公开(公告)号：US08612762B2

公开(公告)日：2013-12-17

申请号：US13603201

申请日：2012-09-04

申请人： Tatsuya Imai

发明人： Tatsuya Imai

IPC分类号： H04L9/32

CPC分类号： H04L63/0823 ,  G06F21/33 ,  H04L63/166

摘要： An apparatus in a system which includes at least a high-level apparatus and a plurality of low-level apparatuses, said apparatus being one of the low-level apparatuses. The apparatus includes a storage unit configured to store an individual certificate set and a common certificate set and a communication unit configured to transmit own authentication information to the high level apparatus to allow the high level apparatus to perform decryption to authenticate the validity of the apparatus.

摘要翻译： 一种系统中的至少包括高级装置和多个低级装置的装置，所述装置是低级装置之一。 该装置包括：存储单元，被配置为存储单个证书集合和公共证书集合;以及通信单元，被配置为向高级别装置发送自身的认证信息，以允许高级别装置执行解密以验证该装置的有效性。

公开(公告)号：US20130263243A1

公开(公告)日：2013-10-03

申请号：US13890591

申请日：2013-05-09

申请人： Tatsuya Imai

发明人： Tatsuya Imai

IPC分类号： H04L29/06

CPC分类号： H04N1/00344 ,  G06F21/608 ,  H04L12/403 ,  H04L41/028 ,  H04L43/00 ,  H04L43/0817 ,  H04L63/02 ,  H04N1/00206 ,  H04N1/32502 ,  H04N1/4433

摘要： An agent device is connected with one or more image-forming devices in a local network having a firewall provided therein. A management device carries out remote management of the image-forming devices in the local network through the Internet. The agent device includes a command receiving unit which starts connection with the management device and receives a management command from the management device via the firewall, the command being sent by the management device in response to the connection. An image-forming-device communication unit receives device-state information of a corresponding one of the image-forming devices according to the management command. A command response transmitting unit transmits the device-state information to the management device through the Internet.

公开(公告)号：US08314340B2

公开(公告)日：2012-11-20

申请号：US12568512

申请日：2009-09-28

申请人： Sho Akai ,  Tatsuya Imai ,  Iku Tokihisa

发明人： Sho Akai ,  Tatsuya Imai ,  Iku Tokihisa

IPC分类号： H05K1/03

CPC分类号： H05K3/3452 ,  H05K3/244 ,  H05K3/389 ,  H05K3/4644 ,  H05K2201/099 ,  H05K2203/025

摘要： A multilayer printed wiring board including a first interlayer resin insulation layer, a pad formed on the first interlayer resin insulation layer, a solder resist layer formed on the first interlayer resin insulation layer and the pad, a protective film formed on a portion of the pad exposed by an opening of the solder resist layer, and a coating layer formed between the pad and the solder resist layer. The pad mounts an electronic component. The coating layer has a metal layer and a coating film. The metal layer is formed on the surface of the pad and the coating film is formed on the metal layer.

摘要翻译： 一种多层印刷线路板，包括第一层间树脂绝缘层，形成在第一层间树脂绝缘层上的焊盘，形成在第一层间树脂绝缘层上的阻焊层和焊盘，形成在焊盘的一部分上的保护膜 由阻焊层的开口暴露，以及形成在焊盘和阻焊层之间的涂层。 垫安装电子元件。 涂层具有金属层和涂膜。 金属层形成在焊盘的表面上，涂膜形成在金属层上。

公开(公告)号：US08035268B2

公开(公告)日：2011-10-11

申请号：US12256870

申请日：2008-10-23

申请人： Takenari Okuyama ,  Tatsuya Imai ,  Kunitomo Ishiguro

发明人： Takenari Okuyama ,  Tatsuya Imai ,  Kunitomo Ishiguro

IPC分类号： H02K3/34 ,  H02K3/48 ,  H02K1/06

CPC分类号： H02K3/522 ,  H02K3/325 ,  H02K2203/12

摘要： An insulating bobbin for disposition between a stator core and a stator winding of a stator of a rotating machine, the stator winding being wound around the stator core by way of the insulating bobbin, the insulating bobbin comprising a coil end section at which an end portion of the stator winding is disposed, a slot side section forming a slot for winding thereon the stator winding, and a corner section having a curved surface and connecting between the coil end portion and the slot side portion, the corner section having a first radius of curvature at a side closer to the coil end section and a second radius of curvature at a side closer to the slot side section, the second radius of curvature being larger than the first radius of curvature.

摘要翻译： 一种绝缘筒管，用于配置定子铁心与旋转机械的定子的定子绕组之间，定子绕组通过绝缘筒管缠绕在定子芯上，该绝缘筒管包括一个线圈端部， 定子绕组的槽侧部分形成在其上缠绕定子绕组的槽，以及具有弯曲表面并连接在线圈端部和槽侧部分之间的角部，该角部具有第一半径 在更接近线圈端部的一侧的曲率和在更靠近槽侧部分的一侧的第二曲率半径，第二曲率半径大于第一曲率半径。

公开(公告)号：US20100122839A1

公开(公告)日：2010-05-20

申请号：US12568512

申请日：2009-09-28

申请人： Sho AKAI ,  Tatsuya Imai ,  Iku Tokihisa

发明人： Sho AKAI ,  Tatsuya Imai ,  Iku Tokihisa

IPC分类号： H05K1/09 ,  H05K1/02 ,  H05K3/04 ,  H05K3/06

CPC分类号： H05K3/3452 ,  H05K3/244 ,  H05K3/389 ,  H05K3/4644 ,  H05K2201/099 ,  H05K2203/025

摘要： A multilayer printed wiring board including a first interlayer resin insulation layer, a pad formed on the first interlayer resin insulation layer, a solder resist layer formed on the first interlayer resin insulation layer and the pad, a protective film formed on a portion of the pad exposed by an opening of the solder resist layer, and a coating layer formed between the pad and the solder resist layer. The pad mounts an electronic component. The coating layer has a metal layer and a coating film. The metal layer is formed on the surface of the pad and the coating film is formed on the metal layer.

摘要翻译： 一种多层印刷线路板，包括第一层间树脂绝缘层，形成在第一层间树脂绝缘层上的焊盘，形成在第一层间树脂绝缘层上的阻焊层和焊盘，形成在焊盘的一部分上的保护膜 由阻焊层的开口暴露，以及形成在焊盘和阻焊层之间的涂层。 垫安装电子元件。 涂层具有金属层和涂膜。 金属层形成在焊盘的表面上，涂膜形成在金属层上。

公开(公告)号：US08661665B2

公开(公告)日：2014-03-04

申请号：US13315821

申请日：2011-12-09

申请人： Sho Akai ,  Tatsuya Imai ,  Iku Tokihisa

发明人： Sho Akai ,  Tatsuya Imai ,  Iku Tokihisa

IPC分类号： H01K3/10

CPC分类号： H05K3/3452 ,  H05K3/244 ,  H05K3/389 ,  H05K3/4644 ,  H05K2201/099 ,  H05K2203/025

摘要： A multilayer printed wiring board including a first interlayer resin insulation layer, a pad formed on the first interlayer resin insulation layer, a solder resist layer formed on the first interlayer resin insulation layer and the pad, a protective film formed on a portion of the pad exposed by an opening of the solder resist layer, and a coating layer formed between the pad and the solder resist layer. The pad mounts an electronic component. The coating layer has a metal layer and a coating film. The metal layer is formed on the surface of the pad and the coating film is formed on the metal layer.

摘要翻译： 一种多层印刷线路板，包括第一层间树脂绝缘层，形成在第一层间树脂绝缘层上的焊盘，形成在第一层间树脂绝缘层上的阻焊层和焊盘，形成在焊盘的一部分上的保护膜 由阻焊层的开口暴露，以及形成在焊盘和阻焊层之间的涂层。 垫安装电子元件。 涂层具有金属层和涂膜。 金属层形成在焊盘的表面上，涂膜形成在金属层上。

公开(公告)号：US08464330B2

公开(公告)日：2013-06-11

申请号：US12335386

申请日：2008-12-15

申请人： Tatsuya Imai

发明人： Tatsuya Imai

IPC分类号： H04L29/06

CPC分类号： H04N1/00344 ,  G06F21/608 ,  H04L12/403 ,  H04L41/028 ,  H04L43/00 ,  H04L43/0817 ,  H04L63/02 ,  H04N1/00206 ,  H04N1/32502 ,  H04N1/4433

摘要： An agent device is connected with one or more image-forming devices in a local network having a firewall provided therein. A management device carries out remote management of the image-forming devices in the local network through the Internet. The agent device includes a command receiving unit which starts connection with the management device and receives a management command from the management device via the firewall, the command being sent by the management device in response to the connection. An image-forming-device communication unit receives device-state information of a corresponding one of the image-forming devices according to the management command. A command response transmitting unit transmits the device-state information to the management device through the Internet.

摘要翻译： 代理设备与其中具有防火墙的本地网络中的一个或多个图像形成设备连接。 管理设备通过因特网对本地网络中的图像形成设备进行远程管理。 代理装置包括命令接收单元，其开始与管理设备的连接，并且经由防火墙从管理设备接收管理命令，该命令由管理设备响应于该连接发送。 图像形成装置通信单元根据管理命令接收对应的一个图像形成装置的装置状态信息。 命令响应发送单元通过因特网将设备状态信息发送到管理设备。

公开(公告)号：US08291225B2

公开(公告)日：2012-10-16

申请号：US12630624

申请日：2009-12-03

申请人： Tatsuya Imai

发明人： Tatsuya Imai

IPC分类号： H04L9/32

CPC分类号： H04L63/0823 ,  G06F21/33 ,  H04L63/166

摘要： An apparatus in a system which includes at least a high-level apparatus and a plurality of low-level apparatuses, said apparatus being one of the low-level apparatuses. The apparatus includes a storage unit configured to store an individual certificate set and a common certificate set and a communication unit configured to transmit own authentication information to the high level apparatus to allow the high level apparatus to perform decryption to authenticate the validity of the apparatus.

摘要翻译： 一种系统中的至少包括高级装置和多个低级装置的装置，所述装置是低级装置之一。 该装置包括：存储单元，被配置为存储单个证书集合和公共证书集合;以及通信单元，被配置为向高级别装置发送自身的认证信息，以允许高级别装置执行解密以验证该装置的有效性。

公开(公告)号：US20120152600A1

公开(公告)日：2012-06-21

申请号：US13307499

申请日：2011-11-30

申请人： Hiroyuki NISHIOKA ,  Ryojiro Tominaga ,  Tatsuya Imai

发明人： Hiroyuki NISHIOKA ,  Ryojiro Tominaga ,  Tatsuya Imai

IPC分类号： H05K1/02 ,  B05D5/12

CPC分类号： H05K3/4007 ,  H05K3/3452 ,  H05K3/3484 ,  H05K2201/099 ,  H05K2203/0594

摘要： A printed wiring board including an interlayer resin insulation layer, a pad formed on the interlayer resin insulation layer and for mounting an electronic component, a solder-resist layer formed on the interlayer resin insulation layer and the pad and having an opening portion over the pad, and a coating layer formed on the pad and exposed through the opening portion of the solder-resist layer. The solder-resist layer has a protruding portion protruding toward the inside of the opening portion in a bottom portion of the opening portion, and the protruding portion of the solder-resist layer has a flat surface in an end portion of the protruding portion.

摘要翻译： 一种印刷电路板，包括层间树脂绝缘层，形成在层间树脂绝缘层上并用于安装电子部件的焊盘，形成在层间树脂绝缘层和焊盘上的阻焊层，并且在焊盘上具有开口部分 以及形成在焊盘上并通过阻焊层的开口部露出的涂层。 阻焊层具有在开口部的底部朝向开口部的内侧突出的突出部，并且阻焊层的突出部在突出部的端部具有平坦的表面。

公开(公告)号：US20100126758A1

公开(公告)日：2010-05-27

申请号：US12568467

申请日：2009-09-28

申请人： Sho AKAI ,  Tatsuya Imai ,  Iku Tokihisa

发明人： Sho AKAI ,  Tatsuya Imai ,  Iku Tokihisa

IPC分类号： H05K1/09 ,  H05K1/03 ,  B05D5/12 ,  C23F1/00 ,  C25D5/00

CPC分类号： H05K3/389 ,  H05K3/244 ,  H05K3/384 ,  H05K3/421 ,  H05K3/4644 ,  H05K2203/0361 ,  H05K2203/073 ,  H05K2203/0789 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A multilayer printed wiring board including a first interlayer resin insulation layer, a first conductive circuit formed on the first interlayer resin insulation layer, a second interlayer resin insulation layer formed on the first interlayer resin insulation layer and the first conductive circuit and having an opening portion exposing a portion of the first conductive circuit, a second conductive circuit formed on the second interlayer resin insulation layer, a via conductor formed in the opening portion of the second interlayer resin insulation layer and connecting the first conductive circuit and the second conductive circuit, and a coating layer having a metal layer and a coating film and formed between the first conductive circuit and the second interlayer resin insulation layer. The metal layer is formed on the surface of the first conductive circuit and the coating film is formed on the metal layer.

摘要翻译： 一种多层印刷电路板，包括第一层间树脂绝缘层，形成在第一层间树脂绝缘层上的第一导电电路，形成在第一层间树脂绝缘层上的第二层间树脂绝缘层和第一导电电路，并且具有开口部分 暴露第一导电电路的一部分，形成在第二层间树脂绝缘层上的第二导电电路，形成在第二层间树脂绝缘层的开口部分并连接第一导电电路和第二导电电路的通孔导体，以及 具有金属层和涂膜的涂层，形成在第一导电电路和第二层间树脂绝缘层之间。 金属层形成在第一导电电路的表面上，并且涂层膜形成在金属层上。