摘要:
A heterojunction bipolar transistor is provided with a ballast resistor layer in an emitter layer which prevents the current amplification factor .beta. from decreasing. The n-GaAs carrier supply layer having a specified carrier concentration is formed between the ballast resistor layer and the n-AlGaAs layer.
摘要:
A field effect transistor including a semi-insulating semiconductor substrate, a first conductivity type semiconductor layer disposed on the substrate and forming a heterojunction with the substrate, second conductivity type spaced apart source and drain regions extending through the layer into the substrate, a metallic gate disposed on the layer between the source and drain regions, and a second conductivity type channel disposed in the substrate extending between the source and drain regions and forming a pn heterojunction with the layer for reducing leakage current from the channel to the gate. The second conductivity type channel is produced by ion implantation, and the implantation conditions are controlled as a mechanism for controllably establishing a threshold voltage for the field effect transistor.
摘要:
A semiconductor device includes an n.sup.+ type InGaAs layer at a surface of the device, a refractory metal emitter electrode making ohmic contact to the n.sup.+ layer without alloying, and an externally accessible base region produced in the neighborhood of the emitter electrode by a diffusion using the emitter electrode and an insulating side wall film as a diffusion mask.
摘要:
A semiconductor device includes a collector layer comprising a first conductivity type semiconductor layer, a base layer comprising a second conductivity type semiconductor layer produced on the collector layer, an emitter layer comprising a first conductivity type semiconductor layer produced on the base layer, a contact layer comprising an undoped semiconductor layer produced on the emitter layer, second conductivity type first implantation regions produced at regions each consisting of the contact layer, the emitter layer, and the base layer, so as to leave a central region therebetween, base electrodes produced on the first implantation regions, a first conductivity type second implantation region produced by implanting impurities from the surface of the contact layer extending into the emitter layer, in a region between the first implantation regions, and an emitter electrode produced on the second implantation region. Or, a semiconductor device includes an emitter layer comprising undoped semiconductor layer and a first conductivity type second implantation region produced by implanting impurities from the surface of the undoped semiconductor layer extending into the base layer, at a region between the first implantation regions.
摘要:
Disclosed is an output overvoltage protection circuit for a power amplifier having a plurality of stages, which comprises a monitor circuit for monitoring an output overvoltage of an output transistor in the final stage of the power amplifier and allowing a current to flow therethrough in response to the monitored output overvoltage, and a current mirror circuit for supplying a current proportional to the current from the monitor circuit in such a manner that the base bias of the first-stage transistor of the power amplifier is reduced in response to the current supplied from the current mirror circuit, to reduce the output of the final-stage output transistor.
摘要:
A microwave power amplifier having n stages (n is an integer of at least two), which uses bipolar transistors as amplifying elements. Grounded electrodes, bias applying methods, and bias values of the bipolar transistors of the respective stages are set so that phase rotations of output powers of bipolar transistors of m stages (m is an integer of 1.ltoreq.m.ltoreq.n-1) among the n stages are canceled by phase rotation of at least one of the other bipolar transistors of the (n-m) stages. Therefore, the total phase rotation of the power amplifier can be neutralized, resulting in a microwave power amplifier having excellent distortion characteristics.
摘要:
An electrode lead of a transistor extends beyond other electrode leads of the transistor, is disposed adjacent to the corresponding electrode, and is disposed outside the other electrode leads for heat radiation. A wider part of the electrode lead may have a via hole or a thick metal plating for heat radiation. Further, the electrode is preferably grounded and is connected to an external input terminal to which heat is transferred.
摘要:
A bipolar transistor circuit element includes a semiconductor substrate; successively disposed on the substrate, a base layer, an emitter layer, and a collector layer; a bipolar transistor formed from parts of the collector, base, and emitter layers and including a base electrode electrically connected to the base layer and a base electrode pad for making an external connection to the base layer; a base ballasting resistor formed from a part of the base layer isolated from the bipolar transistor and electrically connecting the base electrode to the base electrode pad; and a base parallel capacitor connected in parallel with the base ballasting resistor wherein the base parallel capacitor includes part of the base input pad, a dielectric film disposed on part of the base electrode pad, and a second electrode disposed on the dielectric layer opposite the base electrode pad and electrically connected to the emitter electrode of the bipolar transistor. The base ballasting resistor has a high resistance relative to an emitter ballasting reactor so that it can be easily mass produced with good uniformity and yield.
摘要:
An optoelectronic integrated circuit includes a light responsive element for converting an optical signal into an electrical signal and an electronic circuit for processing the electrical signal. The light responsive element is disposed on a first surface of a substrate and includes p side electrodes and n side electrodes alternatingly arranged parallel to each other. The electronic circuit is disposed on a second surface of the substrate. The light responsive element is electrically connected to the electronic circuit by a via hole penetrating the substrate. In this structure, light incident on the first surface is almost completely absorbed by the substrate and hardly reaches the electronic circuit on the second surface. Therefore, variations in operation of the electronic circuit, such as an increase in drain current, are reduced. In addition, since the degree of freedom in arranging these elements on both surfaces of the substrate is increased, high-density integration is achieved, resulting in a small-sized IC chip.
摘要:
A frequency divider circuit including a field effect transistor on a semi-insulating substrate including applying a voltage higher than the lowest of the power supply voltages of the frequency divider circuit to the semi-insulating substrate.