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公开(公告)号：US08961227B2
公开(公告)日：2015-02-24
申请号：US13348801
申请日：2012-01-12
申请人： Mark W. Gailus , Brian P. Kirk , Thomas S. Cohen
发明人： Mark W. Gailus , Brian P. Kirk , Thomas S. Cohen
IPC分类号： H01R13/648 , H01R13/26 , H01R24/62
CPC分类号： H01R13/26 , H01R13/6585 , H01R13/6597 , H01R24/62
摘要： An electrical connector for connecting a conductor of a daughter card connector wafer with a blade in the housing of a backplane connector. The daughter card conductor has a body with two elongated beams extending outward from the body. The two elongated beams each have an outer edge and an inner edge, whereby an opening is defined between the inner edges. The backplane conductor has a body with a narrowed tab portion extending outward from said second conductor body. The narrowed tab portion having outer opposite edges and is sized so that the narrowed tab portion fits between at least a portion of the outer edges of the two elongated beams, and in some cases between at least a portion of the inner edges of the two elongated beams.
摘要翻译： 一种用于将子卡连接器晶片的导体与背板连接器的外壳中的刀片连接的电连接器。 子卡导体具有一个具有从身体向外延伸的两个细长梁的主体。 两个细长梁各自具有外边缘和内边缘，由此在内边缘之间限定开口。 背板导体具有主体，该主体具有从所述第二导体本体向外延伸的窄的突片部分。 狭窄的突片部分具有外部相对的边缘，并且其尺寸使得狭窄的突片部分配合在两个细长梁的外边缘的至少一部分之间，并且在一些情况下，在两个细长的梁的内边缘的至少一部分之间 梁。
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公开(公告)号：US08814595B2
公开(公告)日：2014-08-26
申请号：US13354783
申请日：2012-01-20
IPC分类号： H01R13/648
CPC分类号： H01R13/04 , H01R13/6461 , H01R13/6473 , H01R13/6587
摘要： A broadside coupled connector assembly has two sets of conductors, each separate planes. By providing the same path lengths, there is no skew between the conductors of the differential pair and the impedance of those conductors is identical. The conductor sets are formed by embedding the first set of conductors in an insulated housing having a top surface with channels. The second set of conductors is placed within the channels so that no air gaps form between the two sets of conductors. A second insulated housing is filled over the second set of conductors and into the channels to form a completed wafer. The ends of the first and second sets of conductors and the blades are jogged in both an x- and y-coordinate to reduce crosstalk and improve electrical performance.
摘要翻译： 宽侧耦合连接器组件具有两组导体，每个独立的平面。 通过提供相同的路径长度，差分对的导体之间不存在偏斜，并且那些导体的阻抗相同。 导体组是通过将第一组导体嵌入绝缘壳体而形成的，绝缘壳体具有带通道的顶表面。 第二组导体放置在通道内，使得两组导体之间不会形成气隙。 第二绝缘壳体填充在第二组导体上并进入通道以形成完整的晶片。 第一组和第二组导体和叶片的端部在x和y坐标上均匀点动以减少串扰并提高电气性能。
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公开(公告)号：US20140004724A1
公开(公告)日：2014-01-02
申请号：US13930531
申请日：2013-06-28
申请人： Marc B. Cartier, JR. , David Manter , Prescott B. Atkinson , Philip T. Stokoe , Thomas S. Cohen , Mark W. Gailus
发明人： Marc B. Cartier, JR. , David Manter , Prescott B. Atkinson , Philip T. Stokoe , Thomas S. Cohen , Mark W. Gailus
IPC分类号： H01R12/70
CPC分类号： H01R12/7082 , H01R12/712 , H01R13/6587 , H01R43/20 , H05K1/0222 , H05K1/024 , H05K1/0251 , H05K2201/09063 , Y10T29/49121
摘要： An RF connector module and associated printed circuit board providing high isolation and controlled impedance at RF frequencies. The connector module may be manufactured using conventional manufacturing techniques, such as stamping, insert molding, multi-shot molding and interference fit between components, to provide low cost. A connector module constructed with these techniques may implement a co-planar waveguide structure, with conductive shields for isolation and lossy material to enforce co-planar propagation modes. The printed circuit board may similarly be manufactured using conventional manufacturing techniques, including drilling to form vias. As a result, an interconnection system may be manufactured with low cost. These techniques may be applied to provide performance, including in the form of isolation between RF signals, comparable to that provided by more expensive components.
摘要翻译： RF连接器模块和相关的印刷电路板，在RF频率下提供高隔离和受控阻抗。 连接器模块可以使用常规的制造技术制造，例如冲压，嵌件成型，多次成型和部件之间的过盈配合，以提供低成本。 用这些技术构成的连接器模块可以实现共面波导结构，其具有用于隔离的导电屏蔽和有损材料以实现共面传播模式。 印刷电路板可类似地使用常规制造技术制造，包括钻孔以形成通孔。 结果，可以以低成本制造互连系统。 可以应用这些技术来提供性能，包括在RF信号之间的隔离的形式，与由更昂贵的组件提供的RF信号相当。
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公开(公告)号：US08123563B2
公开(公告)日：2012-02-28
申请号：US13004973
申请日：2011-01-12
IPC分类号： H01R13/66
CPC分类号： H05K7/1458 , H01R12/724 , H01R13/514 , H01R13/6584 , H01R13/6625 , H01R13/719
摘要： An electrical connector that electrically connects a first printed circuit board and a second printed circuit board is disclosed, where the electrical connector in the preferred embodiment includes: (a) an insulative housing; (b) a plurality of signal conductors, with at least a portion of each of the plurality of signal conductors disposed within the insulative housing; (c) each of the plurality of signal conductors having a first contact end, a second contact end and an intermediate portion therebetween; and (d) a passive circuit element electrically connected to the intermediate portion of each of the plurality of signal conductors, where the passive circuit element is housed in an insulative package and includes at least a capacitor or an inductor.
摘要翻译： 公开了一种电连接第一印刷电路板和第二印刷电路板的电连接器，其中优选实施例中的电连接器包括：（a）绝缘壳体; （b）多个信号导体，所述多个信号导体中的每一个的至少一部分设置在所述绝缘外壳内; （c）多个信号导体中的每一个具有第一接触端，第二接触端和它们之间的中间部分; 以及（d）无源电路元件，其电连接到所述多个信号导体中的每一个的中间部分，其中所述无源电路元件容纳在绝缘封装中并且包括至少一个电容器或电感器。
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公开(公告)号：US20110256741A1
公开(公告)日：2011-10-20
申请号：US13004973
申请日：2011-01-12
CPC分类号： H05K7/1458 , H01R12/724 , H01R13/514 , H01R13/6584 , H01R13/6625 , H01R13/719
摘要： An electrical connector that electrically connects a first printed circuit board and a second printed circuit board is disclosed, where the electrical connector in the preferred embodiment includes: (a) an insulative housing; (b) a plurality of signal conductors, with at least a portion of each of the plurality of signal conductors disposed within the insulative housing; (c) each of the plurality of signal conductors having a first contact end, a second contact end and an intermediate portion therebetween; and (d) a passive circuit element electrically connected to the intermediate portion of each of the plurality of signal conductors, where the passive circuit element is housed in an insulative package and includes at least a capacitor or an inductor.
摘要翻译： 公开了一种电连接第一印刷电路板和第二印刷电路板的电连接器，其中优选实施例中的电连接器包括：（a）绝缘壳体; （b）多个信号导体，所述多个信号导体中的每一个的至少一部分设置在所述绝缘外壳内; （c）多个信号导体中的每一个具有第一接触端，第二接触端和它们之间的中间部分; 以及（d）无源电路元件，其电连接到所述多个信号导体中的每一个的中间部分，其中所述无源电路元件容纳在绝缘封装中并且包括至少一个电容器或电感器。
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公开(公告)号：US20090298308A1
公开(公告)日：2009-12-03
申请号：US12463118
申请日：2009-05-08
IPC分类号： H01R12/00
CPC分类号： H05K7/1458 , H01R12/724 , H01R13/514 , H01R13/6584 , H01R13/6625 , H01R13/719
摘要： An electrical connector that electrically connects a first printed circuit board and a second printed circuit board is disclosed, where the electrical connector in the preferred embodiment includes: (a) an insulative housing; (b) a plurality of signal conductors, with at least a portion of each of the plurality of signal conductors disposed within the insulative housing; (c) each of the plurality of signal conductors having a first contact end, a second contact end and an intermediate portion therebetween; and (d) a passive circuit element electrically connected to the intermediate portion of each of the plurality of signal conductors, where the passive circuit element is housed in an insulative package and includes at least a capacitor or an inductor.
摘要翻译： 公开了一种电连接第一印刷电路板和第二印刷电路板的电连接器，其中优选实施例中的电连接器包括：（a）绝缘壳体; （b）多个信号导体，所述多个信号导体中的每一个的至少一部分设置在所述绝缘外壳内; （c）多个信号导体中的每一个具有第一接触端，第二接触端和它们之间的中间部分; 以及（d）无源电路元件，其电连接到所述多个信号导体中的每一个的中间部分，其中所述无源电路元件容纳在绝缘封装中并且包括至少一个电容器或电感器。
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公开(公告)号：US20090011641A1
公开(公告)日：2009-01-08
申请号：US11958457
申请日：2007-12-18
IPC分类号： H01R13/648 , H01R13/02 , H01R43/00
CPC分类号： H01R12/727 , H01R12/585 , H01R12/724 , H01R13/514 , H01R13/516 , H01R13/6461 , H01R13/6587 , H01R13/6599 , H01R43/16 , H01R43/24 , Y10T29/4922
摘要： An electrical connector includes a wafer formed with a ground shield made from a non-conductive material made conductive with conductive particles disposed therein, thereby eliminating the necessity of the metal ground shield plate found in prior art connectors while maintaining sufficient performance characteristics and minimizing electrical noise generated in the wafer. The wafer housing is formed with a first, insulative housing at least partially surrounding a pair of signal strips and a second, conductive housing at least partially surrounding the first, insulative housing and the signal strips. The housings provide the wafer with sufficient structural integrity, obviating the need for additional support structures or components for a wafer. Ground strips may be employed in the wafer and may be formed in the same plane as the signal strips. The second, conductive housing may be connected (e.g., molded) to the ground strips and spaced appropriately from the signal strips. The wafer may also include air gaps between the signal strips of one wafer and the conductive housing of an adjacent wafer further reducing electrical noise or other losses (e.g., cross-talk) without sacrificing significant signal strength.
摘要翻译： 电连接器包括形成有由不导电材料制成的接地屏蔽的晶片，其中导电颗粒被布置在其中，从而消除了现有技术连接器中发现的金属接地屏蔽板的必要性，同时保持足够的性能特性并最小化电噪声 在晶片中产生。 晶片壳体形成有至少部分地围绕一对信号带的第一绝缘壳体和至少部分地围绕第一绝缘壳体和信号条的第二导电壳体。 这些外壳为晶片提供了足够的结构完整性，从而避免了对晶片的附加支撑结构或部件的需要。 接地条可以用在晶片中，并且可以形成在与信号条相同的平面中。 第二导电壳体可以被连接（例如，模制）到接地条并且与信号条适当地间隔开。 晶片还可以包括一个晶片的信号条和相邻晶片的导电外壳之间的气隙，从而进一步降低电噪声或其他损耗（例如串扰），而不会牺牲显着的信号强度。
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公开(公告)号：US20080246555A1
公开(公告)日：2008-10-09
申请号：US12062570
申请日：2008-04-04
申请人： BRIAN KIRK , Thomas S. Cohen
发明人： BRIAN KIRK , Thomas S. Cohen
IPC分类号： H01P5/12
CPC分类号： H01R13/514 , H01R12/724 , H01R13/6471 , H01R13/6477 , H01R13/6587
摘要： An electrical interconnection system with high speed, differential electrical connectors. The connector is assembled from wafers each containing a column of conductive elements, some of which form differential pairs. A housing for the wafer is formed with regions of higher and lower dielectric constant material. The regions of lower dielectric constant material are selectively positioned adjacent longer signal conductors of the differential pairs. The material may be preferentially placed along curved segments of the differential pair to reduce crosstalk in the connector while reducing skew.
摘要翻译： 具有高速差动电连接器的电气互连系统。 连接器由每个包含一列导电元件的晶片组装，其中一些形成差分对。 用于晶片的壳体形成有较高和较低介电常数材料的区域。 低介电常数材料的区域选择性地定位在差分对的更长的信号导体附近。 材料可以优先放置在差动对的弯曲段上，以减少连接器中的串扰，同时减少偏斜。
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公开(公告)号：US07163421B1
公开(公告)日：2007-01-16
申请号：US11183564
申请日：2005-07-18
IPC分类号： H01R13/648
CPC分类号： H01R12/727 , H01R12/585 , H01R12/724 , H01R13/514 , H01R13/516 , H01R13/6461 , H01R13/6587 , H01R13/6599 , H01R43/16 , H01R43/24 , Y10T29/4922
摘要： An electrical connector includes a wafer formed with a ground shield made from a non-conductive material made conductive with conductive particles disposed therein, thereby eliminating the necessity of the metal ground shield plate found in prior art connectors while maintaining sufficient performance characteristics and minimizing electrical noise generated in the wafer. The wafer housing is formed with a first, insulative housing at least partially surrounding a pair of signal strips and a second, conductive housing at least partially surrounding the first, insulative housing and the signal strips. The housings provide the wafer with sufficient structural integrity, obviating the need for additional support structures or components for a wafer. Ground strips may be employed in the wafer and may be formed in the same plane as the signal strips. The second, conductive housing may be connected (e.g., molded) to the ground strips and spaced appropriately from the signal strips. The wafer may also include air gaps between the signal strips of one wafer and the conductive housing of an adjacent wafer further reducing electrical noise or other losses (e.g., cross-talk) without sacrificing significant signal strength.
摘要翻译： 电连接器包括形成有由不导电材料制成的接地屏蔽的晶片，其中导电颗粒被布置在其中，从而消除了现有技术连接器中发现的金属接地屏蔽板的必要性，同时保持足够的性能特性并最小化电噪声 在晶片中产生。 晶片壳体形成有至少部分地围绕一对信号带的第一绝缘壳体和至少部分地围绕第一绝缘壳体和信号条的第二导电壳体。 这些外壳为晶片提供了足够的结构完整性，从而避免了对晶片的附加支撑结构或部件的需要。 接地条可以用在晶片中，并且可以形成在与信号条相同的平面中。 第二导电壳体可以被连接（例如，模制）到接地条并且与信号条适当地隔开。 晶片还可以包括一个晶片的信号条和相邻晶片的导电外壳之间的气隙，从而进一步降低电噪声或其他损耗（例如串扰），而不会牺牲显着的信号强度。
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公开(公告)号：US06739918B2
公开(公告)日：2004-05-25
申请号：US10061120
申请日：2002-02-01
IPC分类号： H01R13514
CPC分类号： H01R13/6315 , H01R13/6587 , H01R43/24
摘要： An electrical connector assembly suitable for use in a matrix assembly. The electrical connector assembly has two connectors, each assembled from wafers. The individual wafers are shielded and separate shield pieces are positioned in one connector transverse to the wafers in that connector. Additionally, wafers in at least one of the connectors includes a compliant portion that allows the two connectors to be self-aligning.
摘要翻译： 一种适用于矩阵组件的电连接器组件。 电连接器组件具有两个连接器，每个连接器由晶片组装。 单个晶片被屏蔽，并且分离的屏蔽片位于横向于该连接器中的晶片的一个连接器中。 此外，至少一个连接器中的晶片包括允许两个连接器自对准的柔性部分。
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