摘要:
A method for forecasting a WIP (work in process) output schedule and a computer program product thereof are provided. A plurality of sets of historical WIP data regarding a product generated in respective historical periods are first collected, in which the product has a maximum historical production cycle. Thereafter, a predetermined time is used to divide the maximum historical production cycle into intervals. Then, the quantities of historical WIPs appearing in the respective intervals are computed in accordance with output times of the historical WIPs recorded in each of the sets of historical WIP data, thereby obtaining output probability density data series. If the number of the historical periods is greater than or equal to a minimum model-building number, a predicted output probability density data series of a next period following the historical periods is conjectured by using the output probability density data series in accordance with a prediction algorithm.
摘要:
A test method of a liquid crystal display panel is provided. The liquid crystal display panel includes a plurality of pixels and a testing pad. The pixels are disposed at intersections between a first, a second, and a third data lines and a plurality of scan lines. In the test method, each of the scan lines is driven to connect liquid crystal capacitors of the pixels to the first, the second, and the third data lines. A first and a second test voltages are respectively supplied to the first and the second data lines, wherein the first test voltage is not equal to the second test voltage. The first data line is floated. The floated first data line is measured through the testing pad to determine whether the liquid crystal capacitors of the pixels electrically connected to the first and the second data lines are electrically connected with each other.
摘要:
A method for manufacturing a bearing device includes steps: providing a hollow mold, then injecting a feedstock of powder and molten binder into the mold under pressure, thus forming a desired perform of a cylindrical body and a desired perform of a cover; separating the binder from the desired perform of the body and the desired perform of the cover; sintering the desired perform of the body and the desired perform of the cover, thereby forming the body and the cover; and mounting the cover on the body, thereby forming the bearing device.
摘要:
A flat heat pipe includes a casing, a wick structure received in the casing, and a working medium contained in the casing and saturated in the wick structure. The casing has an upper plate and a bottom plate opposite to the upper plate. The wick structure is attached only to the bottom plate of the casing. The wick structure spaces from the upper plate with a vapor channel defined between the upper plate and the wick structure.
摘要:
The invention provides an electronic apparatus. In one embodiment, the electronic apparatus comprises a motherboard, a Universal Serial Bus (USB) 3.0 module, and a Peripheral Component Interconnect Express (PCIe) interface. The motherboard comprises a host chip and a power supply module. The USB 3.0 module comprises a USB 3.0 controller chip and a USB 3.0 connector, wherein a USB 3.0 connector is located on a front panel of the electronic apparatus. The PCIe interface couples the USB 3.0 module with the motherboard, transmits a set of PCIe signals between the host chip and the USB 3.0 controller chip, and sends a power generated by the power supply module to the USB 3.0 controller chip and the USB 3.0 connector.
摘要:
An exemplary method of manufacturing a heat dissipation device includes, firstly, providing a heat pipe including a condenser section having a planar outer surface, and providing a heat sink including a supporting surface defining a guiding line. The guiding line has a width smaller than a width of the outer surface of the condenser section. Next, an amount solder is spread on the supporting surface along the guiding line to form a solder layer on the supporting surface. The solder layer has a size not larger than a size of the outer surface of the condenser section. Then the outer surface of condenser section of the heat pipe is attached to the solder layer on the supporting surface of the heat sink.
摘要:
A control device is applied to a base of an umbrella stem. A buckle sits in the base whose upper portion sets a controlling device controlled by the buckle and whose lower portion radially disposes a spool disk. The peripheral wall of the spool disk having ratchets defined thereon is embraced by a spool groove. Two ends of a spiral spring are respectively fixed to the base and the spool disk to generate an elastic force driving the spool disk's rotation. A shift block positioned under the base of the controlling device has a continuous torsion to contact the spool disk and clasp the ratchets. A disk cord provides one end fixed on the spool disk and wound around the spool groove and the other end penetrating the controlling device and the base to join an upper accommodation of the umbrella.
摘要:
A cleaning solution is provided. The cleaning solution includes (a) 0.01-0.1 wt % of hydrofluoric acid (HF); (b) 1-5 wt % of a strong acid, wherein the strong acid is an inorganic acid; (c) 0.05-0.5 wt % of ammonium fluoride (NH4F); (d) a chelating agent containing a carboxylic group; (e) triethanolamine (TEA); (f) ethylenediaminetetraacetic acid (EDTA); and (g) water for balance.
摘要:
A cleaning solution is provided. The cleaning solution includes (a) 0.01-0.1 wt % of hydrofluoric acid (HF); (b) 1-5 wt % of a strong acid, wherein the strong acid is an inorganic acid; (c) 0.05-0.5 wt % of ammonium fluoride (NH4F); (d) a chelating agent containing a carboxylic group; (e) triethanolamine (TEA); (f) ethylenediaminetetraacetic acid (EDTA); and (g) water for balance.
摘要:
A semiconductor manufacturing process is provided. First, a substrate is provided, wherein a patterned conductive layer, a dielectric layer and a patterned metal hard mask layer are sequentially formed thereon. Thereafter, a portion of the dielectric layer is removed to form a damascene opening exposing the patterned conductive layer. Afterwards, the dielectric layer is heated to above 200° C. Thereafter, a plasma treatment process is performed on the damascene opening, wherein the gases used to generate the plasma include hydrogen gas and inert gas. Afterwards, a conductive layer is formed in the damascene opening to fill therein.