoxy resin that has 1.8 or more and less than 2.6 on average of epoxy groups in the molecule; a multi-functional epoxy resin that contains 2.8 or more on average of epoxy groups in one molecule; a hardening agent; an inorganic filler; and a molybdenum compound, wherein the epoxy resin composition for a prepreg is obtained by blending a pre-reacted epoxy resin, which is obtained by reacting at least the phosphorus compound with the bifunctional epoxy resin and the multi-functional epoxy resin, or the bifunctional epoxy resin only in advance, the bifunctional epoxy resin or the multi-functional epoxy resin, the hardening agent, the inorganic filler, and the molybdenum compound, which is excellent in flame retardance, heat resistance, thermal stiffness, and excellent in hole position accuracy without the production of a harmful substance at the time of combustion, a prepreg using the epoxy resin composition for a prepreg, and a multilayer printed circuit board using the prepreg.

摘要翻译： 本发明要解决的问题是提供一种用于预浸料的环氧树脂组合物，其用于制造含有多层印刷电路板的印刷电路板，其中预浸料的环氧树脂组合物的特征在于含有 必要成分，平均分子中与环氧树脂反应的酚羟基平均为1.8以上且小于3的磷化合物，平均为磷成分为0.8以上的磷化合物; 分子中环氧基团平均为1.8以上且小于2.6的双官能环氧树脂; 在一个分子中含有2.8个或更多个平均环氧基的多官能环氧树脂; 硬化剂; 无机填料; 和钼化合物，其中预浸料用环氧树脂组合物通过将至少使磷化合物与双官能环氧树脂和多官能环氧树脂反应获得的预反应环氧树脂或双官能团 环氧树脂仅提前，双功能环氧树脂或多功能环氧树脂，硬化剂，无机填料和钼化合物，其阻燃性，耐热性，热刚度优异，孔位精度优异 在燃烧时不产生有害物质，使用该预浸料坯用环氧树脂组合物的预浸料坯和使用该预浸料坯的多层印刷电路板。

公开(公告)号：US20130096233A1

公开(公告)日：2013-04-18

申请号：US13637629

申请日：2011-03-22

申请人： Tomoaki Iwami ,  Masaaki Matsumoto ,  Tomoyuki Abe ,  Tatsuo Yonemoto ,  Hiroaki Fujiwara

发明人： Tomoaki Iwami ,  Masaaki Matsumoto ,  Tomoyuki Abe ,  Tatsuo Yonemoto ,  Hiroaki Fujiwara

IPC分类号： C08L63/00 ,  C08K9/02 ,  C08K3/10 ,  C08K3/22

CPC分类号： C08L63/00 ,  C08G59/4021 ,  C08G59/621 ,  C08J5/24 ,  C08J2363/00 ,  C08K3/10 ,  C08K3/22 ,  C08K5/5313 ,  C08K5/5397 ,  C08K9/02 ,  H05K1/0326 ,  H05K1/0353 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0209 ,  H05K2201/0227 ,  H05K2201/0263

摘要： The problem to be solved by the invention is to provide an epoxy resin composition for a prepreg, which is used in the manufacture of a printed circuit board containing a multilayer printed circuit board, wherein the epoxy resin composition for a prepreg is characterized by containing as essential components, a phosphorus compound that has 1.8 or more and less than 3 on average of a phenolic hydroxyl group that is reactive to an epoxy resin in the molecule, and that has 0.8 or more on average of a phosphorus element; a bifunctional epoxy resin that has 1.8 or more and less than 2.6 on average of epoxy groups in the molecule; a multi-functional epoxy resin that contains 2.8 or more on average of epoxy groups in one molecule; a hardening agent; an inorganic filler; and a molybdenum compound, wherein the epoxy resin composition for a prepreg is obtained by blending a pre-reacted epoxy resin, which is obtained by reacting at least the phosphorus compound with the bifunctional epoxy resin and the multi-functional epoxy resin, or the bifunctional epoxy resin only in advance, the bifunctional epoxy resin or the multi-functional epoxy resin, the hardening agent, the inorganic filler, and the molybdenum compound, which is excellent in flame retardance, heat resistance, thermal stiffness, and excellent in hole position accuracy without the production of a harmful substance at the time of combustion, a prepreg using the epoxy resin composition for a prepreg, and a multilayer printed circuit board using the prepreg.

摘要翻译： 本发明要解决的问题是提供一种用于预浸料的环氧树脂组合物，其用于制造含有多层印刷电路板的印刷电路板，其中预浸料的环氧树脂组合物的特征在于含有 必要成分，平均分子中与环氧树脂反应的酚羟基平均为1.8以上且小于3的磷化合物，平均为磷成分为0.8以上的磷化合物; 分子中环氧基团平均为1.8以上且小于2.6的双官能环氧树脂; 在一个分子中含有2.8个或更多个平均环氧基的多官能环氧树脂; 硬化剂; 无机填料; 和钼化合物，其中预浸料用环氧树脂组合物通过将至少使磷化合物与双官能环氧树脂和多官能环氧树脂反应获得的预反应环氧树脂或双官能团 环氧树脂仅提前，双功能环氧树脂或多功能环氧树脂，硬化剂，无机填料和钼化合物，其阻燃性，耐热性，热刚度优异，孔位精度优异 在燃烧时不产生有害物质，使用该预浸料坯用环氧树脂组合物的预浸料坯和使用该预浸料坯的多层印刷电路板。

公开(公告)号：US5112989A

公开(公告)日：1992-05-12

申请号：US325807

申请日：1989-03-20

申请人： Tatsuo Yonemoto ,  Eiichiro Saito ,  Masahiro Matsumura

发明人： Tatsuo Yonemoto ,  Eiichiro Saito ,  Masahiro Matsumura

IPC分类号： C07D207/44 ,  C07D207/448 ,  C07D207/452 ,  C07D209/48 ,  C08F22/36 ,  C08F22/40

CPC分类号： C07D207/448 ,  C07D207/452

摘要： A process for producing an unsaturated dicarboxylic acid imide compound of formula (I): ##STR1## wherein D represents a divalent organic group having at least one carbon/carbon double bond; R.sup.1 represents an n-valent organic group having at least one carbon atom; and n is an integer of 1 or above, which comprises reacting an unsaturated amide acid compound of formula (II): ##STR2## wherein D, R.sup.1, and n are as defined above, with an orthoester of formula (III): ##STR3## wherein R.sup.2 and R.sup.3, which may be the same or different, each represents a monovalent organic group having at least one carbon atom, to form an unsaturated dicarboxylic acid amide acid ester compound of formula (IV): ##STR4## wherein D, R.sup.1, R.sup.3, and n are as defined above, and then imidating the compound of formula (IV).

摘要翻译： 制备式（I）的不饱和二羧酸酰亚胺化合物的方法：其中D表示具有至少一个碳/碳双键的二价有机基团; R1表示具有至少一个碳原子的n价有机基团; 其中n为1以上的整数，其包括使式（II）的不饱和酰胺酸化合物：其中D，R1和n如上所定义的式（II）与式（III）的原酸酯反应， ：R2-C [-OR3] 3（III）其中R2和R3可以相同或不同，表示具有至少一个碳原子的一价有机基团，形成式（I）的不饱和二羧酸酰胺酸酯化合物 （IV）：其中D，R1，R3和n如上所定义，然后酰亚胺化式（IV）化合物。

公开(公告)号：US5136015A

公开(公告)日：1992-08-04

申请号：US506956

申请日：1990-04-10

申请人： Tatsuo Yonemoto ,  Masahiro Matsumura ,  Yoshihisa Sugawa ,  Eiichiro Saito ,  Hiroshi Yamamoto ,  Keiko Kashihara

发明人： Tatsuo Yonemoto ,  Masahiro Matsumura ,  Yoshihisa Sugawa ,  Eiichiro Saito ,  Hiroshi Yamamoto ,  Keiko Kashihara

IPC分类号： C08J5/24 ,  B32B5/00 ,  B32B27/04 ,  C08G73/12 ,  H05K1/03

CPC分类号： C08J5/24 ,  B32B27/04 ,  C08G73/121 ,  H05K1/0346 ,  C08J2379/08 ,  Y10T428/31721

摘要： An addition type imide resin prepolymer is obtained by a reaction of unsaturated bisimide of 1.0 mol to diamine of 0.25 to 0.43 mol and an addition of polyamine having three or more benzene rings. The prepolymer is thereby made to contain substantially no unreacted diamine component which affects human body of operators, and to have remarkably excellent heat resistance and adhesive properties, while effective to restrain a production of any component of a molecular weight exceeding 15,000.

摘要翻译： 通过使1.0摩尔的不饱和双酰亚胺与二胺的摩尔比为0.25〜0.43摩尔，加入具有3个以上苯环的多胺，可以得到加成型酰亚胺树脂预聚物。 从而使预聚物基本上不含有影响操作者的人体的未反应的二胺成分，并且具有显着优异的耐热性和粘合性，同时有效地抑制任何分子量超过15,000的成分的生产。

公开(公告)号：US20090314523A1

公开(公告)日：2009-12-24

申请号：US11919139

申请日：2006-04-19

申请人： Katsuhiko Ito ,  Tatsuo Yonemoto ,  Tomoaki Sawada ,  Ikuo Takahashi ,  Hideshi Tomita

发明人： Katsuhiko Ito ,  Tatsuo Yonemoto ,  Tomoaki Sawada ,  Ikuo Takahashi ,  Hideshi Tomita

IPC分类号： H05K1/00 ,  B32B27/04 ,  B05D3/00

CPC分类号： B32B17/04 ,  C08G18/095 ,  C08G18/7614 ,  C08G18/7671 ,  C08G59/4042 ,  C08K5/3445 ,  C08L63/00 ,  C08L79/00 ,  C08L79/08 ,  C08L2666/20 ,  C08L2666/22 ,  C09J7/21 ,  C09J7/35 ,  C09J163/00 ,  C09J179/00 ,  C09J2400/263 ,  C09J2463/00 ,  C09J2479/08 ,  H05K3/386 ,  H05K3/4623 ,  H05K3/4626 ,  H05K3/4691 ,  H05K2201/0154 ,  H05K2201/0195 ,  Y10T442/2738

摘要： An adhesive sheet with a base for flexible printed wiring boards is provided, which has advantages of easiness of machining, excellent moldability, high rigidity and preventing the fall of resin dust particles during machining of a multilayer flexible printed wiring board or a flex-rigid printed wiring board. This adhesive sheet is used for bonding of a flexible printed wiring board made of a polyimide resin, and comprises a woven or nonwoven fabric as the base and a resin composition. The resin composition contains, as essential components, (a) an epoxy resin having two or more of epoxy groups in one molecule; (b) a polycarbodiimide resin dispersible in a solvent, in which the epoxy resin (a) is also dispersible, and having a number average molecular weight of 2000 or more and less than 10000; and (c) an imidazole curing agent. A weight ratio of the component (a) and the component (b) is in a range of 80:20 to 20:80.

摘要翻译： 提供了一种具有柔性印刷电路板基部的粘合片，其具有加工容易性，成型性优异，刚性高，防止在多层柔性印刷线路板或柔性印刷线路板加工过程中树脂粉尘颗粒的下落 接线板 该粘合片用于粘接由聚酰亚胺树脂制成的柔性印刷线路板，并且包括作为基底的机织或非织造织物和树脂组合物。 树脂组合物含有（a）一分子中具有2个以上的环氧基的环氧树脂作为必要成分， （b）分散在溶剂中的聚碳二亚胺树脂，其中环氧树脂（a）也可分散，数均分子量为2000以上且小于10000; 和（c）咪唑固化剂。 组分（a）和组分（b）的重量比在80:20至20:80的范围内。