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    Wired circuit board and producing method thererof
    3.
    发明授权
    Wired circuit board and producing method thererof 有权
    有线电路板及其制造方法

    公开(公告)号：US08354597B2

    公开(公告)日：2013-01-15

    申请号：US12216511

    申请日：2008-07-07

    申请人： Takahiko Yokai ,  Toshiki Naito

    发明人： Takahiko Yokai ,  Toshiki Naito

    IPC分类号： H05K1/03 ,  G11B5/48 ,  H05K1/00

    CPC分类号： H05K1/05 ,  H05K1/056 ,  H05K3/44 ,  H05K2201/09745 ,  H05K2201/10416 ,  H05K2203/0323 ,  H05K2203/0369 ,  H05K2203/0723 ,  Y10T29/49124

    摘要： A wired circuit board includes a metal supporting board having at least one depressed portion, a conductive portion embedded in the at least one depressed portion and formed of a material having a higher conductivity than that of the metal supporting board, an insulating layer formed on the metal supporting board so as to cover the conductive portion, and a plurality of wires formed on the insulating layer in mutually spaced-apart relation so as to oppose to the conductive portion.

    摘要翻译： 布线电路板包括具有至少一个凹陷部分的金属支撑板，嵌入至少一个凹陷部分中的导电部分并且由具有比金属支撑板的导电性更高的导电性的材料形成，绝缘层形成在 金属支撑板以覆盖导电部分，并且以相互间隔的关系形成在绝缘层上以与导电部分相对的多个导线。

    OPTICAL WAVEGUIDE FOR TOUCH PANEL
    4.
    发明申请
    OPTICAL WAVEGUIDE FOR TOUCH PANEL 审中-公开
    用于触摸面板的光学波形

    公开(公告)号：US20120045170A1

    公开(公告)日：2012-02-23

    申请号：US13207926

    申请日：2011-08-11

    申请人： Naoki Shibata ,  Toshiki Naito

    发明人： Naoki Shibata ,  Toshiki Naito

    IPC分类号： G02B6/32

    CPC分类号： G06F3/0421 ,  G02B6/1245 ,  G02B6/138 ,  G02B6/30 ,  G02B2006/12102

    摘要： An optical waveguide for a touch panel is capable of causing light beams emitted from a light-emitting optical waveguide section to enter a light-receiving optical waveguide section even when warpage or distortion occurs. Edges of an over cladding layer covering an end surface of a core for emitting a light beams and an end surface of a core for receiving the light beams respectively are configured in the form of light-emitting and light-receiving lens portions each having an outwardly-bulging arcuately curved surface as seen in vertical sectional view. The light-emitting lens portion has one of the following configurations: a configuration in which a light beam emitted from the light-emitting lens portion is adapted to diffuse in the direction of the height of the light-emitting lens portion; and a configuration in which the height of the light-emitting lens portion is less than that of the light-receiving lens portion.

    摘要翻译： 即使发生翘曲或变形，用于触摸面板的光波导能够使从发光光波导部分发射的光束进入光接收光波导部分。 覆盖用于发射光束的芯的端面的上覆层的边缘和用于接收光束的芯的端面分别被配置为发光和光接收透镜部分的形式，每个透镜部分具有向外 如垂直剖视图所示，呈弧形弧形曲面。 发光透镜部分具有以下配置之一：从发光透镜部分发射的光束适于在发光透镜部分的高度方向上扩散的配置; 以及发光透镜部的高度小于受光透镜部的高度的结构。

    Suspension board with circuit
    6.
    发明授权
    Suspension board with circuit 有权
    悬挂板带电路

    公开(公告)号：US08014103B2

    公开(公告)日：2011-09-06

    申请号：US12289727

    申请日：2008-11-03

    申请人： Tetsuya Ohsawa ,  Toshiki Naito ,  Hirotoshi Iguchi

    发明人： Tetsuya Ohsawa ,  Toshiki Naito ,  Hirotoshi Iguchi

    IPC分类号： G11B5/48 ,  G11B5/60 ,  G11B21/21

    CPC分类号： G11B5/486

    摘要： A suspension board with circuit includes a metal supporting board, an insulating layer formed on the metal supporting board, a conductive layer formed on the insulating layer, and a pedestal for supporting a slider. The pedestal includes a lower pedestal made of the insulating layer, and formed in a continuous frame shape so as to surround a bonding surface of the metal supporting board to the slider, and an upper pedestal made of the conductive layer, and formed in a discontinuous frame shape on the lower pedestal.

    摘要翻译： 具有电路的悬挂板包括金属支撑板，形成在金属支撑板上的绝缘层，形成在绝缘层上的导电层和用于支撑滑块的基座。 基座包括由绝缘层制成的下基座，并且以连续的框架形状围绕金属支撑板与滑块的接合表面，以及由导电层制成的上基座，并形成为不连续的 框架形状在下底座上。

    Production method of a wired circuit board
    7.
    发明授权
    Production method of a wired circuit board 有权
    有线电路板的生产方法

    公开(公告)号：US07971353B2

    公开(公告)日：2011-07-05

    申请号：US12068502

    申请日：2008-02-07

    申请人： Yuichi Takayoshi ,  Kazushi Ichikawa ,  Toshiki Naito

    发明人： Yuichi Takayoshi ,  Kazushi Ichikawa ,  Toshiki Naito

    IPC分类号： H05K3/02 ,  H05K3/10

    CPC分类号： H05K1/0269 ,  H05K1/111 ,  H05K3/303 ,  H05K3/3452 ,  H05K2201/094 ,  H05K2201/09781 ,  H05K2201/09918 ,  H05K2203/163 ,  H05K2203/166 ,  Y02P70/611 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155

    摘要： A wired circuit board that can provide improved reliability on connection between the terminal portions and the external terminals while ensuring high productivity and cost reduction, and a production method thereof. After a conductive pattern 3 including terminal portions 6 to connect with external terminals 22 of an electronic component 21 and criterion marks 8 to determine presence or absence of an inhibitory portion 23 that may be formed due to formation of an insulating cover layer 4 to inhibit connection between the terminal portions 6 and the external terminals 22 are formed on the insulating base layer 2 simultaneously, the insulating cover layer 4 to cover the conductive pattern 3 and an opening 7 from which the terminal portions 6 and the criterion marks 8 are exposed is formed. Thereafter, the presence or absence of the inhibitory portion 23 is determined with reference to the criterion marks 8 exposed from the opening 7 of the insulating cover layer 4.

    摘要翻译： 一种能够在确保高生产率和成本降低的同时，在端子部与外部端子之间的连接方面提高可靠性的布线电路板及其制造方法。 在包括与电子部件21的外部端子22连接的端子部分6的导电图案3和标准标记8之间以确定由于形成绝缘覆盖层4而形成的抑制部分23的存在或不存在以禁止连接 在绝缘基底层2上同时形成端子部分6和外部端子22之间，覆盖导电图案3的绝缘覆盖层4和端子部分6和标准标记8暴露的开口7形成 。 此后，参照从绝缘覆盖层4的开口部7露出的基准标记8来确定抑制部23的有无。

    Wired circuit board, connection structure thereof, and connection method therefor
    8.
    发明申请
    Wired circuit board, connection structure thereof, and connection method therefor 审中-公开
    有线电路板及其连接结构及其连接方法

    公开(公告)号：US20110063816A1

    公开(公告)日：2011-03-17

    申请号：US12805939

    申请日：2010-08-25

    申请人： Hiroyuki Tanabe ,  Toshiki Naito

    发明人： Hiroyuki Tanabe ,  Toshiki Naito

    IPC分类号： H05K1/11 ,  H05K3/36

    CPC分类号： H05K3/363 ,  G11B5/484 ,  H05K1/056 ,  H05K1/117 ,  H05K3/366 ,  H05K2201/09381 ,  H05K2201/09727 ,  Y10T29/49126

    摘要： A wired circuit board includes a first wired circuit board provided with a first conductive pattern which has first terminals comprising placement surfaces for placing a meltable metal and first wires continuous with the first terminals; and a second wired circuit board provided with a second conductive pattern which has second terminals connected with the first terminals through the meltable metal and second wires continuous with the second terminals. The first wired circuit board and the second wired circuit board are arranged so that a first plane containing the first terminals and a second plane containing the second terminals are intersected with each other, and the placement surfaces are zoned so as to gradually widen toward the second terminals.

    摘要翻译： 布线电路板包括：第一布线电路板，其具有第一导电图案，第一导电图案具有第一端子，第一端子包括用于放置可熔金属的布置表面和与第一端子连续的第一布线; 以及设置有第二导电图案的第二布线电路板，其具有通过可熔融金属与第一端子连接的第二端子，以及与第二端子连续的第二导线。 第一布线电路板和第二布线电路板被布置成使得包含第一端子的第一平面和包含第二端子的第二平面彼此相交，并且放置表面被分区以朝向第二端子逐渐变宽 终端。