公开(公告)号：US07337019B2

公开(公告)日：2008-02-26

申请号：US10135405

申请日：2002-05-01

申请人： Terry P. Reiss ,  Arulkumar P. Shanmugasundram ,  Alexander T. Schwarm

发明人： Terry P. Reiss ,  Arulkumar P. Shanmugasundram ,  Alexander T. Schwarm

IPC分类号： G06F19/00 ,  H05B1/02 ,  G05B11/01

CPC分类号： G05B23/0286 ,  G05B19/41865 ,  G05B2219/31357 ,  G05B2219/31443 ,  G05B2219/45031 ,  Y02P90/12 ,  Y02P90/14 ,  Y02P90/20

摘要： Semiconductor wafers are processed in conjunction with a manufacturing execution system using a run-to-run controller and a fault detection system. A recipe is received from the manufacturing execution system by the run-to-run controller for controlling a tool. The recipe includes a setpoint for obtaining one or more target wafer properties. Processing of the wafers is monitored by measuring processing attributes including fault conditions and wafer properties using the fault detection system and one or more sensors. Setpoints of the recipe may be modified at the run-to-run controller according to the processing attributes to maintain the target wafer properties, except in cases when a fault condition is detected by the fault detection system. Thus, data acquired in the presence of tool or wafer fault conditions are not used for feedback purposes. In addition, fault detection models may be used to define a range of conditions indicative of a fault condition. In these cases, the fault detection models may be modified to incorporate, as parameters, setpoints of a recipe modified by a run-to-run controller.

摘要翻译： 半导体晶片与使用运行控制器和故障检测系统的制造执行系统一起进行处理。 通过用于控制工具的跑步运行控制器从制造执行系统接收配方。 该配方包括用于获得一个或多个目标晶片特性的设定点。 通过使用故障检测系统和一个或多个传感器测量包括故障状况和晶片特性的处理属性来监视晶片的处理。 除了在故障检测系统检测到故障情况的情况下，配方的设定点可以根据处理属性在运行控制器上修改以维持目标晶片特性。 因此，在存在工具或晶片故障条件的情况下获取的数据不用于反馈目的。 此外，可以使用故障检测模型来定义指示故障状况的条件范围。 在这些情况下，可以修改故障检测模型，以便将由运行到运行的控制器修改的配方的设定点作为参数进行参考。