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1.发明授权公开(公告)号：US09208942B2
公开(公告)日：2015-12-08
申请号：US13233569
申请日：2011-09-15
申请人： Vinit Singh , Christine A. Frysz
发明人： Vinit Singh , Christine A. Frysz
CPC分类号： H01F38/14 , H01F17/0013 , H04B5/0075 , H05K1/165
摘要： A structure for wireless communication having a plurality of conductor layers, an insulator layer separating each of the conductor layers, and at least one connector connecting two of the conductor layers wherein an electrical resistance is reduced when an electrical signal is induced in the resonator at a predetermined frequency.
摘要翻译： 一种用于具有多个导体层的无线通信结构，分隔每个导体层的绝缘体层以及连接两个导体层的至少一个连接器，其中在谐振器中感应电信号时电阻减小 预定频率。
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2.发明授权System using multi-layer wire structure for high efficiency wireless communication 有权系统采用多层线结构进行高效无线通信公开(公告)号：US08860545B2
公开(公告)日：2014-10-14
申请号：US13233663
申请日：2011-09-15
申请人： Vinit Singh , Christine A. Frysz
发明人： Vinit Singh , Christine A. Frysz
IPC分类号： H01F5/00
CPC分类号： H01Q1/38 , A61N1/0553 , A61N1/3605 , A61N1/37229 , A61N1/3756 , A61N1/3787 , B33Y80/00 , H01F5/00 , H01F5/003 , H01F7/06 , H01F17/00 , H01F17/0006 , H01F17/0013 , H01F17/02 , H01F21/005 , H01F27/28 , H01F27/2804 , H01F27/30 , H01F27/42 , H01F29/02 , H01F38/14 , H01F41/00 , H01F41/04 , H01F41/041 , H01F41/32 , H01F2027/2809 , H01Q7/00 , H01R43/00 , H01R43/20 , H02J7/025 , H02J17/00 , H02J50/12 , H02P13/00 , H03H7/01 , H04B5/0031 , H04B5/0037 , H04B5/0062 , H04B5/0068 , H04B5/0075 , H05B6/06 , H05B6/1245 , H05B6/36 , H05B6/362 , H05K1/165 , H05K2201/0352 , Y02B40/126 , Y10T29/49005 , Y10T29/4902 , Y10T29/4908 , Y10T29/49117 , Y10T29/49155 , Y10T29/49169 , Y10T29/49195
摘要： A structure for wireless communication having a plurality of conductor layers, an insulator layer separating each of the conductor layers, and at least one connector connecting two of the conductor layers wherein an electrical resistance is reduced when an electrical signal is induced in the resonator at a predetermined frequency.
摘要翻译： 一种用于具有多个导体层的无线通信结构，分隔每个导体层的绝缘体层以及连接两个导体层的至少一个连接器，其中在谐振器中感应电信号时电阻减小 预定频率。
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3.发明授权System comprising a multi-layer-multi-turn structure for high efficiency wireless communication 有权包括用于高效率无线通信的多层多匝结构的系统公开(公告)号：US08653927B2
公开(公告)日：2014-02-18
申请号：US13233624
申请日：2011-09-15
申请人： Vinit Singh , Christine A. Frysz
发明人： Vinit Singh , Christine A. Frysz
IPC分类号： H01F5/00
CPC分类号： H01Q1/38 , A61N1/0553 , A61N1/3605 , A61N1/37229 , A61N1/3756 , A61N1/3787 , B33Y80/00 , H01F5/00 , H01F5/003 , H01F7/06 , H01F17/00 , H01F17/0006 , H01F17/0013 , H01F17/02 , H01F21/005 , H01F27/28 , H01F27/2804 , H01F27/30 , H01F27/42 , H01F29/02 , H01F38/14 , H01F41/00 , H01F41/04 , H01F41/041 , H01F41/32 , H01F2027/2809 , H01Q7/00 , H01R43/00 , H01R43/20 , H02J7/025 , H02J17/00 , H02J50/12 , H02P13/00 , H03H7/01 , H04B5/0031 , H04B5/0037 , H04B5/0062 , H04B5/0068 , H04B5/0075 , H05B6/06 , H05B6/1245 , H05B6/36 , H05B6/362 , H05K1/165 , H05K2201/0352 , Y02B40/126 , Y10T29/49005 , Y10T29/4902 , Y10T29/4908 , Y10T29/49117 , Y10T29/49155 , Y10T29/49169 , Y10T29/49195
摘要： A structure for wireless communication having a plurality of conductor layers, an insulator layer separating each of the conductor layers, and at least one connector connecting two of the conductor layers wherein an electrical resistance is reduced when an electrical signal is induced in the resonator at a predetermined frequency.
摘要翻译： 一种用于具有多个导体层的无线通信结构，分隔每个导体层的绝缘体层以及连接两个导体层的至少一个连接器，其中在谐振器中感应电信号时电阻减小 预定频率。
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4.发明申请公开(公告)号：US20130067738A1
公开(公告)日：2013-03-21
申请号：US13233735
申请日：2011-09-15
申请人： Vinit Singh , Christine A. Frysz , Matthew Geary , Eitan Babcock , Justin Derbas
发明人： Vinit Singh , Christine A. Frysz , Matthew Geary , Eitan Babcock , Justin Derbas
IPC分类号： H01R43/00
CPC分类号： H01Q1/38 , A61N1/0553 , A61N1/3605 , A61N1/37229 , A61N1/3756 , A61N1/3787 , B33Y80/00 , H01F5/00 , H01F5/003 , H01F7/06 , H01F17/00 , H01F17/0006 , H01F17/0013 , H01F17/02 , H01F21/005 , H01F27/28 , H01F27/2804 , H01F27/30 , H01F27/42 , H01F29/02 , H01F38/14 , H01F41/00 , H01F41/04 , H01F41/041 , H01F41/32 , H01F2027/2809 , H01Q7/00 , H01R43/00 , H01R43/20 , H02J7/025 , H02J17/00 , H02J50/12 , H02P13/00 , H03H7/01 , H04B5/0031 , H04B5/0037 , H04B5/0062 , H04B5/0068 , H04B5/0075 , H05B6/06 , H05B6/1245 , H05B6/36 , H05B6/362 , H05K1/165 , H05K2201/0352 , Y02B40/126 , Y10T29/49005 , Y10T29/4902 , Y10T29/4908 , Y10T29/49117 , Y10T29/49155 , Y10T29/49169 , Y10T29/49195
摘要： A structure for wireless communication having a plurality of conductor layers, an insulator layer separating each of the conductor layers, and at least one connector connecting two of the conductor layers wherein an electrical resistance is reduced when an electrical signal is induced in the resonator at a predetermined frequency.
摘要翻译： 一种用于具有多个导体层的无线通信结构，分隔每个导体层的绝缘体层以及连接两个导体层的至少一个连接器，其中在谐振器中感应电信号时电阻减小 预定频率。
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公开(公告)号：US09439287B2
公开(公告)日：2016-09-06
申请号：US13233751
申请日：2011-09-15
申请人： Vinit Singh , Christine A. Frysz
发明人： Vinit Singh , Christine A. Frysz
CPC分类号： H05K1/16 , H05K3/4644
摘要： A structure for wireless communication having a plurality of conductor layers, an insulator layer separating each of the conductor layers, and at least one connector connecting two of the conductor layers wherein an electrical resistance is reduced when an electrical signal is induced in the resonator at a predetermined frequency.
摘要翻译： 一种用于具有多个导体层的无线通信结构，分隔每个导体层的绝缘体层以及连接两个导体层的至少一个连接器，其中在谐振器中感应电信号时电阻减小 预定频率。
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公开(公告)号：US08567048B2
公开(公告)日：2013-10-29
申请号：US13233686
申请日：2011-09-15
申请人： Vinit Singh , Christine A. Frysz , Matthew Geary , Eitan Babcock , Justin Derbas
发明人： Vinit Singh , Christine A. Frysz , Matthew Geary , Eitan Babcock , Justin Derbas
IPC分类号： H01R43/00
CPC分类号： H01Q1/38 , A61N1/0553 , A61N1/3605 , A61N1/37229 , A61N1/3756 , A61N1/3787 , B33Y80/00 , H01F5/00 , H01F5/003 , H01F7/06 , H01F17/00 , H01F17/0006 , H01F17/0013 , H01F17/02 , H01F21/005 , H01F27/28 , H01F27/2804 , H01F27/30 , H01F27/42 , H01F29/02 , H01F38/14 , H01F41/00 , H01F41/04 , H01F41/041 , H01F41/32 , H01F2027/2809 , H01Q7/00 , H01R43/00 , H01R43/20 , H02J7/025 , H02J17/00 , H02J50/12 , H02P13/00 , H03H7/01 , H04B5/0031 , H04B5/0037 , H04B5/0062 , H04B5/0068 , H04B5/0075 , H05B6/06 , H05B6/1245 , H05B6/36 , H05B6/362 , H05K1/165 , H05K2201/0352 , Y02B40/126 , Y10T29/49005 , Y10T29/4902 , Y10T29/4908 , Y10T29/49117 , Y10T29/49155 , Y10T29/49169 , Y10T29/49195
摘要： A structure for wireless communication having a plurality of conductor layers, an insulator layer separating each of the conductor layers, and at least one connector connecting two of the conductor layers wherein an electrical resistance is reduced when an electrical signal is induced in the resonator at a predetermined frequency.
摘要翻译： 一种用于具有多个导体层的无线通信结构，分隔每个导体层的绝缘体层以及连接两个导体层的至少一个连接器，其中在谐振器中感应电信号时电阻减小 预定频率。
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7.发明申请公开(公告)号：US20130069843A1
公开(公告)日：2013-03-21
申请号：US13233538
申请日：2011-09-15
申请人： Vinit Singh , Christine A. Frysz
发明人： Vinit Singh , Christine A. Frysz
CPC分类号： A61B5/0015 , H01Q1/36 , H01Q1/38 , H01Q7/00
摘要： A structure for wireless communication having a plurality of conductor layers, an insulator layer separating each of the conductor layers, and at least one connector connecting two of the conductor layers wherein an electrical resistance is reduced when an electrical signal is induced in the resonator at a predetermined frequency.
摘要翻译： 一种用于具有多个导体层的无线通信结构，分隔每个导体层的绝缘体层以及连接两个导体层的至少一个连接器，其中在谐振器中感应电信号时电阻减小 预定频率。
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8.发明申请System Using Multi-Layer Wire Structure for High Efficiency Wireless Communication 有权使用多层线结构实现高效无线通信的系统公开(公告)号：US20130069750A1
公开(公告)日：2013-03-21
申请号：US13233663
申请日：2011-09-15
申请人： Vinit Singh , Christine A. Frysz
发明人： Vinit Singh , Christine A. Frysz
CPC分类号： H01Q1/38 , A61N1/0553 , A61N1/3605 , A61N1/37229 , A61N1/3756 , A61N1/3787 , B33Y80/00 , H01F5/00 , H01F5/003 , H01F7/06 , H01F17/00 , H01F17/0006 , H01F17/0013 , H01F17/02 , H01F21/005 , H01F27/28 , H01F27/2804 , H01F27/30 , H01F27/42 , H01F29/02 , H01F38/14 , H01F41/00 , H01F41/04 , H01F41/041 , H01F41/32 , H01F2027/2809 , H01Q7/00 , H01R43/00 , H01R43/20 , H02J7/025 , H02J17/00 , H02J50/12 , H02P13/00 , H03H7/01 , H04B5/0031 , H04B5/0037 , H04B5/0062 , H04B5/0068 , H04B5/0075 , H05B6/06 , H05B6/1245 , H05B6/36 , H05B6/362 , H05K1/165 , H05K2201/0352 , Y02B40/126 , Y10T29/49005 , Y10T29/4902 , Y10T29/4908 , Y10T29/49117 , Y10T29/49155 , Y10T29/49169 , Y10T29/49195
摘要： A structure for wireless communication having a plurality of conductor layers, an insulator layer separating each of the conductor layers, and at least one connector connecting two of the conductor layers wherein an electrical resistance is reduced when an electrical signal is induced in the resonator at a predetermined frequency.
摘要翻译： 一种用于具有多个导体层的无线通信结构，分隔每个导体层的绝缘体层以及连接两个导体层的至少一个连接器，其中在谐振器中感应电信号时电阻减小 预定频率。
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9.发明申请System Comprising a Multi-Layer-Multi-Turn Structure for High Efficiency Wireless Communication 有权包括用于高效无线通信的多层多匝结构的系统公开(公告)号：US20130069749A1
公开(公告)日：2013-03-21
申请号：US13233624
申请日：2011-09-15
申请人： Vinit Singh , Christine A. Frysz
发明人： Vinit Singh , Christine A. Frysz
CPC分类号： H01Q1/38 , A61N1/0553 , A61N1/3605 , A61N1/37229 , A61N1/3756 , A61N1/3787 , B33Y80/00 , H01F5/00 , H01F5/003 , H01F7/06 , H01F17/00 , H01F17/0006 , H01F17/0013 , H01F17/02 , H01F21/005 , H01F27/28 , H01F27/2804 , H01F27/30 , H01F27/42 , H01F29/02 , H01F38/14 , H01F41/00 , H01F41/04 , H01F41/041 , H01F41/32 , H01F2027/2809 , H01Q7/00 , H01R43/00 , H01R43/20 , H02J7/025 , H02J17/00 , H02J50/12 , H02P13/00 , H03H7/01 , H04B5/0031 , H04B5/0037 , H04B5/0062 , H04B5/0068 , H04B5/0075 , H05B6/06 , H05B6/1245 , H05B6/36 , H05B6/362 , H05K1/165 , H05K2201/0352 , Y02B40/126 , Y10T29/49005 , Y10T29/4902 , Y10T29/4908 , Y10T29/49117 , Y10T29/49155 , Y10T29/49169 , Y10T29/49195
摘要： A structure for wireless communication having a plurality of conductor layers, an insulator layer separating each of the conductor layers, and at least one connector connecting two of the conductor layers wherein an electrical resistance is reduced when an electrical signal is induced in the resonator at a predetermined frequency.
摘要翻译： 一种用于具有多个导体层的无线通信结构，分隔每个导体层的绝缘体层以及连接两个导体层的至少一个连接器，其中在谐振器中感应电信号时电阻减小 预定频率。
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10.发明授权Method of operation of a multi-layer-multi-turn structure for high efficiency wireless communication 有权一种用于高效率无线通信的多层多匝结构的操作方法公开(公告)号：US09232893B2
公开(公告)日：2016-01-12
申请号：US13233538
申请日：2011-09-15
申请人： Vinit Singh , Christine A. Frysz
发明人： Vinit Singh , Christine A. Frysz
CPC分类号： A61B5/0015 , H01Q1/36 , H01Q1/38 , H01Q7/00
摘要： A structure for wireless communication having a plurality of conductor layers, an insulator layer separating each of the conductor layers, and at least one connector connecting two of the conductor layers wherein an electrical resistance is reduced when an electrical signal is induced in the resonator at a predetermined frequency.
摘要翻译： 一种用于具有多个导体层的无线通信结构，分隔每个导体层的绝缘体层以及连接两个导体层的至少一个连接器，其中在谐振器中感应电信号时电阻减小 预定频率。
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