摘要:
A system to remove heat from a heat-generating electronic component within a computer chassis and to contain electromagnetic radiation from traversing high-throughput vents in a bezel that forms a portion of the chassis containment structure comprises a heat sink having a fin structure with an inlet face, an outlet face and interconnected air channels therethrough, a base to engage the component and to transfer heat from the component to the fin structure, wherein the inlet face of the fin structure is disposed proximate the vents to block electromagnetic radiation from traversing the vents. In one embodiment, a heat pipe or a spreader bar moves heat from a base engaging a component distal from the bezel to the fin structure having an air inlet face proximal to the vents.
摘要:
The present invention can include an automated method controlling the fan speed of computer system cooling fans with altitude and/or fluid density data from a centralized sensor. Such a method can utilize a centralized sensor to determine the altitude/fluid density within an enclosed area. The centralized sensor can be positioned so as to be unaffected by extraneous activities within the enclosed area. The determined altitude/fluid density can be conveyed to a computer system containing one or more cooling fans. The computer system can be located within the enclosed area. Then, the computer system can determine the need for adjusting the speed of the cooling fans based on the altitude/fluid density. When the need for adjustment exists, the speed of the cooling fans can be adjusted in accordance with the altitude/fluid density.
摘要:
A method for electromagnetically shielding the end of a rigid cable (10) containing a large number of conductors to provide increased bending flexibility is disclosed along with a ground strap assembly (24). Ground strap assembly (24) is designed to shield a cable (10) that consists of a plurality of insulated conductors (18) surrounded by one or more conducting shields (14) (16) and outer insulating sheath (12). A portion of the outer insulating sheath (12) is removed to expose a protruding portion of conducting shield (14). The protruding portion of conducting shield (14) is folded back along a remaining portion of outer insulating sheath (12) thereby exposing the ends of the conductors. Ground strap assembly (24) comprises a braided conducting ground strap (26) that has a cable end portion (32) extending to a central portion (34). Central portion (34) extends to grounding portion (36). The cable end portion (32) is coupled to the protruding portion of the conducting shield (14) of cable (10) that has been folded back. Such coupling shields a portion of the exposed ends of the conductors (18). The central portion (34) of ground strap (26) has an exit opening to allow the exposed conductors (18) to exit from the ground strap (26) thereby allowing the conductors (18) to be flexibly maneuvered and attached to one or more connection points in an electronic device. A ground strap terminal (28) is coupled to the grounding portion (36) of ground strap (26) allowing the ground strap (26) to be attached to ground, thereby shielding the end of the cable from electromagnetic interference.
摘要:
Computer chassis configured for controlled airflow including at least one component board; a segmented curtain suspended across a region of airflow in the computer chassis above the component board; and at least one component mounted on the component board displacing at least one segment of the segmented curtain creating an airflow channel under the displaced segment. Segmented curtains for controlling airflow in a computer chassis including one or more segments capable of being displaced by components mounted on a component board in the computer chassis; and one or more fasteners for suspending the segmented curtain across a region of airflow in the computer chassis. Controlling airflow in a computer chassis including inserting a component board into the computer chassis; displacing, a segment of a segmented curtain thereby creating an airflow channel; and providing airflow through the airflow channel created by the displacement of the segment of the segmented curtain.
摘要:
A heat sink comprises a first thermally conductive base having a first face to thermally engage a heat-generating electronic component and a second thermally conductive base with a plurality of fins on a first face and a second face to engage the first base. The fins on the second base are positionable in either of two orientations relative to the heat-generating electronic component to which the heat sink is coupled. The fins are selectively placed in the orientation that best utilizes the direction of air flow available to the heat sink. The orientable fins of the heat sink afford flexibility in arranging the heat-generating electronic component on a circuit board or in arranging a circuit board within a computer chassis.
摘要:
Computer chassis configured for controlled airflow including at least one component board; a segmented curtain suspended across a region of airflow in the computer chassis above the component board; and at least one component mounted on the component board displacing at least one segment of the segmented curtain creating an airflow channel under the displaced segment. Segmented curtains for controlling airflow in a computer chassis including one or more segments capable of being displaced by components mounted on a component board in the computer chassis; and one or more fasteners for suspending the segmented curtain across a region of airflow in the computer chassis. Controlling airflow in a computer chassis including inserting a component board into the computer chassis; displacing, a segment of a segmented curtain thereby creating an airflow channel; and providing airflow through the airflow channel created by the displacement of the segment of the segmented curtain.
摘要:
An assembly for routing fiber optic cables transversely across an electronics housing interior. The electronics housing interior supports circuit boards, some of which are optically coupled to the fiber optic cables requiring routing. The assembly includes a support member for coupling with the housing interior, and this support member is pivotally coupled to a fiber optic cable retaining member. The fiber optic cable retaining member routes the fiber optic cables across the housing interior, and it can be pivoted away from the electronics housing, enabling one to remove a circuit board for service, testing, or replacement without handling of or with minimal handling of individual fiber optic cables. A cover is pivotally coupled to the fiber optic cable retaining member, and it can be opened to facilitate the routing of the fiber optic cables or closed to protect the routed fiber optic cables.
摘要:
A heat sink to remove heat from a processor within a chassis to air moving through a fin structure on the heat sink. An embodiment of the heat sink comprises a heat bus engaging the processor to conduct heat from the processor to a fin structure having interconnected, repeating cellular air channels. A U-shaped heat bus comprises a base and first and second legs extending therefrom connected to opposite sides of the fin structure. An embodiment of the heat bus has a solid conductive core to conductively transfer heat from the processor through the base and the first and second legs to sides of the fin structure. Alternately, an embodiment of the heat bus has a hollow core containing a fluid to evaporatively transfer heat from the processor through the base and the first and second legs to sides of the fin structure.
摘要:
A heat sink comprises a first thermally conductive base having a first face to thermally engage a heat-generating electronic component and a second thermally conductive base with a plurality of fins on a first face and a second face to engage the first base. The fins on the second base are positionable in either of two orientations relative to the heat-generating electronic component to which the heat sink is coupled. The fins are selectively placed in the orientation that best utilizes the direction of air flow available to the heat sink. The orientable fins of the heat sink afford flexibility in arranging the heat-generating electronic component on a circuit board or in arranging a circuit board within a computer chassis.