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公开(公告)号:US07651938B2
公开(公告)日:2010-01-26
申请号:US11422795
申请日:2006-06-07
申请人: Seah Sun Too , Hsiang Wan Liau , Janet Kirkland , Tek Seng Tan , Maxat Touzelbaev , Raj N. Master
发明人: Seah Sun Too , Hsiang Wan Liau , Janet Kirkland , Tek Seng Tan , Maxat Touzelbaev , Raj N. Master
CPC分类号: H01L23/42 , H01L23/367 , H01L23/3736 , H01L23/4338 , H01L2224/16 , H01L2224/73253 , H01L2924/01079 , H01L2924/16152 , H01L2924/3511
摘要: Thermal interface materials and method of using the same in packaging are provided. In one aspect, a thermal interface material is provided that includes an indium preform that has a first surface and a second surface opposite to the first surface, an interior portion and a peripheral boundary. The indium preform has a channel extending from the peripheral boundary towards the interior portion. The channel enables flux to liberate during thermal cycling.
摘要翻译: 提供热界面材料及其在包装中的使用方法。 在一个方面,提供一种热界面材料,其包括具有第一表面和与第一表面相对的第二表面的铟预制件,内部部分和外围边界。 铟预制件具有从周边边界向内部延伸的通道。 该通道使热通量在热循环期间释放。
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公开(公告)号:US20070284737A1
公开(公告)日:2007-12-13
申请号:US11422795
申请日:2006-06-07
申请人: Seah Sun Too , Hsiang Wan Liau , Janet Kirkland , Tek Seng Tan , Maxat Touzelbaev , Raj N. Master
发明人: Seah Sun Too , Hsiang Wan Liau , Janet Kirkland , Tek Seng Tan , Maxat Touzelbaev , Raj N. Master
IPC分类号: H01L23/48
CPC分类号: H01L23/42 , H01L23/367 , H01L23/3736 , H01L23/4338 , H01L2224/16 , H01L2224/73253 , H01L2924/01079 , H01L2924/16152 , H01L2924/3511
摘要: Thermal interface materials and method of using the same in packaging are provided. In one aspect, a thermal interface material is provided that includes an indium preform that has a first surface and a second surface opposite to the first surface, an interior portion and a peripheral boundary. The indium preform has a channel extending from the peripheral boundary towards the interior portion. The channel enables flux to liberate during thermal cycling.
摘要翻译: 提供热界面材料及其在包装中的使用方法。 在一个方面,提供一种热界面材料,其包括具有第一表面和与第一表面相对的第二表面的铟预制件,内部部分和外围边界。 铟预制件具有从周边边界向内部延伸的通道。 该通道使热通量在热循环期间释放。
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公开(公告)号:US20100055848A1
公开(公告)日:2010-03-04
申请号:US12587627
申请日:2009-10-09
CPC分类号: H01L22/12 , G06T7/0006 , G06T2207/30148 , H01L21/563 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/00
摘要: In inspecting for quality of underfill material dispensed in an IC package, a camera image is captured for the IC package having the underfill material dispensed between an IC die and a package substrate. A data processor analyzes the camera image to determine an occurrence of an unacceptable condition of the underfill material. Pre-heating and/or post-heating of the package substrate before and/or after dispensing the underfill material by a contact-less heater ensures uniform spreading of the underfill material.
摘要翻译: 在检查分配在IC封装中的底部填充材料的质量时,捕获用于IC封装的照相机图像,其具有分配在IC管芯和封装衬底之间的底部填充材料。 数据处理器分析相机图像以确定底部填充材料的不可接受状况的发生。 在通过无接触加热器分配底部填充材料之前和/或之后,封装基板的预热和/或后加热确保了底部填充材料的均匀铺展。
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公开(公告)号:US07256065B1
公开(公告)日:2007-08-14
申请号:US10859673
申请日:2004-06-03
申请人: Seah Sun Too , Edward Alcid , Ahmad Juwanda , Keng Sang Cha , Leang Hua Kam , Tek Seng Tan
发明人: Seah Sun Too , Edward Alcid , Ahmad Juwanda , Keng Sang Cha , Leang Hua Kam , Tek Seng Tan
IPC分类号: H01L21/00
CPC分类号: H01L23/10 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2924/15311 , H01L2924/16251 , H01L2924/00
摘要: A method for coupling a lid to a support substrate having a semiconductor chip coupled thereto and a clamp fixture. Each semiconductor component has a semiconductor chip mounted to a semiconductor component and a lid coupled to the support substrate via a lid attach material. The lid attach material is cured either using a two-step process that includes a partial cure step followed by a clampless cure step or by curing the die attach material in a clamp fixture without including a pre-cure step. The semiconductor component manufacture decides on the curing approach based on cost and the number of semiconductor components being manufactured. If the semiconductor manufacturer opts for curing with a clamp fixture, the clamp fixture includes a base plate insert on which the semiconductor components are placed and a compression mechanism that includes a compression plate having a compressive material disposed thereon.
摘要翻译: 一种用于将盖连接到具有与其连接的半导体芯片的支撑基板和夹具固定装置的方法。 每个半导体部件具有安装到半导体部件的半导体芯片和通过盖子连接材料连接到支撑基板的盖子。 使用包括部分固化步骤然后是无钳位固化步骤的两步工艺或通过在不包括预固化步骤的情况下将夹具附着材料固化在夹具夹具中来固化盖附接材料。 半导体部件制造基于成本和正在制造的半导体部件的数量来决定固化方法。 如果半导体制造商选择用夹具固定固化,则夹具夹具包括其上放置半导体部件的基板插件和包括其上设置有压缩材料的压缩板的压缩机构。
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公开(公告)号:US07256067B1
公开(公告)日:2007-08-14
申请号:US11381089
申请日:2006-05-01
申请人: Seah Sun Too , Tek Seng Tan , Keng Sang Cha , Kee Hean Keok
发明人: Seah Sun Too , Tek Seng Tan , Keng Sang Cha , Kee Hean Keok
IPC分类号: H01L21/00
CPC分类号: H01L21/50 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/73253
摘要: An integrated circuit lid fixture and methods of using the same are provided. In one aspect, an integrated circuit lid fixture is provided that includes a base that has a plurality of pillars. Each of the plurality of pillars has a surface for supporting a substrate that may be removably seated thereon. The surfaces of the plurality of pillars have a first footprint at least as large as a footprint of the substrates to be placed thereon. A plate is provided for applying a compressive force to an integrated circuit lid positioned on any of the substrates removably seated on the pillars.
摘要翻译: 提供一种集成电路盖固定装置及其使用方法。 一方面,提供一种集成电路盖固定装置,其包括具有多个支柱的基座。 多个支柱中的每一个具有用于支撑可移除地安置在其上的基板的表面。 多个柱的表面具有至少与要放置在其上的基板的覆盖区一样大的第一印迹。 提供了一种板,用于向位于可拆卸地安置在支柱上的任何基板上的集成电路盖施加压缩力。
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公开(公告)号:US07999394B2
公开(公告)日:2011-08-16
申请号:US12638112
申请日:2009-12-15
申请人: Seah Sun Too , Hsiang Wan Liau , Janet Kirkland , Tek Seng Tan , Maxat Touzelbaev , Raj N. Master
发明人: Seah Sun Too , Hsiang Wan Liau , Janet Kirkland , Tek Seng Tan , Maxat Touzelbaev , Raj N. Master
CPC分类号: H01L23/42 , H01L23/367 , H01L23/3736 , H01L23/4338 , H01L2224/16 , H01L2224/73253 , H01L2924/01079 , H01L2924/16152 , H01L2924/3511
摘要: Thermal interface materials and method of using the same in packaging are provided. In one aspect, a thermal interface material is provided that includes an indium preform that has a first surface and a second surface opposite to the first surface, an interior portion and a peripheral boundary. The indium preform has a channel extending from the peripheral boundary towards the interior portion. The channel enables flux to liberate during thermal cycling.
摘要翻译: 提供热界面材料及其在包装中的使用方法。 在一个方面,提供一种热界面材料,其包括具有第一表面和与第一表面相对的第二表面的铟预制件,内部部分和外围边界。 铟预制件具有从周边边界向内部延伸的通道。 该通道使热通量在热循环期间释放。
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公开(公告)号:US20100117222A1
公开(公告)日:2010-05-13
申请号:US12638112
申请日:2009-12-15
申请人: Seah Sun Too , Hsiang Wan Liau , Janet Kirkland , Tek Seng Tan , Maxat Touzelbaev , Raj N. Master
发明人: Seah Sun Too , Hsiang Wan Liau , Janet Kirkland , Tek Seng Tan , Maxat Touzelbaev , Raj N. Master
IPC分类号: H01L23/34 , H01L21/50 , H01L23/373 , H01L23/40
CPC分类号: H01L23/42 , H01L23/367 , H01L23/3736 , H01L23/4338 , H01L2224/16 , H01L2224/73253 , H01L2924/01079 , H01L2924/16152 , H01L2924/3511
摘要: Thermal interface materials and method of using the same in packaging are provided. In one aspect, a thermal interface material is provided that includes an indium preform that has a first surface and a second surface opposite to the first surface, an interior portion and a peripheral boundary. The indium preform has a channel extending from the peripheral boundary towards the interior portion. The channel enables flux to liberate during thermal cycling.
摘要翻译: 提供热界面材料及其在包装中的使用方法。 在一个方面,提供一种热界面材料,其包括具有第一表面和与第一表面相对的第二表面的铟预制件,内部部分和外围边界。 铟预制件具有从周边边界向内部延伸的通道。 该通道使热通量在热循环期间释放。
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公开(公告)号:US07622311B1
公开(公告)日:2009-11-24
申请号:US11290086
申请日:2005-11-30
IPC分类号: H01L21/66
CPC分类号: H01L22/12 , G06T7/0006 , G06T2207/30148 , H01L21/563 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/00
摘要: In inspecting for quality of underfill material dispensed in an IC package, a camera image is captured for the IC package having the underfill material dispensed between an IC die and a package substrate. A data processor analyzes the camera image to determine an occurrence of an unacceptable condition of the underfill material. Pre-heating and/or post-heating of the package substrate before and/or after dispensing the underfill material by a contact-less heater ensures uniform spreading of the underfill material.
摘要翻译: 在检查分配在IC封装中的底部填充材料的质量时,捕获用于IC封装的照相机图像,其具有分配在IC管芯和封装衬底之间的底部填充材料。 数据处理器分析相机图像以确定底部填充材料的不可接受状况的发生。 在通过无接触加热器分配底部填充材料之前和/或之后,封装基板的预热和/或后加热确保了底部填充材料的均匀铺展。
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