公开(公告)号：US07245884B2

公开(公告)日：2007-07-17

申请号：US09884274

申请日：2001-06-19

申请人： Toshifumi Oida ,  Takahiro Watanabe ,  Eigoro Ina ,  Norio Nakajima

发明人： Toshifumi Oida ,  Takahiro Watanabe ,  Eigoro Ina ,  Norio Nakajima

IPC分类号： H04B1/38

CPC分类号： H01L23/552 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6677 ,  H01L2223/6688 ,  H01L2224/05599 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2224/73204 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15192 ,  H01L2924/15313 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01Q1/243 ,  H01Q1/38 ,  H01Q23/00 ,  H04B1/38 ,  H05K1/16 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： An RF module includes a multi-layered substrate. A base-band IC, a memory IC, a quartz oscillator and surface-mount components are mounted on the upper surface of the multi-layered substrate. A metallic cap also is attached to the upper surface of the multi-layered substrate. A cavity is formed in the lower surface of the multi-layered substrate substantially at the center thereof. A first RF-IC and a second RF-IC are embedded in the cavity. Wiring patterns for providing connections between the base-band IC and the memory IC, through-holes, RF passive components, and the shield ground electrode pattern are disposed inside of the multi-layered substrate.

摘要翻译： RF模块包括多层基板。 基带IC，存储器IC，石英振荡器和表面安装部件安装在多层基板的上表面上。 金属帽也附接到多层基板的上表面。 在多层基板的下表面的大致中央形成有空腔。 第一个RF-IC和第二个RF-IC嵌入在腔中。 用于提供基带IC与存储器IC，通孔，RF无源部件和屏蔽接地电极图案之间的连接的布线图案设置在多层基板的内部。

公开(公告)号：US06288680B1

公开(公告)日：2001-09-11

申请号：US09040686

申请日：1998-03-18

申请人： Teruhisa Tsuru ,  Seiji Kanba ,  Toshifumi Oida ,  Harufumi Mandai

发明人： Teruhisa Tsuru ,  Seiji Kanba ,  Toshifumi Oida ,  Harufumi Mandai

IPC分类号： H04B138

CPC分类号： H01Q1/362 ,  H01Q1/243 ,  H01Q1/38 ,  H01Q11/08

摘要： An antenna apparatus 10 includes a chip antenna 14 provided with a conductor 11, a power-supply electrode 12 to which one end of the conductor 11 is connected, and a terminal electrode 13 to which the other end of the conductor is connected; and a mounting substrate 18 provided with a line-shaped radiative conductor 15 formed by printing an electrically conductive material on a surface, a line-shaped conductive pattern 16, and a substantially rectangular ground electrode 17. The chip antenna 14 is mounted on the mounting substrate 18. The power-supply electrode 12 of the chip antenna 14 is connected through the conductive pattern 16 on the mounting substrate 18 to a power-supply source V. The terminal electrode 13 of the chip antenna 14 is connected to one end of the radiative conductor 15 on the mounting substrate 18.

摘要翻译： 天线装置10包括设置有导体11的芯片天线14，与导体11的一端连接的电源电极12以及导体的另一端连接的端子电极13。 以及安装基板18，其设置有通过在表面上印刷导电材料而形成的线状辐射导体15，线状导电图案16和大致矩形的接地电极17.芯片天线14安装在安装件 基板18.芯片天线14的电源电极12通过安装基板18上的导电图案16连接到电源V.芯片天线14的端子电极13连接到 安装基板18上的辐射导体15。

公开(公告)号：US5912647A

公开(公告)日：1999-06-15

申请号：US852749

申请日：1997-05-07

申请人： Teruhisa Tsuru ,  Harufumi Mandai ,  Toshifumi Oida

发明人： Teruhisa Tsuru ,  Harufumi Mandai ,  Toshifumi Oida

IPC分类号： H01Q1/22 ,  H01Q1/38 ,  H01Q9/04

CPC分类号： H01Q1/2283 ,  H01Q1/22 ,  H01Q1/38 ,  H01Q9/0421

摘要： An antenna unit having a substrate and a radiator, including a metal plate, which is mounted on the substrate, the radiator being provided with a feed terminal, a ground terminal and an electrostatic capacitance connecting terminal extending toward the substrate, so that the radiator is fixed to the substrate through the feed terminal, the ground terminal and the electrostatic capacitance connecting terminal, and further a capacitance being connected between the capacitance connecting terminal and a ground potential.

摘要翻译： 一种具有基板和散热器的天线单元，包括安装在基板上的金属板，散热器设置有馈电端子，接地端子和静电电容连接端子，朝向基板延伸，使得散热器 通过馈电端子，接地端子和静电电容连接端子固定到衬底，并且还有一个电容连接在电容连接端子和接地电位之间。

公开(公告)号：US5874926A

公开(公告)日：1999-02-23

申请号：US815277

申请日：1997-03-10

申请人： Teruhisa Tsuru ,  Harufumi Mandai ,  Toshifumi Oida ,  Yoichiro Suga

发明人： Teruhisa Tsuru ,  Harufumi Mandai ,  Toshifumi Oida ,  Yoichiro Suga

IPC分类号： H01Q1/36 ,  H01Q1/38 ,  H01Q1/50

CPC分类号： H04B1/18 ,  H01Q1/362 ,  H01Q1/38 ,  H03H7/40

摘要： A matching circuit and an antenna apparatus which, though small-sized, can be used in a radio apparatus which transmits and receives radio waves having a wide range of frequencies. A matching circuit includes an inductance element formed of a chip inductor connected in series with an antenna body, a first capacitance element formed of a trimmer capacitor, and a second capacitance element formed of a chip capacitor, which capacitance elements are connected between respective ends of the inductance element and a ground terminal, and thus in parallel to the antenna body. One end of the inductance element is connected to the power supply terminal of the antenna body, and the other end is connected to a power source for applying a voltage to the antenna body. The first capacitance element is connected between a ground and the connection point of the power supply terminal of the antenna body and the inductance element. The second capacitance element is connected between a ground and the connection point of the inductance element and the power source.

摘要翻译： 尽管体积小的匹配电路和天线装置可以用于发送和接收具有宽频率范围的无线电波的无线电装置中。 匹配电路包括由与天线体串联连接的芯片电感器形成的电感元件，由微调电容器形成的第一电容元件和由片状电容器形成的第二电容元件，所述电容元件连接在 电感元件和接地端子，因此平行于天线体。 电感元件的一端连接到天线体的电源端子，另一端连接到用于向天线体施加电压的电源。 第一电容元件连接在地与天线体的电源端子与电感元件的连接点之间。 第二电容元件连接在接地和电感元件与电源的连接点之间。

公开(公告)号：US06693243B1

公开(公告)日：2004-02-17

申请号：US09711571

申请日：2000-11-13

申请人： Toshifumi Oida ,  Akihiro Ochii ,  Nobuyoshi Okuda ,  Yoshirou Satou ,  Katsuhiko Fujikawa

发明人： Toshifumi Oida ,  Akihiro Ochii ,  Nobuyoshi Okuda ,  Yoshirou Satou ,  Katsuhiko Fujikawa

IPC分类号： H05K116

CPC分类号： H05K3/341 ,  H01L23/49805 ,  H01L23/49838 ,  H01L2924/0002 ,  H05K3/3442 ,  H05K2201/09781 ,  H05K2201/10727 ,  H05K2201/10969 ,  H05K2203/168 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49155 ,  H01L2924/00

摘要： On a mounting surface of a multilayered component as a surface mounting component, an isolated electrode is arranged so as to be isolated from other terminal electrodes on the mounting surface. For solder applied to the isolated electrode, the application range can be securely limited to an area within the isolated electrode.

摘要翻译： 在作为表面安装部件的多层部件的安装面上，隔离电极配置成与安装面上的其他端子电极隔离。 对于施加到隔离电极的焊料，施加范围可以被可靠地限制在隔离电极内的区域。

公开(公告)号：US6028554A

公开(公告)日：2000-02-22

申请号：US35522

申请日：1998-03-05

申请人： Harufumi Mandai ,  Teruhisa Tsuru ,  Toshifumi Oida

发明人： Harufumi Mandai ,  Teruhisa Tsuru ,  Toshifumi Oida

IPC分类号： H01Q1/22 ,  H01Q1/36 ,  H01Q1/38 ,  H01Q21/30

CPC分类号： H01Q1/2283 ,  H01Q1/22 ,  H01Q1/36 ,  H01Q1/362 ,  H01Q1/38 ,  H01Q21/30

摘要： The invention provides a mobile image apparatus (10), comprising: a case unit (11); at least one antenna (12) disposed at least one of within said case unit (11) and outside said case unit (11); wherein said chip antenna (12) comprises; a substrate (1) made of at least one of a dielectric material and a magnetic material; at least one conductor (2) disposed at least one of within said substrate (1) and on a surface of said substrate (1); at least one power feeding terminal (3) disposed on a surface of said substrate (1) and connected to one end of said conductor (2) for applying a voltage to said conductor (2).

摘要翻译： 本发明提供了一种移动图像装置（10），包括：壳体单元（11）; 至少一个天线（12），其设置在所述壳体单元（11）内和所述壳体单元（11）的外部中的至少一个上; 其中所述芯片天线（12）包括： 由介电材料和磁性材料中的至少一种制成的基片（1）; 至少一个导体（2）设置在所述衬底（1）内和所述衬底（1）的表面上的至少一个上; 至少一个供电端子（3），设置在所述基板（1）的表面上并且连接到所述导体（2）的一端，用于向所述导体（2）施加电压。

公开(公告)号：US06603960B1

公开(公告)日：2003-08-05

申请号：US09534271

申请日：2000-03-24

申请人： Toshifumi Oida ,  Masaki Kimura ,  Satoshi Ishino ,  Norio Nakajima

发明人： Toshifumi Oida ,  Masaki Kimura ,  Satoshi Ishino ,  Norio Nakajima

IPC分类号： H03C162

CPC分类号： H01P5/185

摘要： A transmission output control device comprising: a directional coupler which branches a part of an amplified transmission signal from a high output amplifier; and a detector which detects a part of said branched transmission signal; wherein the directional coupler and the detector are integrated in a laminated body in which a plurality of dielectric layers are laminated.

摘要翻译： 一种发送输出控制装置，包括：定向耦合器，其将来自高输出放大器的放大的发送信号的一部分分支; 以及检测器，其检测所述分支传输信号的一部分; 其中所述定向耦合器和所述检测器集成在层压体中，其中层叠有多个电介质层。

公开(公告)号：US06480708B1

公开(公告)日：2002-11-12

申请号：US09522204

申请日：2000-03-09

申请人： Koji Tanaka ,  Toshifumi Oida

发明人： Koji Tanaka ,  Toshifumi Oida

IPC分类号： H04B106

CPC分类号： H01P1/227

摘要： A compact variable attenuator, composite variable attenuator, and mobile communication apparatus capable of variably controlling attenuation continuously. The variable attenuator includes a first comb line comprising first and second lines which are electromagnetically coupled with a coupling coefficient M, a second comb line comprising third and fourth lines which are electromagnetically coupled with a coupling coefficient M, and first and second diodes connected to the third and fourth lines of the second comb line. A first terminal is connected to one end of the first line and a second terminal is connected to one end of the second line. The first and second diodes are connected between one end of each of the third and fourth lines and a ground with their anodes connected to one end of each of the third and fourth lines, respectively. First and second control terminals for turning the first and second diodes on and off are connected at the junction of other end of the first line and the other end of the third line and at the junction of the other end of the second line and the other end of the fourth line via resistors.

摘要翻译： 能够连续地可变地控制衰减的紧凑型可变衰减器，复合可变衰减器和移动通信装置。 所述可变衰减器包括第一梳状线，其包括与耦合系数M电磁耦合的第一和第二线，包括与耦合系数M电磁耦合的第三和第四线的第二梳状线以及连接到所述耦合系数M的第一和第二二极管 第二梳线的第三和第四线。 第一端子连接到第一线路的一端，第二端子连接到第二线路的一端。 第一和第二二极管分别连接在第三和第四线中的每一个的一端和分别与第三和第四线中的每一根的一端相连的阳极的地。 用于使第一和第二二极管导通和断开的第一和第二控制端子连接在第一线路的另一端和第三线路的另一端的接合处，并且在第二线路的另一端和另一端子的接合处 第四行的末端通过电阻。

公开(公告)号：US06034640A

公开(公告)日：2000-03-07

申请号：US53550

申请日：1998-04-01

申请人： Toshifumi Oida ,  Teruhisa Tsuru ,  Yoshihiro Yoshimoto ,  Harufumi Mandai

发明人： Toshifumi Oida ,  Teruhisa Tsuru ,  Yoshihiro Yoshimoto ,  Harufumi Mandai

IPC分类号： H01Q23/00 ,  H01Q1/24 ,  H01Q1/36 ,  H01Q1/38 ,  H01Q5/00 ,  H01Q9/00 ,  H01Q9/04 ,  H01Q9/14 ,  H04B1/18 ,  H04B1/38 ,  H04B1/3822

CPC分类号： H01Q9/145 ,  H01Q1/362 ,  H01Q1/38 ,  H01Q5/50 ,  H01Q9/0442

摘要： The invention provides an antenna device, comprising: an antenna body including a conductor, an equivalent circuit of said conductor comprising an inductive component and a resistive component in a series connection, wherein a frequency adjusting circuit including at least a parallel circuit of a switching element and a passive element is connected to said conductor of said antenna body. The antenna body is connected in series with said frequency adjusting circuit.The invention enable to provide a compact antenna device for use in a mobile communication apparatus that performs transmission and reception on frequencies in a wide range.

摘要翻译： 本发明提供一种天线装置，包括：天线体，包括导体，所述导体的等效电路包括串联连接中的感应部件和电阻部件，其中频率调节电路至少包括开关元件的并联电路 并且无源元件连接到所述天线体的所述导体。 天线体与所述频率调整电路串联连接。 本发明能够提供一种在宽范围内的频率上进行发送和接收的移动通信装置中使用的紧凑型天线装置。

公开(公告)号：US6028568A

公开(公告)日：2000-02-22

申请号：US208223

申请日：1998-12-09

申请人： Kenji Asakura ,  Toshifumi Oida ,  Harufumi Mandai

发明人： Kenji Asakura ,  Toshifumi Oida ,  Harufumi Mandai

IPC分类号： H01Q1/36 ,  H01Q1/38 ,  H01Q1/40 ,  H01Q7/00 ,  H01Q9/30 ,  H01Q9/36 ,  H01Q9/42 ,  H01Q1/24

CPC分类号： H01Q1/38 ,  H01Q1/362

摘要： The invention provides a chip-antenna, comprising: a base member including a mounting surface and made of at least one of dielectric ceramic and magnetic ceramic; at least two conductors disposed within said base member or on a surface of said base member, at least a portion of said conductors being substantially perpendicular to the mounting surface of said base member; a feeding electrode for applying a voltage to said conductors and disposed on the surface of said base member; a ground electrode disposed at least one on the surface of and within said base member; one of said conductors being served as a first conductor, one end of which is connected to said feeding electrode; the rest of said conductor being served as a second conductor, one end of which are connected to said ground electrode; and the other end of said first conductor and the other end of said second conductor being connected.

摘要翻译： 本发明提供了一种芯片天线，包括：基座构件，包括安装表面，由介电陶瓷和磁性陶瓷中的至少一种制成; 至少两个导体，其设置在所述基座构件内或所述基座构件的表面上，所述导体的至少一部分基本上垂直于所述基座构件的安装表面; 用于向所述导体施加电压并设置在所述基底构件的表面上的馈电电极; 接地电极，其设置在所述基底构件的表面上和内部的至少一个上; 所述导体中的一个被用作第一导体，其一端连接到所述馈电电极; 所述导体的其余部分被用作第二导体，其一端连接到所述接地电极; 并且所述第一导体的另一端和所述第二导体的另一端连接。