Resist pattern forming method, resist pattern, positive resist composition, nanoimprint mold and photomask
    1.
    发明授权
    Resist pattern forming method, resist pattern, positive resist composition, nanoimprint mold and photomask 有权
    抗蚀剂图案形成方法,抗蚀剂图案,正性抗蚀剂组合物,纳米压印模具和光掩模

    公开(公告)号:US08906600B2

    公开(公告)日:2014-12-09

    申请号:US13561540

    申请日:2012-07-30

    摘要: A resist pattern forming method includes: in the following order, (1) a step of forming a film on a substrate by using a positive resist composition; (2) a step of exposing the film; and (4) a step of performing development by using an alkali developer after the exposing, wherein the positive resist composition contains (A) a polymer compound having a repeating unit represented by the following formula (I) as defined in the specification, a thickness of the film formed in the step (1) is from 15 to 40 nm, and an alkali component concentration in the alkali developer is from 0.5 to 1.1 mass %.

    摘要翻译: 抗蚀剂图形形成方法包括:按以下顺序,(1)通过使用正性抗蚀剂组合物在基板上形成膜的步骤; (2)曝光胶片的步骤; (4)通过使用曝光后的碱性显影剂进行显影的工序,其中正型抗蚀剂组合物含有(A)具有如本说明书中定义的下式(I)表示的重复单元的高分子化合物,其厚度 的步骤(1)中形成的膜为15〜40nm,碱显影剂中的碱成分浓度为0.5〜1.1质量%。

    RESIST PATTERN FORMING METHOD, RESIST PATTERN, POSITIVE RESIST COMPOSITION, NANOIMPRINT MOLD AND PHOTOMASK
    3.
    发明申请
    RESIST PATTERN FORMING METHOD, RESIST PATTERN, POSITIVE RESIST COMPOSITION, NANOIMPRINT MOLD AND PHOTOMASK 有权
    电阻图案形成方法,电阻图案,阳性电阻组合物,纳米压印模具和光电

    公开(公告)号:US20130052568A1

    公开(公告)日:2013-02-28

    申请号:US13561540

    申请日:2012-07-30

    摘要: A resist pattern forming method includes: in the following order, (1) a step of forming a film on a substrate by using a positive resist composition; (2) a step of exposing the film; and (4) a step of performing development by using an alkali developer after the exposing, wherein the positive resist composition contains (A) a polymer compound having a repeating unit represented by the following formula (I) as defined in the specification, a thickness of the film formed in the step (1) is from 15 to 40 nm, and an alkali component concentration in the alkali developer is from 0.5 to 1.1 mass %.

    摘要翻译: 抗蚀剂图形形成方法包括:按以下顺序,(1)通过使用正性抗蚀剂组合物在基板上形成膜的步骤; (2)曝光胶片的步骤; (4)通过使用曝光后的碱性显影剂进行显影的工序,其中正型抗蚀剂组合物含有(A)具有如本说明书中定义的下式(I)表示的重复单元的高分子化合物,其厚度 的步骤(1)中形成的膜为15〜40nm,碱显影剂中的碱成分浓度为0.5〜1.1质量%。

    Positive resist composition and pattern forming method using the same
    6.
    发明授权
    Positive resist composition and pattern forming method using the same 有权
    正型抗蚀剂组合物和使用其的图案形成方法

    公开(公告)号:US07625690B2

    公开(公告)日:2009-12-01

    申请号:US11717618

    申请日:2007-03-14

    IPC分类号: G03F7/004 G03F7/30

    摘要: A resist composition, which comprises: (A) a resin containing a repeating unit represented by formula (I); and (B) a compound capable of generating an acid upon irradiation with actinic rays or radiation: wherein AR represents an aryl group; Rn represents an alkyl group, a cycloalkyl group or an aryl group; and A represents an atom or group selected from the group consisting of a hydrogen atom, an alkyl group, a halogen atom, a cyano group and an alkyloxycarbonyl group, and a pattern forming method using the resist composition.

    摘要翻译: 一种抗蚀剂组合物,其包含:(A)含有由式(I)表示的重复单元的树脂; 和(B)能够在用光化射线或辐射照射时能够产生酸的化合物:其中AR表示芳基; Rn表示烷基,环烷基或芳基; A表示选自氢原子,烷基,卤素原子,氰基和烷氧基羰基的原子或基团,以及使用该抗蚀剂组合物的图案形成方法。

    Positive resist composition and pattern forming method using the same
    10.
    发明授权
    Positive resist composition and pattern forming method using the same 有权
    正型抗蚀剂组合物和使用其的图案形成方法

    公开(公告)号:US07923196B2

    公开(公告)日:2011-04-12

    申请号:US12672329

    申请日:2008-08-01

    IPC分类号: G03F7/00 G03F7/004 G03F7/20

    摘要: A positive resist composition comprising (A) a resin which contains all of the repeating units represented by formulae (I) to (III), and becomes soluble in an alkali developer by the action of an acid, and (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation; and a pattern forming method using the composition. A represents a group capable of decomposing and leaving by the action of an acid, each R1 independently represents hydrogen or a methyl group, R2 represents a phenyl group or a cyclohexyl group, m represents 1 or 2, and n represents an integer of 0 to 2. By virtue of this construction, a resist composition ensuring high resolution, good pattern profile, sufficient depth of focus, little defects after development, and sufficiently high plasma etching resistance is provided.

    摘要翻译: 一种正型抗蚀剂组合物,其包含(A)含有由式(I)至(III)表示的所有重复单元的树脂,并且通过酸的作用变得可溶于碱性显影剂,和(B)能够 在用光化射线或辐射照射时产生酸; 以及使用该组合物的图案形成方法。 A表示能够通过酸的分解和离去的基团,每个R 1独立地表示氢或甲基,R 2表示苯基或环己基,m表示1或2,n表示0〜 通过这种结构,提供了确保高分辨率,良好的图案轮廓,足够的焦深,显影后的小缺陷以及足够高的耐等离子体耐蚀刻性的抗蚀剂组合物。