公开(公告)号：US08063486B2

公开(公告)日：2011-11-22

申请号：US11748111

申请日：2007-05-14

申请人： Koichi Hirano ,  Tsukasa Shiraishi ,  Seiichi Nakatani ,  Tatsuo Ogawa

发明人： Koichi Hirano ,  Tsukasa Shiraishi ,  Seiichi Nakatani ,  Tatsuo Ogawa

IPC分类号： H01L23/48

CPC分类号： H05K1/0271 ,  H01L23/49811 ,  H01L24/12 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13011 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/351 ,  H05K1/09 ,  H05K1/111 ,  H05K3/243 ,  H05K2201/0338 ,  H05K2201/0355 ,  H05K2201/09109 ,  H01L2924/00 ,  H01L2224/05599

摘要： A circuit board 1 having a base material 10 and an electrode 11 formed on at least one main surface of the base material 10 includes an easy peeling portion 12 formed in at least one of an inner portion and a side portion of the electrode 11, with the adhesive strength between the electrode 11 and the easy peeling portion 12 being less than the adhesive strength between the electrode 11 and the base material 10. A circuit board that has high connection reliability and enables narrow pitch mounting thereby can be provided.

摘要翻译： 具有基材10和形成在基材10的至少一个主表面上的电极11的电路板1包括形成在电极11的内部和侧部中的至少一个中的易剥离部分12， 电极11和容易剥离部12之间的粘合强度小于电极11与基材10之间的粘合强度。可以提供具有高连接可靠性并能实现窄间距安装的电路板。

公开(公告)号：US07963310B2

公开(公告)日：2011-06-21

申请号：US12940803

申请日：2010-11-05

申请人： Tsukasa Shiraishi ,  Seiichi Nakatani

发明人： Tsukasa Shiraishi ,  Seiichi Nakatani

IPC分类号： B32B37/00

CPC分类号： H05K3/3484 ,  B01D21/283 ,  H01L21/563 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/28 ,  H01L24/31 ,  H01L24/742 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/11005 ,  H01L2224/1152 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81903 ,  H01L2224/83886 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H05K3/323 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/0285 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A liquid resin in which conductive particles are dispersed is supplied to between a circuit substrate and a semiconductor chip disposed so as to face each other and an ultrasonic wave having an amplitude in a perpendicular direction to a surface of the circuit substrate to generate a standing wave in a resin. Then, the conductive particles dispersed in the resin are captured at nodes of the standing wave to form connection bodies of aggregation of the conductive particles between connection terminals of the semiconductor chip and terminals of the circuit substrate. Thus, the semiconductor chip is mounted on the circuit substrate via the connection bodies. The terminals are arrayed so as to be spaced apart from one another by half a wavelength of the standing wave and each of the nodes of the standing wave are generated at a position between the terminals in the resin.

摘要翻译： 将分散有导电粒子的液态树脂供给到电路基板与设置为彼此相对的半导体芯片之间，并且具有与电路基板的表面垂直的振幅的超声波，以产生驻波 在树脂中。 然后，分散在树脂中的导电颗粒在驻波的节点处被捕获，以在半导体芯片的连接端子和电路基板的端子之间形成导电颗粒的聚集的连接体。 因此，半导体芯片经由连接体安装在电路基板上。 端子排列成彼此间隔开驻波的一半波长，并且在树脂中的端子之间的位置处产生驻波的每个节点。

公开(公告)号：US20110049218A1

公开(公告)日：2011-03-03

申请号：US12940803

申请日：2010-11-05

申请人： Tsukasa SHIRAISHI ,  Seiichi Nakatani

发明人： Tsukasa SHIRAISHI ,  Seiichi Nakatani

IPC分类号： B23K1/08

CPC分类号： H05K3/3484 ,  B01D21/283 ,  H01L21/563 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/28 ,  H01L24/31 ,  H01L24/742 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/11005 ,  H01L2224/1152 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81903 ,  H01L2224/83886 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H05K3/323 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/0285 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A liquid resin in which conductive particles are dispersed is supplied to between a circuit substrate and a semiconductor chip disposed so as to face each other and an ultrasonic wave having an amplitude in a perpendicular direction to a surface of the circuit substrate to generate a standing wave in a resin. Then, the conductive particles dispersed in the resin are captured at nodes of the standing wave to form connection bodies of aggregation of the conductive particles between connection terminals of the semiconductor chip and terminals of the circuit substrate. Thus, the semiconductor chip is mounted on the circuit substrate via the connection bodies. The terminals are arrayed so as to be spaced apart from one another by half a wavelength of the standing wave and each of the nodes of the standing wave are generated at a position between the terminals in the resin.

摘要翻译： 将分散有导电粒子的液态树脂供给到电路基板与设置为彼此相对的半导体芯片之间，并且具有与电路基板的表面垂直的振幅的超声波，以产生驻波 在树脂中。 然后，分散在树脂中的导电颗粒在驻波的节点处被捕获，以在半导体芯片的连接端子和电路基板的端子之间形成导电颗粒的聚集的连接体。 因此，半导体芯片经由连接体安装在电路基板上。 端子排列成彼此间隔开驻波的一半波长，并且在树脂中的端子之间的位置处产生驻波的每个节点。

公开(公告)号：US20050163982A1

公开(公告)日：2005-07-28

申请号：US11039778

申请日：2005-01-24

申请人： Masahiro Ono ,  Tsukasa Shiraishi

发明人： Masahiro Ono ,  Tsukasa Shiraishi

IPC分类号： H01L21/56 ,  H01L21/60 ,  H01L23/498 ,  H05K3/32 ,  B32B3/00

CPC分类号： H01L24/83 ,  H01L21/563 ,  H01L23/49811 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/31 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/1329 ,  H01L2224/13318 ,  H01L2224/13339 ,  H01L2224/13344 ,  H01L2224/13347 ,  H01L2224/13355 ,  H01L2224/13357 ,  H01L2224/1336 ,  H01L2224/13364 ,  H01L2224/13369 ,  H01L2224/13386 ,  H01L2224/1339 ,  H01L2224/13444 ,  H01L2224/16225 ,  H01L2224/29082 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81101 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K3/321 ,  Y10T156/1056 ,  Y10T428/24917 ,  Y10T428/24983 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/29347 ,  H01L2224/29344 ,  H01L2224/29339 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/2936 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/29318 ,  H01L2224/29444 ,  H01L2224/05599

摘要： The invention is intended for providing a semiconductor package structure which prevents degradation in characteristics of a semiconductor device, and breakage of interconnections, when the semiconductor device is packaged on a circuit substrate. In the package structure having the semiconductor device mounted on the circuit substrate, bump electrodes of the semiconductor device are placed on input/output terminal electrodes of the circuit substrate and are electrically and mechanically connected thereto by bonding with a conductive adhesive, and the semiconductor device is bonded and fixed to the circuit substrate by a resin film formed previously on a surface of a main body of the circuit substrate. The structure does no damage to a semiconductor functional part and to interconnections, and allows mounting with a lower load as compared to structures using conventional anisotropic conductive films and the like.

摘要翻译： 本发明旨在提供一种当将半导体器件封装在电路基板上时，防止半导体器件的特性劣化以及互连断裂的半导体封装结构。 在具有安装在电路基板上的半导体器件的封装结构中，半导体器件的突起电极被放置在电路基板的输入/输出端子电极上，并通过与导电粘合剂结合而电连接和机械连接，半导体器件 通过预先形成在电路基板的主体的表面上的树脂膜粘结固定在电路基板上。 与使用常规的各向异性导电膜等的结构相比，该结构不会损坏半导体功能部件和互连，并且允许以较低的负载进行安装。

公开(公告)号：US20120029453A1

公开(公告)日：2012-02-02

申请号：US13147265

申请日：2010-02-01

申请人： Yuki Noda ,  Mitsuhiro Wada ,  Tsukasa Shiraishi

发明人： Yuki Noda ,  Mitsuhiro Wada ,  Tsukasa Shiraishi

IPC分类号： A61L15/18

CPC分类号： A61F13/53 ,  A61F2013/530569

摘要： In an absorbent article 1, an absorber 30 is arranged between a liquid-permeable topsheet 10 and a liquid-impermeable backsheet 20, and the absorber 30 includes electrolyte particles as a hygroscopic material 70. This enables exhibition of a sufficient hygroscopicity during wearing and more surely suppress a discomfort of a wearer due to sweatiness or tackiness.

摘要翻译： 在吸收性物品1中，吸收体30配置在透液性顶片10和不透液性底片20之间，吸收体30包含作为吸湿材料70的电解质粒子。这样可以在穿着时展现充分的吸湿性， 肯定地抑制由于汗水或粘性引起的穿着者的不适。

公开(公告)号：US20100331801A1

公开(公告)日：2010-12-30

申请号：US12742986

申请日：2008-11-06

申请人： Yusuke Kawakami ,  Tsukasa Shiraishi

发明人： Yusuke Kawakami ,  Tsukasa Shiraishi

IPC分类号： A61F13/15

CPC分类号： A61F13/15 ,  A61F13/4751 ,  A61F13/4756 ,  A61F13/49

摘要： According to an absorptive article (disposable diaper) 10 of the present invention, an absorber (absorptive structure) 12 is provided with a first region 55 disposed on an internal surface sheet 41 side and having a higher content ratio of the superabsorptive polymer than a content ratio of the hydrophilic fiber, a second region 56 disposed on an external surface sheet 42 side and having a lower content ratio of the superabsorptive polymer than the content ratio of the superabsorptive polymer in the first region and a higher content ratio of the hydrophilic fiber than the content ratio of the hydrophilic fiber in the first region, and a space that penetrates from the external surface sheet 42 side of the second region 56 to the first region 55, and that can be entered by the superabsorptive polymer that is swollen by absorbing a body fluid in the first region 55.

摘要翻译： 根据本发明的吸收性物品（一次性尿布）10，吸收体（吸收结构体）12具有设置在内表面片41侧的第一区域55，并且超吸收性聚合物的含有率高于含量 亲水性纤维的比例，设置在外表面片42侧的第二区域56，超吸收性聚合物的含量比低于第一区域中的超吸收性聚合物的含有比例，并且亲水性纤维的含有比例高于 第一区域中的亲水性纤维的含有比例和从第二区域56的外表面片材侧42向第一区域55贯通的空间，并且可以通过吸收吸收性聚合物而膨胀的超吸收性聚合物进入 第一区域55中的体液。

公开(公告)号：US07850803B2

公开(公告)日：2010-12-14

申请号：US11783750

申请日：2007-04-11

申请人： Tsukasa Shiraishi ,  Seiichi Nakatani

发明人： Tsukasa Shiraishi ,  Seiichi Nakatani

IPC分类号： B32B37/00

CPC分类号： H05K3/3484 ,  B01D21/283 ,  H01L21/563 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/28 ,  H01L24/31 ,  H01L24/742 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/11005 ,  H01L2224/1152 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81903 ,  H01L2224/83886 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H05K3/323 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/0285 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A liquid resin in which conductive particles are dispersed is supplied to between a circuit substrate and a semiconductor chip disposed so as to face each other and an ultrasonic wave having an amplitude in a perpendicular direction to a surface of the circuit substrate to generate a standing wave in a resin. Then, the conductive particles dispersed in the resin are captured at nodes of the standing wave to form connection bodies of aggregation of the conductive particles between connection terminals of the semiconductor chip and terminals of the circuit substrate. Thus, the semiconductor chip is mounted on the circuit substrate via the connection bodies. The terminals are arrayed so as to be spaced apart from one another by half a wavelength of the standing wave and each of the nodes of the standing wave are generated at a position between the terminals in the resin.

摘要翻译： 将分散有导电粒子的液态树脂供给到电路基板与设置为彼此相对的半导体芯片之间，并且具有与电路基板的表面垂直的振幅的超声波，以产生驻波 在树脂中。 然后，分散在树脂中的导电颗粒在驻波的节点处被捕获，以在半导体芯片的连接端子和电路基板的端子之间形成导电颗粒的聚集的连接体。 因此，半导体芯片经由连接体安装在电路基板上。 端子排列成彼此间隔开驻波的一半波长，并且在树脂中的端子之间的位置处产生驻波的每个节点。

公开(公告)号：US20090085227A1

公开(公告)日：2009-04-02

申请号：US11914581

申请日：2006-05-09

申请人： Tsukasa Shiraishi ,  Seiichi Nakatani ,  Seiji Karashima ,  Koichi Hirano ,  Takashi Kitae ,  Yoshihisa Yamashita ,  Takashi Ichiryu

发明人： Tsukasa Shiraishi ,  Seiichi Nakatani ,  Seiji Karashima ,  Koichi Hirano ,  Takashi Kitae ,  Yoshihisa Yamashita ,  Takashi Ichiryu

IPC分类号： H01L23/488 ,  H01L21/60

CPC分类号： H01L21/563 ,  H01L23/552 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/06505 ,  H01L2224/13099 ,  H01L2224/1403 ,  H01L2224/14505 ,  H01L2224/16225 ,  H01L2224/27013 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/83007 ,  H01L2224/83051 ,  H01L2224/83101 ,  H01L2224/83136 ,  H01L2224/83139 ,  H01L2224/83205 ,  H01L2224/83801 ,  H01L2224/83888 ,  H01L2224/9201 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/3025 ,  H05K3/303 ,  H05K3/323 ,  H05K3/3436 ,  H05K3/3484 ,  H05K2201/10568 ,  H05K2201/10977 ,  H05K2201/2036 ,  H05K2203/083 ,  H05K2203/087 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/01047 ,  H01L2924/00014 ,  H01L2224/13111

摘要： A flip chip mounting body in which a circuit substrate having a plurality of connection terminals and an electronic part (semiconductor chip) having a plurality of electrode terminals are aligned face to face with each other, with a resin composition composed of solder powder, a resin and a convection additive being sandwiched in between, while a means such as spacers is interposed in between so as to provide a uniform gap between the two parts, or the electronic part (semiconductor chip) is placed inside a plate-shaped member having two or more protruding portions, so that the solder powder is allowed to move through boiling of the convection additive and to be self-aggregated to form a solder layer, thereby electrically connecting the connection terminals and the electrode terminals; and a mounting method for such a mounting body.

摘要翻译： 一种倒装芯片安装体，其中具有多个连接端子的电路基板和具有多个电极端子的电子部件（半导体芯片）彼此面对面地对准，其中树脂组合物由焊料粉末，树脂 并且夹在其间的对流添加剂，同时诸如间隔物的装置插入其间，以便在两个部件之间提供均匀的间隙，或者将电子部件（半导体芯片）放置在具有两个或 更多的突出部分，使得焊料粉末能够通过对流添加剂的沸腾而移动并且自聚集形成焊料层，从而电连接连接端子和电极端子; 以及这种安装体的安装方法。

公开(公告)号：US20080186045A1

公开(公告)日：2008-08-07

申请号：US12023144

申请日：2008-01-31

申请人： Yoji UEDA ,  Tsukasa SHIRAISHI ,  Yositake HAYASHI ,  Rikiya OKIMOTO

发明人： Yoji UEDA ,  Tsukasa SHIRAISHI ,  Yositake HAYASHI ,  Rikiya OKIMOTO

IPC分类号： G01R31/02 ,  H05K1/00 ,  H05K3/36

CPC分类号： H05K3/4638 ,  H05K1/0268 ,  H05K1/116 ,  H05K3/4623 ,  H05K2201/0969 ,  H05K2201/09781 ,  Y10T29/49126

摘要： An inspection mark structure has an inspection via hole, which is provided in substrate sheets to be heat-pressed constituting at least two layers of laminates; a round pattern electrode, which is formed on one main face side of the substrate sheet provided with the inspection via hole, and provided around the end face of the inspection via hole at such a predetermined distance as not to come into contact with the end face; and a conduction electrode, which is formed on the other main face side of the substrate sheet provided with the inspection via hole, and provided so as to be electrically connected with the end face of the inspection via hole.

摘要翻译： 检查标记结构具有检查通孔，其设置在构成至少两层层压体的被加热的基板中; 圆形图案电极，其形成在设置有检查通孔的基板的一个主面侧上，并且设置在检查通孔的端面周围以不与端面接触的预定距离 ; 以及导电电极，其形成在设置有检查通孔的基板的另一主面侧，并且设置成与检查通孔的端面电连接。

公开(公告)号：US20080011402A1

公开(公告)日：2008-01-17

申请号：US11783750

申请日：2007-04-11

申请人： Tsukasa Shiraishi ,  Seiichi Nakatani

发明人： Tsukasa Shiraishi ,  Seiichi Nakatani

IPC分类号： H01B13/00 ,  G10K11/36

CPC分类号： H05K3/3484 ,  B01D21/283 ,  H01L21/563 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/28 ,  H01L24/31 ,  H01L24/742 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/11005 ,  H01L2224/1152 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81903 ,  H01L2224/83886 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H05K3/323 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/0285 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A liquid resin in which conductive particles are dispersed is supplied to between a circuit substrate and a semiconductor chip disposed so as to face each other and an ultrasonic wave having an amplitude in a perpendicular direction to a surface of the circuit substrate to generate a standing wave in a resin. Then, the conductive particles dispersed in the resin are captured at nodes of the standing wave to form connection bodies of aggregation of the conductive particles between connection terminals of the semiconductor chip and terminals of the circuit substrate. Thus, the semiconductor chip is mounted on the circuit substrate via the connection bodies. The terminals are arrayed so as to be spaced apart from one another by half a wavelength of the standing wave and each of the nodes of the standing wave are generated at a position between the terminals in the resin.

摘要翻译： 将分散有导电粒子的液态树脂供给到电路基板与设置为彼此相对的半导体芯片之间，并且具有与电路基板的表面垂直的振幅的超声波，以产生驻波 在树脂中。 然后，分散在树脂中的导电颗粒在驻波的节点处被捕获，以在半导体芯片的连接端子和电路基板的端子之间形成导电颗粒的聚集的连接体。 因此，半导体芯片经由连接体安装在电路基板上。 端子排列成彼此间隔开驻波的一半波长，并且在树脂中的端子之间的位置处产生驻波的每个节点。