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公开(公告)号:US4728568A
公开(公告)日:1988-03-01
申请号:US920784
申请日:1986-10-20
申请人: Shigeru Sasada , Tetsuo Ohwada , Masaru Mishima
发明人: Shigeru Sasada , Tetsuo Ohwada , Masaru Mishima
IPC分类号: H05K3/40 , H05K3/00 , H05K3/06 , H05K3/42 , H01L21/203 , H01L21/306 , A61L15/00
CPC分类号: H05K3/0094 , H05K2201/0959 , H05K2203/0191 , H05K2203/025 , H05K2203/0278 , H05K2203/0582 , H05K2203/0769 , H05K2203/0786 , H05K2203/1394 , H05K3/061 , H05K3/427 , Y10T428/2826 , Y10T428/3188 , Y10T428/31895 , Y10T428/31902 , Y10T428/31906
摘要: Disclosed is a masking tape suitable for use in manufacturing a printed circuit board. The masking tape comprises a water soluble paper as a tape base material, and a water soluble adhesive agent applied to one side of the paper. A method of filling through-holes employing such a water soluble masking tape in a process of manufacturing a printed circuit board is also disclosed.
摘要翻译: 公开了适用于制造印刷电路板的遮蔽胶带。 遮蔽胶带包括作为胶带基材的水溶性纸,以及施加到纸一面的水溶性粘合剂。 还公开了在制造印刷电路板的过程中使用这种水溶性胶带填充通孔的方法。