公开(公告)号：US09696711B2

公开(公告)日：2017-07-04

申请号：US14232980

申请日：2012-07-12

申请人： Teruo Asakawa ,  Hirofumi Yamaguchi ,  Supika Mashiro ,  Toshihiko Iijima ,  Hirokazu Narisawa ,  Kou Fujimura

发明人： Teruo Asakawa ,  Hirofumi Yamaguchi ,  Supika Mashiro ,  Toshihiko Iijima ,  Hirokazu Narisawa ,  Kou Fujimura

IPC分类号： G06F19/00 ,  G04F1/00 ,  H01L21/00 ,  G05B19/402 ,  G05B19/418

CPC分类号： G05B19/402 ,  G05B19/41865 ,  G05B2219/2609 ,  G05B2219/32078 ,  G05B2219/32272 ,  G05B2219/32277 ,  G05B2219/32311 ,  G05B2219/49202 ,  Y02P90/14 ,  Y02P90/20 ,  Y02P90/28 ,  Y02P90/285

摘要： A processing indicating device to improve the efficiency of processing on an object. The device includes a first communication unit which communicates information with a plurality of processing devices for processing the object and a second communication unit which communicates information with a conveyance controlling device controlling conveying of the object to the plurality of processing devices. An arrival time predicting unit predicts on the basis of information received by the second communication unit, the time when the conveying device arrives at one of the processing devices. In addition, a finish time predicting unit receives information and predicts the time when the processing on the object in the one processing device finishes. A processing indicating unit causes processing control information that orders the execution of device state improvement treatment to be transmitted to the one processing device on the basis of the predicted respective times.

公开(公告)号：US20140358271A1

公开(公告)日：2014-12-04

申请号：US14232980

申请日：2012-07-12

申请人： Teruo Asakawa ,  Hirofumi Yamaguchi ,  Supika Mashiro ,  Toshihiko Iijima ,  Hirokazu Narisawa ,  Kou Fujimura

发明人： Teruo Asakawa ,  Hirofumi Yamaguchi ,  Supika Mashiro ,  Toshihiko Iijima ,  Hirokazu Narisawa ,  Kou Fujimura

IPC分类号： G05B19/402

CPC分类号： G05B19/402 ,  G05B19/41865 ,  G05B2219/2609 ,  G05B2219/32078 ,  G05B2219/32272 ,  G05B2219/32277 ,  G05B2219/32311 ,  G05B2219/49202 ,  Y02P90/14 ,  Y02P90/20 ,  Y02P90/28 ,  Y02P90/285

摘要： A processing indicating device to improve the efficiency of processing on an object. The device includes a first communication unit which communicates information with a plurality of processing devices for processing the object and a second communication unit which communicates information with a conveyance controlling device controlling conveying of the object to the plurality of processing devices. An arrival time predicting unit predicts on the basis of information received by the second communication unit, the time when the conveying device arrives at one of the processing devices. In addition, a finish time predicting unit receives information and predicts the time when the processing on the object in the one processing device finishes. A processing indicating unit causes processing control information that orders the execution of device state improvement treatment to be transmitted to the one processing device on the basis of the predicted respective times.

摘要翻译： 一种处理指示装置，用于提高对物体的处理效率。 该装置包括：第一通信单元，其与多个用于处理该对象的处理装置进行通信;第二通信单元，其与传送控制装置通信信息，该输送控制装置控制对该多个处理装置的传送。 到达时间预测单元基于由第二通信单元接收的信息，传送设备到达处理设备之一的时间来预测。 此外，完成时间预测单元接收信息并预测在一个处理设备中的对象的处理完成的时间。 处理指示单元基于预测的各个时间，使得命令执行设备状态改善处理的处理控制信息被发送到一个处理设备。

公开(公告)号：US08319510B2

公开(公告)日：2012-11-27

申请号：US12817876

申请日：2010-06-17

申请人： Kazuhito Ogino ,  Toshihiko Iijima ,  Kaori Arai

发明人： Kazuhito Ogino ,  Toshihiko Iijima ,  Kaori Arai

IPC分类号： G01R31/00 ,  G01R31/20

CPC分类号： G01R31/2887

摘要： Disclosed is a pre-alignment method and a computer-readable medium storing a pre-alignment program capable of reducing pre-alignment time and transfer time of a semiconductor wafer. The pre-alignment method includes steps of rotating the semiconductor wafer transferred from a receiving unit onto a rotating body of a pre-alignment mechanism by a transfer mechanism, calculating and storing an eccentric value between a shaft center of the rotating body and a center of the semiconductor wafer detected by a sensor of the pre-alignment mechanism, correcting a positional deviation of the semiconductor wafer on the rotating body by the transfer mechanism according to the calculated eccentric value, when the calculated eccentric value exceeds a predetermined value, and estimating the eccentric value when conducting the pre-alignment operation for a succeeding semiconductor wafer, based on the eccentric value accumulated during the pre-alignment operation conducted for semiconductor wafers prior to the succeeding semiconductor wafer.

摘要翻译： 公开了一种预定位方法和存储能够减少半导体晶片的预对准时间和传送时间的预对准程序的计算机可读介质。 预对准方法包括以下步骤：通过传送机构将从接收单元传送的半导体晶片旋转到预对准机构的旋转体上，计算并存储旋转体的轴心与中心之间的偏心值 由所述预对准机构的传感器检测出的所述半导体晶片，当计算出的偏心值超过预定值时，根据计算出的偏心值，通过所述传送机构校正所述半导体晶片在所述旋转体上的位置偏差， 基于在后续半导体晶片之前对半导体晶片进行的预对准操作期间累积的偏心值进行对后续半导体晶片的预对准操作时的偏心值。

公开(公告)号：US08121723B2

公开(公告)日：2012-02-21

申请号：US11524280

申请日：2006-09-21

申请人： Toshihiko Iijima ,  Shinya Shimizu

发明人： Toshihiko Iijima ,  Shinya Shimizu

IPC分类号： G06F7/00

CPC分类号： H01L21/6732 ,  H01L21/67276 ,  H01L21/67736

摘要： A substrate transfer system includes a substrate storing apparatus for storing therein one or more substrates; at least one substrate processing apparatus for performing a predetermined processing on the substrate; and a substrate transfer apparatus for transferring the substrate by moving between the substrate storing apparatus and the substrate processing apparatus, the substrate transfer apparatus including at least one substrate transfer unit for supporting the substrate, unloading the substrate from the substrate storing apparatus or the substrate processing apparatus, and loading the substrate into the substrate storing apparatus of the substrate processing apparatus. The substrate transfer apparatus moves while supporting the substrate by the substrate transfer unit.

摘要翻译： 基板转印系统包括用于在其中存储一个或多个基板的基板存储装置; 至少一个基板处理装置，用于对所述基板执行预定处理; 以及基板转印装置，用于通过在基板收纳装置和基板处理装置之间移动来转印基板，基板转印装置包括至少一个用于支撑基板的基板转移单元，从基板存储装置卸载基板或基板处理 装置，并将基板装载到基板处理装置的基板存储装置中。 基板转印装置在通过基板转印单元支撑基板的同时移动。

公开(公告)号：US20100321052A1

公开(公告)日：2010-12-23

申请号：US12817876

申请日：2010-06-17

申请人： Kazuhito OGINO ,  Toshihiko IIJIMA ,  Kaori ARAI

发明人： Kazuhito OGINO ,  Toshihiko IIJIMA ,  Kaori ARAI

IPC分类号： G01R31/00

CPC分类号： G01R31/2887

摘要： Disclosed is a pre-alignment method and a computer-readable medium storing a pre-alignment program capable of reducing pre-alignment time and transfer time of a semiconductor wafer. The pre-alignment method includes steps of rotating the semiconductor wafer transferred from a receiving unit onto a rotating body of a pre-alignment mechanism by a transfer mechanism, calculating and storing an eccentric value between a shaft center of the rotating body and a center of the semiconductor wafer detected by a sensor of the pre-alignment mechanism, correcting a positional deviation of the semiconductor wafer on the rotating body by the transfer mechanism according to the calculated eccentric value, when the calculated eccentric value exceeds a predetermined value, and estimating the eccentric value when conducting the pre-alignment operation for a succeeding semiconductor wafer, based on the eccentric value accumulated during the pre-alignment operation conducted for semiconductor wafers prior to the succeeding semiconductor wafer.

摘要翻译： 公开了一种预对准方法和存储能够减少半导体晶片的预对准时间和传送时间的预对准程序的计算机可读介质。 预对准方法包括以下步骤：通过传送机构将从接收单元传送的半导体晶片旋转到预对准机构的旋转体上，计算并存储旋转体的轴心与中心之间的偏心值 由所述预对准机构的传感器检测出的所述半导体晶片，当计算出的偏心值超过预定值时，根据计算出的偏心值，通过所述传送机构校正所述半导体晶片在所述旋转体上的位置偏差， 基于在后续半导体晶片之前对半导体晶片进行的预对准操作期间累积的偏心值进行对后续半导体晶片的预对准操作时的偏心值。

公开(公告)号：US07826918B2

公开(公告)日：2010-11-02

申请号：US11374998

申请日：2006-03-15

申请人： Toshihiko Iijima ,  Shinya Shimizu ,  Kaori Ishihara

发明人： Toshihiko Iijima ,  Shinya Shimizu ,  Kaori Ishihara

IPC分类号： G06F7/00

CPC分类号： H01L21/67736 ,  G01R31/2893 ,  G05B19/41815 ,  G05B2219/31002 ,  G05B2219/31216 ,  G05B2219/33198 ,  G05B2219/45031 ,  H01L21/67265 ,  Y02P90/08 ,  Y02P90/285 ,  Y10S414/135

摘要： A transfer method employs a transfer system including a semiconductor handling device and an automatic transfer device. The semiconductor handling device includes a first transfer mechanism and a first optically coupled parallel I/O communications interface. The automatic transfer device includes a second transfer mechanism and a second optically coupled parallel I/O communications interface. The transfer method includes a successive transfer notifying step wherein the automatic transfer device and the semiconductor handling device notify each other that a successive transfer is possible via an optical communications between the first and the second optically coupled parallel I/O communications interface in case where a plurality of objects to be processed are able to be successively transferred one by one between the first and the second transfer mechanism; and a successive transfer step wherein the objects are transferred one by one between the first and the second transfer mechanism.

摘要翻译： 转印方法采用包括半导体处理装置和自动转印装置的转印系统。 半导体处理装置包括第一传送机构和第一光耦合并行I / O通信接口。 自动传送装置包括第二传送机构和第二光耦合并行I / O通信接口。 传送方法包括连续传送通知步骤，其中自动传送设备和半导体处理设备通过彼此通过第一和第二光耦合并行I / O通信接口之间的光通信可以进行连续的传送， 要处理的多个物体能够在第一和第二传送机构之间逐个地依次传送; 以及连续传送步骤，其中物体在第一和第二传送机构之间逐个传送。

公开(公告)号：US07457680B2

公开(公告)日：2008-11-25

申请号：US11550433

申请日：2006-10-18

申请人： Shuji Akiyama ,  Toshihiko Iijima ,  Hiroki Hosaka

发明人： Shuji Akiyama ,  Toshihiko Iijima ,  Hiroki Hosaka

IPC分类号： G06F19/00 ,  G06F7/00 ,  G05B19/18

CPC分类号： H01L21/67276 ,  H01L21/67775 ,  H01L21/67778 ,  Y10S414/135

摘要： The present invention relates to conveyance method for transporting a plurality of unprocessed/processed objects between an automatic transporting device (AGV) and a semiconductor manufacturing device (prober). The prober has a load port to/from which the objects are delivered from/to the AGV. The method comprises the steps of: making a communication between the AGV and the prober to decide respective timings of deliveries of the objects to/from the load port; and transporting the objects between the AGV and the prober via the load port, with the timings of the deliveries of the objects to/from the load port shifted from each other by using a holding site for provisionally holding the object. The holding site is at least one of components of the AGV and the prober other than the load port.

摘要翻译： 本发明涉及用于在自动传送装置（AGV）和半导体制造装置（探测器）之间传送多个未处理物体的传送方法。 探测器具有一个负载端口，从该对象从AGV传送对象。 该方法包括以下步骤：在AGV与探测器之间进行通信，以确定与负载端口之间传送物体的相应定时; 并且经由装载端口在AGV和探测器之间传送对象，其中通过使用用于临时保持物体的保持位置，物体到/从装载端口的传送的定时彼此偏移。 持有站点至少是AGV的组件和负载端口以外的探测器。

公开(公告)号：US20070062446A1

公开(公告)日：2007-03-22

申请号：US11524280

申请日：2006-09-21

申请人： Toshihiko Iijima ,  Shinya Shimizu

发明人： Toshihiko Iijima ,  Shinya Shimizu

IPC分类号： B05C13/00 ,  B05C13/02 ,  B05C21/00 ,  B05C1/00

CPC分类号： H01L21/6732 ,  H01L21/67276 ,  H01L21/67736

摘要： A substrate transfer system includes a substrate storing apparatus for storing therein one or more substrates; at least one substrate processing apparatus for performing a predetermined processing on the substrate; and a substrate transfer apparatus for transferring the substrate by moving between the substrate storing apparatus and the substrate processing apparatus, the substrate transfer apparatus including at least one substrate transfer unit for supporting the substrate, unloading the substrate from the substrate storing apparatus or the substrate processing apparatus, and loading the substrate into the substrate storing apparatus of the substrate processing apparatus. The substrate transfer apparatus moves while supporting the substrate by the substrate transfer unit.

摘要翻译： 基板转印系统包括用于在其中存储一个或多个基板的基板存储装置; 至少一个基板处理装置，用于对所述基板执行预定处理; 以及基板转印装置，用于通过在基板收纳装置和基板处理装置之间移动来转印基板，基板转印装置包括至少一个用于支撑基板的基板转移单元，从基板存储装置卸载基板或基板处理 装置，并将基板装载到基板处理装置的基板存储装置中。 基板转印装置在通过基板转印单元支撑基板的同时移动。

公开(公告)号：US07458469B2

公开(公告)日：2008-12-02

申请号：US11227136

申请日：2005-09-16

申请人： Hiroki Hosaka ,  Toshihiko Iijima ,  Shinya Shimizu

发明人： Hiroki Hosaka ,  Toshihiko Iijima ,  Shinya Shimizu

IPC分类号： B65G49/07

CPC分类号： H01L21/67309 ,  Y10S414/137

摘要： In a substrate transfer apparatus, an adaptor unit 25 includes a box-shaped main body 40 having three open sides; and a plurality of stage arms 41 disposed in the main body 40, serving as substrate mounting members. Each of the stage arms 41 has a disc-shaped wafer supporting portion 411 disposed at an approximately central portion of the main body 40 and a flat body 412 disposed in the main body 40 so as not to interfere with the moving paths of transfer arms 241 and 341. Formed at a connecting portion of the wafer supporting portion 411 and the body 412 are cutout portions 413 for preventing interference between the stage arms 41 and two prongs of leading end portions of the transfer arms 241 and 341 introduced into the main body 40.

摘要翻译： 在基板输送装置中，适配器单元25包括具有三个开口侧的箱形主体40; 以及设置在主体40中的用作基板安装构件的多个平台臂41。 每个平台臂41具有设置在主体40的大致中央部的盘状晶片支撑部411和设置在主体40中的平坦体412，以便不干涉传送臂241的移动路径 在晶片支撑部分411和主体412的连接部分处形成切口部分413，用于防止台臂41与引入主体40的转移臂241和341的前端部分的两个尖头之间的干涉 。

公开(公告)号：US20060152211A1

公开(公告)日：2006-07-13

申请号：US11374998

申请日：2006-03-15

申请人： Toshihiko Iijima ,  Shinya Shimizu ,  Kaori Ishihara

发明人： Toshihiko Iijima ,  Shinya Shimizu ,  Kaori Ishihara

IPC分类号： G01R31/28

CPC分类号： H01L21/67736 ,  G01R31/2893 ,  G05B19/41815 ,  G05B2219/31002 ,  G05B2219/31216 ,  G05B2219/33198 ,  G05B2219/45031 ,  H01L21/67265 ,  Y02P90/08 ,  Y02P90/285 ,  Y10S414/135

摘要： A transfer method employs a transfer system including a semiconductor handling device and an automatic transfer device. The semiconductor handling device includes a first transfer mechanism and a first optically coupled parallel I/O communications interface. The automatic transfer device includes a second transfer mechanism and a second optically coupled parallel I/O communications interface. The transfer method includes a successive transfer notifying step wherein the automatic transfer device and the semiconductor handling device notify each other that a successive transfer is possible via an optical communications between the first and the second optically coupled parallel I/O communications interface in case where a plurality of objects to be processed are able to be successively transferred one by one between the first and the second transfer mechanism; and a successive transfer step wherein the objects are transferred one by one between the first and the second transfer mechanism.

摘要翻译： 转印方法采用包括半导体处理装置和自动转印装置的转印系统。 半导体处理装置包括第一传送机构和第一光耦合并行I / O通信接口。 自动传送装置包括第二传送机构和第二光耦合并行I / O通信接口。 传送方法包括连续传送通知步骤，其中自动传送设备和半导体处理设备通过彼此通过第一和第二光耦合并行I / O通信接口之间的光通信可以进行连续的传送， 要处理的多个物体能够在第一和第二传送机构之间逐个地依次传送; 以及连续传送步骤，其中物体在第一和第二传送机构之间逐个传送。