公开(公告)号：US08173759B2

公开(公告)日：2012-05-08

申请号：US12861283

申请日：2010-08-23

申请人： Tsutomu Kashiwagi ,  Toshio Shiobara

发明人： Tsutomu Kashiwagi ,  Toshio Shiobara

IPC分类号： C08L83/04 ,  C08G77/06

CPC分类号： C08G77/50 ,  C08G77/12 ,  C08G77/20 ,  C08L83/14 ,  C08L83/00

摘要： The present invention provides an organopolysilmethylene represented by the following general formula (1): wherein R1 is, independently of each other, a group selected from the group consisting of an unsubstituted or substituted monovalent hydrocarbon group having 1 to 10 carbon atoms, an alkoxy group, a hydroxy group, R3SiCH2— and R3SiO—, wherein R is, independently of each other, a group selected from the group consisting of an unsubstituted or substituted monovalent hydrocarbon group having 1 to 10 carbon atoms, an alkoxy group, and a hydroxy group, m is an integer of 1 to 100, and n is an integer of 1 to 100, and wherein at least two out of R1's and R's are an alkenyl group.

摘要翻译： 本发明提供由以下通式（1）表示的有机聚亚甲硅烷基：其中R 1彼此独立地为选自未取代或取代的碳原子数1〜10的一价烃基，烷氧基 ，羟基R3SiCH2-和R3SiO-，其中R是彼此独立地选自未取代或取代的具有1-10个碳原子的一价烃基，烷氧基和羟基的基团 m为1〜100的整数，n为1〜100的整数，R 1和R 2中的至少2个为烯基。

公开(公告)号：US08133957B2

公开(公告)日：2012-03-13

申请号：US12510491

申请日：2009-07-28

申请人： Yoshihira Hamamoto ,  Toshio Shiobara ,  Miyuki Wakao ,  Tsutomu Kashiwagi

发明人： Yoshihira Hamamoto ,  Toshio Shiobara ,  Miyuki Wakao ,  Tsutomu Kashiwagi

IPC分类号： C08G77/14

CPC分类号： C08G59/306 ,  C08G59/3254 ,  C08L83/06

摘要： A resin composition for encapsulating an optical semiconductor element that comprises components (A), (B) and (C) described below: (A) a branched silicone resin containing 2 to 6 epoxy groups, one or more (R1SiO3/2) units, two or more (R2R3SiO)n structures and 3 or more (R43-xR5xSiO1/2) units per molecule, in an amount of 100 parts by weight, wherein R1, R2, R3, R4 and R5 each represents a hydrogen atom, a hydroxyl group or a monovalent organic group of 1 to 20 carbon atoms which monovalent organic group may or may not contain an oxygen atom, provided that at least two of the R5 groups within each molecule represent an epoxy group and/or an epoxy group-containing non-aromatic group, n represents an integer of 3 to 20, and x represents an integer of 1 to 3, (B) a curing agent, in such an amount that a content of epoxy reactive groups in the component (B) ranges from 0.4 to 1.5 moles per 1 mol of epoxy groups within component (A), and (C) a curing catalyst, in an amount within a range from 0.01 to 3 parts by weight per 100 parts by weight of a combination of component (A) and component (B).

摘要翻译： 一种包含下述成分（A），（B）和（C）的光半导体元件的树脂组合物：（A）含有2〜6个环氧基的支链硅氧烷树脂，1个以上（R 1 SiO 3/2） 两个或多个（R 2 R 3 SiO）n结构和每个分子3个以上（R 43-x R 5 x SiO 1/2）单元，其量为100重量份，其中R 1，R 2，R 3，R 4和R 5各自表示氢原子，羟基 基团或1〜20个碳原子的一价有机基团，该一价有机基团可以含有或不含有氧原子，条件是每个分子中的至少两个R 5基团表示环氧基和/或含环氧基的非 - - 芳族基团，n表示3〜20的整数，x表示1〜3的整数，（B）固化剂，其量为组分（B）中环氧基反应性基团的含量为0.4 至组分（A）中每1mol环氧基团为1.5摩尔，和（C）固化催化剂，其量范围为fr 每100重量份组分（A）和组分（B）的组合0.01-1重量份。

公开(公告)号：US08124715B2

公开(公告)日：2012-02-28

申请号：US12938639

申请日：2010-11-03

申请人： Hayato Tanaka ,  Tsutomu Kashiwagi ,  Toshio Shiobara

发明人： Hayato Tanaka ,  Tsutomu Kashiwagi ,  Toshio Shiobara

IPC分类号： C08G77/20

CPC分类号： C08G77/26 ,  C07F7/0838 ,  C08G77/20 ,  H01L23/293 ,  H01L2924/0002 ,  H01L2924/00

摘要： The purpose of the present invention is to provide an isocyanuric ring-containing organopolysiloxane which can provide a cured product which can exploit the properties of a hydrosilylation (addition reaction), and is suitable for use in an encapsulating materials for an optical semiconductor. Thus, the present invention provides an organopolysiloxane having at least one isocyanuric ring in a molecule and vinyl siloxy groups at both terminals, and represented by the following formula (1): wherein X is, independently of each other, a monovalent organic group which does not have an unsaturated bond, R1 and R2 are, independently of each other, a methyl group or a phenyl group, and P is an integer of from 1 to 30.

摘要翻译： 本发明的目的是提供一种可以提供可以利用氢化硅烷化（加成反应）的性质的固化产物的异氰脲酸环的有机聚硅氧烷，并且适合用于光学半导体的封装材料。 因此，本发明提供了在分子中具有至少一个异氰脲酸酯环的两端的乙烯基甲硅烷氧基和由下式（1）表示的有机聚硅氧烷：其中，X彼此独立地为1价有机基， 不具有不饱和键，R 1和R 2彼此独立地为甲基或苯基，P为1〜30的整数。

公开(公告)号：US20120007119A1

公开(公告)日：2012-01-12

申请号：US13179200

申请日：2011-07-08

申请人： Toshio SHIOBARA ,  Tsutomu Kashiwagi

发明人： Toshio SHIOBARA ,  Tsutomu Kashiwagi

IPC分类号： H01L33/60

CPC分类号： H01L33/44 ,  H01L33/60 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2933/0025 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light-emitting semiconductor device includes a lead frame having lead electrodes, a reflector arranged with the lead frame, and a light-emitting semiconductor chip accommodated in the reflector and having electrodes connected to the lead electrodes by a flip-chip bonding method, wherein: a gap between the lead frame and the light-emitting semiconductor chip is filled with a cured underfill material, and a cured silicon oxide film of 0.05 to 10 μm thickness is formed covering surfaces of the light-emitting semiconductor chip and reflector.

摘要翻译： 发光半导体器件包括具有引线电极的引线框架，布置有引线框架的反射器和容纳在反射器中的发光半导体芯片，并且具有通过倒装芯片接合方法连接到引线电极的电极，其中 ：引线框与发光半导体芯片之间的间隙填充有固化的底部填充材料，并且形成厚度为0.05至10μm的固化的氧化硅膜覆盖表面的发光半导体芯片和反射器。

公开(公告)号：US08057906B2

公开(公告)日：2011-11-15

申请号：US11529312

申请日：2006-09-29

申请人： Tsutomu Kashiwagi ,  Toshio Shiobara ,  Masanobu Sato ,  Koki Matsumoto

发明人： Tsutomu Kashiwagi ,  Toshio Shiobara ,  Masanobu Sato ,  Koki Matsumoto

IPC分类号： B32B9/04

CPC分类号： C08J7/047 ,  C08J2383/04 ,  C08J2483/00 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/16195 ,  Y10T428/31663 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A method of reducing surface tackiness of a silicone rubber cured product is provided. The method includes coating the surface of a cured product of a curable silicone rubber composition, which has a molar ratio within the composition of hydrogen atoms bonded to silicon atoms relative to alkenyl groups bonded to silicon atoms of 1.0 or greater, and which, following curing, exhibits a type A hardness prescribed in JIS K6253 of no more than 20, with a curable silicone resin layer which, following curing, exhibits a type D hardness prescribed in JIS K6253 of 30 or greater; and subsequently curing the silicone resin to form a cured resin layer with a thickness of no more than 0.5 mm. Adhesion of dirt to the surface can be prevented.

摘要翻译： 提供降低硅橡胶固化产物的表面粘性的方法。 该方法包括将可固化的硅橡胶组合物的固化产物的表面涂覆，该固化产物的摩尔比在与硅原子键合的氢原子的组成中相对于键合到硅原子的链烯基为1.0或更大，并且其在固化之后 表现出JIS K6253规定为不大于20的A型硬度，其中固化后的固化性有机硅树脂层表现出JIS K6253规定的D型硬度为30以上; 然后固化硅树脂以形成厚度不大于0.5mm的固化树脂层。 可以防止污垢附着到表面。

公开(公告)号：US20110241048A1

公开(公告)日：2011-10-06

申请号：US13074317

申请日：2011-03-29

申请人： Yusuke TAGUCHI ,  Toshio Shiobara

发明人： Yusuke TAGUCHI ,  Toshio Shiobara

IPC分类号： H01L33/60 ,  F21V7/22 ,  C08K3/22 ,  C08L63/00 ,  C08L83/04

CPC分类号： H01L33/60 ,  H01L24/97 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01012 ,  H01L2924/01029 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2933/0058 ,  H01L2924/00014 ,  H01L2924/00

摘要： Disclosed herein is a resin composition including 100 parts by weight of an organic resin and 50 to 1,000 parts by weight of an inorganic filler, wherein 10 to 100% of the inorganic filler is composed of an oxide of a rare earth element.

摘要翻译： 本发明公开了一种树脂组合物，其包含100重量份的有机树脂和50至1,000重量份的无机填料，其中10至100重量％的无机填料由稀土元素的氧化物组成。

公开(公告)号：US20110046319A1

公开(公告)日：2011-02-24

申请号：US12860682

申请日：2010-08-20

申请人： Manabu Ueno ,  Toshio Shiobara ,  Tsutomu Kashiwagi

发明人： Manabu Ueno ,  Toshio Shiobara ,  Tsutomu Kashiwagi

IPC分类号： C08L83/06 ,  C08G77/16

CPC分类号： C08G77/50 ,  C08G77/16 ,  C08G77/18 ,  C08G77/24 ,  C08L83/14 ,  Y10T428/31663 ,  C08L83/00

摘要： The present invention provides an organopolysilmethylene represented by the following general formula (1): wherein R1 is, independently of each other, a group selected from the group consisting of an unsubstituted or substituted monovalent hydrocarbon group having 1 to 10 carbon atoms other than an alkenyl group, an alkoxy group, a hydroxy group and a halogen atom; R2 is, independently of each other, a group selected from the group consisting of an unsubstituted or substituted monovalent hydrocarbon group having 1 to 10 carbon atoms other than an alkenyl group, an alkoxy group, a hydroxy group, a halogen atom and (R1)3SiCH2—, wherein R3 is, independently of each other, a group selected from the group consisting of a hydrogen atom and an alkyl group having 1 to 4 carbon atoms; k is an integer of 1 to 100; and n is an integer of 1 to 1000; and having, in a molecule, at least two out of alkoxy groups, hydroxy groups and halogen atoms bonded to one or more silicon atoms.

摘要翻译： 本发明提供由以下通式（1）表示的有机聚亚甲硅烷基：其中R 1彼此独立地为选自除烯基以外的未取代或取代的碳原子数1〜10的一价烃基 基团，烷氧基，羟基和卤素原子; R2彼此独立地选自除烯基，烷氧基，羟基，卤素原子以外的未取代或取代的碳原子数1〜10的一价烃基和（R1） 3SiCH 2 - ，其中R 3彼此独立地为选自氢原子和具有1至4个碳原子的烷基的基团; k为1〜100的整数， n为1〜1000的整数。 并且在一个分子中具有与一个或多个硅原子键合的烷氧基，羟基和卤素原子中的至少两个。

公开(公告)号：US07858198B2

公开(公告)日：2010-12-28

申请号：US12078909

申请日：2008-04-08

申请人： Tsutomu Kashiwagi ,  Toshio Shiobara

发明人： Tsutomu Kashiwagi ,  Toshio Shiobara

IPC分类号： B32B9/04 ,  C08L83/04

CPC分类号： C08L83/04 ,  C08G77/12 ,  C08G77/16 ,  C08G77/20 ,  C08G77/70 ,  H01L33/56 ,  Y10T428/31663 ,  C08L83/00

摘要： An addition curable adhesive silicone composition containing a phosphor dispersed uniformly therein is provided. The dispersive state of the phosphor remains stable over time. The composition, in an uncured state at room temperature, is either a solid or a semisolid, and is therefore easy to handle, and is suited to an adhesive silicone composition sheet which is able to be formed easily on an LED chip using a conventional assembly apparatus.

摘要翻译： 提供含有均匀分布的荧光体的可固化粘合性有机硅组合物。 荧光体的分散状态随时间保持稳定。 在室温未固化状态下的组合物是固体或半固体，因此易于处理，并且适用于能够使用常规组合容易地在LED芯片上形成的粘合性有机硅组合物片材 仪器。

公开(公告)号：US07683152B2

公开(公告)日：2010-03-23

申请号：US11131197

申请日：2005-05-18

申请人： Hideki Akiba ,  Nobuhiro Ichiroku ,  Toshio Shiobara

发明人： Hideki Akiba ,  Nobuhiro Ichiroku ,  Toshio Shiobara

IPC分类号： C08G77/24

CPC分类号： C08G77/455 ,  C08G73/106 ,  C08L63/00 ,  C08L79/08 ,  C08L83/10 ,  C08L2666/20 ,  C08L2666/22 ,  C08L2666/14

摘要： A partial block polyimide-polysiloxane copolymer is provided comprising repeat unit structures having structural formulae (1) and (2) wherein X is an aromatic or aliphatic ring-containing tetravalent organic radical, Y1 is a diamine residue, Y2 is a diaminosiloxane residue, Y1 and Y2 are contained in the copolymer in amounts of 99-20 mol % and 1-80 mol %, respectively, L and m each are an integer of 2-50. The copolymer has good adhesion to substrates, moisture-proof reliability and a low modulus of elasticity.

摘要翻译： 提供部分嵌段聚酰亚胺 - 聚硅氧烷共聚物，其包含具有结构式（1）和（2）的重复单元结构，其中X是含芳族或脂族环的四价有机基团，Y1是二胺残基，Y2是二氨基硅氧烷残基，Y1 和Y2分别以99-20摩尔％和1-80摩尔％的量包含在共聚物中，L和m各自为2-50的整数。 共聚物对基材的粘合性好，防潮可靠性和低弹性模量。

公开(公告)号：US20100001311A1

公开(公告)日：2010-01-07

申请号：US12496460

申请日：2009-07-01

申请人： Yusuke Taguchi ,  Toshio Shiobara

发明人： Yusuke Taguchi ,  Toshio Shiobara

IPC分类号： H01L33/00 ,  C08L63/00

CPC分类号： H01L23/49861 ,  C08G77/16 ,  C08G77/18 ,  C08L63/00 ,  C08L63/06 ,  C08L83/04 ,  C08L83/06 ,  H01L23/295 ,  H01L23/296 ,  H01L33/56 ,  H01L2924/0002 ,  C08L83/00 ,  C08L2666/14 ,  C08L2666/22 ,  H01L2924/00

摘要： A heat-curable silicone resin-epoxy resin composition that is ideal as a premolded package for a high-brightness LED or solar cell. The composition contains (A) a heat-curable silicone resin, (B) a combination of a triazine derivative epoxy resin and an acid anhydride, or a prepolymer obtained by reaction of them, (C) an inorganic filler, and (D) a curing accelerator. The composition exhibits excellent curability, and yields a uniform cured product that displays excellent retention of heat resistance and light resistance over long periods of time, and suffers minimal yellowing.

摘要翻译： 作为用于高亮度LED或太阳能电池的预先包装的理想的可热固化的有机硅树脂 - 环氧树脂组合物。 该组合物含有（A）可热固化的有机硅树脂，（B）三嗪衍生物环氧树脂和酸酐的组合，或通过它们反应获得的预聚物，（C）无机填料和（D） 固化促进剂。 该组合物表现出优异的固化性，并且产生均匀的固化产物，其在长时间内显示出优异的耐热性和耐光性保持性，并且几乎不发黄。