公开(公告)号：US08460971B2

公开(公告)日：2013-06-11

申请号：US12774811

申请日：2010-05-06

申请人： Wen-Hsiung Chang

发明人： Wen-Hsiung Chang

IPC分类号： H01L23/12

CPC分类号： H01L23/49579 ,  H01L21/561 ,  H01L23/3128 ,  H01L23/481 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L2224/12105 ,  H01L2924/01033 ,  H01L2924/014

摘要： Exemplary semiconductor device packaging structure and packaging method are provided. The packaging method uses an adhesive layer to bond multiple wafer pieces onto a first surface of a carrier substrate, each adjacent two of the wafer pieces having a gap formed therebetween for exposing a part of the adhesive layer. A packaging layer is filled in each of the gaps. At least one through silicon via is formed each of the wafer pieces to expose a bonding pad formed on an active surface of the wafer pieces. Redistribution circuit layers are formed on back surfaces of the respective wafer pieces and filled into the through silicon vias for electrical connection with the bonding pads. A sawing process is performed to saw starting from each of the packaging layers to a second surface of the carrier substrate, and thereby multiple semiconductor device packaging structures are obtained.

公开(公告)号：US20110294237A1

公开(公告)日：2011-12-01

申请号：US12788360

申请日：2010-05-27

申请人： Wen-Hsiung CHANG

发明人： Wen-Hsiung CHANG

IPC分类号： H01L21/66

CPC分类号： H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/76898 ,  H01L23/3114 ,  H01L24/05 ,  H01L24/13 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/83 ,  H01L24/97 ,  H01L27/14618 ,  H01L2221/68327 ,  H01L2224/0231 ,  H01L2224/02313 ,  H01L2224/02371 ,  H01L2224/02372 ,  H01L2224/0239 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/13024 ,  H01L2224/29187 ,  H01L2224/2919 ,  H01L2224/301 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2224/83 ,  H01L2224/92143 ,  H01L2224/92242 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15788 ,  H01L2924/00

摘要： In a packaging method of semiconductor device, firstly, a wafer including a number of dies is provided. The wafer has an active surface and a back surface. The active surface adheres to a carrier. Subsequently, a number of openings are formed in each of the dies. Then, an insulating layer is formed on the back surface and on the side walls of the openings. A metal layer is formed to cover the insulating layer and the bottoms of the openings. A pattern protective layer is formed to cover the metal layer and to expose the metal layer outside the openings. Afterwards, the carrier is removed and the wafer is sawed. Later, a transparent substrate having a number of package units is provided. A spacer is formed at peripheral of each of the package units. A number of good dies are choose from the dies and disposed on the spacer.

摘要翻译： 在半导体装置的封装方法中，首先，提供包含多个管芯的晶片。 晶片具有活性表面和背面。 活性表面粘附到载体上。 随后，在每个模具中形成多个开口。 然后，在开口的背面和侧壁上形成绝缘层。 形成金属层以覆盖绝缘层和开口的底部。 形成图案保护层以覆盖金属层并将金属层暴露于开口外部。 之后，移除载体并锯切晶片。 之后，提供具有多个封装单元的透明基板。 在每个包装单元的周边形成间隔物。 一些好的模具可以从模具中选择并放置在垫片上。

公开(公告)号：US08012797B2

公开(公告)日：2011-09-06

申请号：US12547063

申请日：2009-08-25

申请人： Chi-Chih Shen ,  Jen-Chuan Chen ,  Wen-Hsiung Chang ,  Chi-Chih Chu ,  Cheng-Yi Weng

发明人： Chi-Chih Shen ,  Jen-Chuan Chen ,  Wen-Hsiung Chang ,  Chi-Chih Chu ,  Cheng-Yi Weng

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L21/565 ,  H01L21/4853 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45664 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3511 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2224/45015 ,  H01L2924/207

摘要： In one embodiment, a manufacturing method includes: (1) applying a first electrically conductive material to an upper surface of a substrate to form first conductive bumps; (2) electrically connecting a semiconductor device to the upper surface of the substrate; (3) applying a molding material to form a molded structure covering the first conductive bumps and the semiconductor device, upper ends of the first conductive bumps being recessed below an upper surface of the molded structure; (4) forming openings adjacent to the upper surface of the molded structure, the openings exposing the upper ends of the first conductive bumps; (5) applying, through the openings, a second electrically conductive material to form second conductive bumps; and (6) forming cutting slits extending through the molded structure and the substrate.

摘要翻译： 在一个实施例中，制造方法包括：（1）将第一导电材料施加到衬底的上表面以形成第一导电凸块; （2）将半导体器件电连接到衬底的上表面; （3）施加模塑材料以形成覆盖所述第一导电凸块和所述半导体器件的模制结构，所述第一导电凸块的上端在所述模制结构的上表面下方凹入; （4）形成与模制结构的上表面相邻的开口，所述开口暴露第一导电凸块的上端; （5）通过所述开口施加第二导电材料以形成第二导电凸块; 和（6）形成延伸穿过模制结构和基底的切割狭缝。

公开(公告)号：US20110080661A1

公开(公告)日：2011-04-07

申请号：US12897956

申请日：2010-10-05

申请人： LI-TE KUO ,  CHIEN-LIANG CHEN ,  MEI-LING LAI ,  WEN-HSIUNG CHANG

发明人： LI-TE KUO ,  CHIEN-LIANG CHEN ,  MEI-LING LAI ,  WEN-HSIUNG CHANG

IPC分类号： G02B7/02 ,  B23P11/00

CPC分类号： G02B7/023 ,  G02B13/001 ,  G02B26/0875 ,  H04N5/23212 ,  Y10T29/49826

摘要： A lens displacement device includes a flexible piece, a fixed element and a mobile element. The flexible piece has a support, a flexible part and an oscillation absorber. The flexible part connects to the support and at least one gap exists between the flexible part and the support. The oscillation absorber is installed in the gap between the flexible part and the support. Moreover, the fixed element couples to the support of the flexible piece, and the mobile element couples to the flexible part of the flexible piece. Furthermore, the flexible part of the flexible piece is deformed in shape for providing a restoration force with the mobile element. A manufacturing process of the flexible piece is also disclosed.

摘要翻译： 透镜位移装置包括柔性件，固定元件和移动元件。 柔性件具有支撑件，柔性部件和振动吸收器。 柔性部分连接到支撑件，并且在柔性部件和支撑件之间存在至少一个间隙。 振动吸收器安装在柔性部件和支撑件之间的间隙中。 此外，固定元件连接到柔性件的支撑件，并且移动元件联接到柔性件的柔性部分。 此外，柔性片的柔性部分的形状变形，以提供与移动元件的恢复力。 还公开了柔性件的制造工艺。

公开(公告)号：US20100171205A1

公开(公告)日：2010-07-08

申请号：US12507305

申请日：2009-07-22

申请人： Kuang-Hsiung CHEN ,  Chi-Chih SHEN ,  Jen-Chuan CHEN ,  Wen-Hsiung CHANG ,  Hui-Shan CHANG ,  Pei-Yu HSU ,  Fa-Hao WU ,  Chen-Yu CHIA ,  Chi-Chih CHU ,  Cheng-Yi WENG ,  Ya-Wen HSU

发明人： Kuang-Hsiung CHEN ,  Chi-Chih SHEN ,  Jen-Chuan CHEN ,  Wen-Hsiung CHANG ,  Hui-Shan CHANG ,  Pei-Yu HSU ,  Fa-Hao WU ,  Chen-Yu CHIA ,  Chi-Chih CHU ,  Cheng-Yi WENG ,  Ya-Wen HSU

IPC分类号： H01L21/56 ,  H01L23/498 ,  H01L23/00

CPC分类号： H01L23/3128 ,  H01L21/565 ,  H01L23/49816 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45664 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2224/45015 ,  H01L2924/207

摘要： In one embodiment, a semiconductor device package includes: (1) a substrate unit; (2) connecting elements disposed adjacent to a periphery of the substrate unit and extending upwardly from an upper surface of the substrate unit; (3) a semiconductor device disposed adjacent to the upper surface of the substrate unit and electrically connected to the substrate unit; and (4) a package body disposed adjacent to the upper surface of the substrate unit and covering the semiconductor device. A lateral surface of the package body is substantially aligned with a lateral surface of the substrate unit. The package body defines openings that at least partially expose respective ones of the connecting elements. At least one of the connecting elements has a width WC, and at least one of the openings has a width WU adjacent to an upper surface of the package body, such that WU>WC.

摘要翻译： 在一个实施例中，半导体器件封装包括：（1）衬底单元; （2）连接元件，其邻近所述基板单元的周边设置并从所述基板单元的上表面向上延伸; （3）半导体器件，与所述衬底单元的上表面相邻并且电连接到所述衬底单元; 和（4）与衬底单元的上表面相邻并且覆盖半导体器件的封装体。 封装主体的侧表面基本上与衬底单元的侧表面对准。 包装体限定了至少部分地暴露相应的连接元件的开口。 连接元件中的至少一个具有宽度WC，并且至少一个开口具有与封装主体的上表面相邻的宽度WU，使得WU> WC。

公开(公告)号：US5722437A

公开(公告)日：1998-03-03

申请号：US754038

申请日：1996-12-03

申请人： Wen-Hsiung Chang

发明人： Wen-Hsiung Chang

IPC分类号： A45D8/00 ,  A45D8/24 ,  A45D8/26

CPC分类号： A45D8/24 ,  A45D2008/006

摘要： A hair clip includes a body, a decorative plate changeably fitting in a shallow recess on an upper surface of the body, and a conventional metal clip assembled together. The body has posts to fit in post holes of the metal clip to combine the both together. The decorative plate has projections to engage holes in the body so as to enable the decorative plate easily released for changing it with different colors and designs.

摘要翻译： 发夹包括主体，可变地装配在主体上表面上的浅凹槽中的装饰板和组装在一起的常规金属夹。 身体具有贴合金属夹子的孔中的柱以将两者结合在一起。 装饰板具有用于接合主体中的孔的突起，以便能够容易地将装饰板释放以用不同的颜色和设计改变装饰板。

公开(公告)号：US08563405B2

公开(公告)日：2013-10-22

申请号：US12774795

申请日：2010-05-06

申请人： Wen-Hsiung Chang

发明人： Wen-Hsiung Chang

IPC分类号： H01L21/00 ,  H01L21/44 ,  H01L21/50

CPC分类号： H01L21/76898 ,  H01L21/6835 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381

摘要： A method for manufacturing semiconductor device includes the following steps. First, a carrier substrate and a plurality of pieced segments of wafer are provided. Each of the pieced segments of wafer has an active surface and a back surface on opposite sides thereof. Further, there is at least a bonding pad disposed on the active surface. Next, an adhering layer is formed between the carrier substrate and the active surfaces of the pieced segments of wafer, so as to make the pieced segments of wafer adhere to the carrier substrate. Next, a through silicon via is formed in each of the pieced segments of wafer to electrically connect to the bonding pad correspondingly. Then, the pieced segments of wafer are separated from the carrier substrate.

摘要翻译： 一种制造半导体器件的方法包括以下步骤。 首先，提供载体基板和晶片的多个接头段。 晶片的每个接合段具有活性表面和在其相对侧上的后表面。 此外，至少存在设置在有源表面上的接合焊盘。 接下来，在载体基板和晶片的接合部分的活性表面之间形成粘合层，以使晶片的接头段粘附到载体基板上。 接下来，在晶片的每个接合段中形成贯通硅通孔，以相应地电连接到焊盘。 然后，晶片的接合部分与载体基板分离。

公开(公告)号：US20120049332A1

公开(公告)日：2012-03-01

申请号：US13181278

申请日：2011-07-12

申请人： Jen-Chuan Chen ,  Hui-Shan Chang ,  Wen-Hsiung Chang ,  Wei-Nung Chang

发明人： Jen-Chuan Chen ,  Hui-Shan Chang ,  Wen-Hsiung Chang ,  Wei-Nung Chang

IPC分类号： H01L23/58 ,  H01L21/82

CPC分类号： H01L25/0657 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06548 ,  H01L2225/06572 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2224/81 ,  H01L2924/00

摘要： A semiconductor package and method for making the same are provided, wherein a lower chip having a plurality of conductive structures is bonded to an upper surface of a package substrate and a plurality of matrix walls are formed on the upper surface for surrounding the lower chip, such that an overcoat layer covering the matrix walls and the lower chip can be approximately removed after performing a grinding process to the lower chip to expose a plurality of conductive vias of the lower chip. The cleaning step for removing the residue of overcoat layer can be omitted, and the processing yield and the processing efficiency can be improved. The semiconductor package and the method is particularly suitable for stacking a large dimensional upper chip on a relatively small dimensional lower chip.

摘要翻译： 提供一种半导体封装及其制造方法，其中具有多个导电结构的下部芯片被结合到封装衬底的上表面，并且在上表面上形成多个矩阵壁以围绕下部芯片， 使得覆盖矩阵壁和下部芯片的外涂层可以在对下部芯片进行研磨处理之后大致去除以暴露下部芯片的多个导电通孔。 可以省略除去外涂层残渣的清洗工序，可以提高加工量和加工效率。 该半导体封装和该方法特别适用于在相对较小尺寸的下部芯片上堆叠大尺寸上部芯片。

公开(公告)号：US08076765B2

公开(公告)日：2011-12-13

申请号：US12507305

申请日：2009-07-22

申请人： Kuang-Hsiung Chen ,  Chi-Chih Shen ,  Jen-Chuan Chen ,  Wen-Hsiung Chang ,  Hui-Shan Chang ,  Pei-Yu Hsu ,  Fa-Hao Wu ,  Chen-Yu Chia ,  Chi-Chih Chu ,  Cheng-Yi Weng ,  Ya-Wen Hsu

发明人： Kuang-Hsiung Chen ,  Chi-Chih Shen ,  Jen-Chuan Chen ,  Wen-Hsiung Chang ,  Hui-Shan Chang ,  Pei-Yu Hsu ,  Fa-Hao Wu ,  Chen-Yu Chia ,  Chi-Chih Chu ,  Cheng-Yi Weng ,  Ya-Wen Hsu

IPC分类号： H01L21/44 ,  H01L21/302 ,  H01L21/461

CPC分类号： H01L23/3128 ,  H01L21/565 ,  H01L23/49816 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45664 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2224/45015 ,  H01L2924/207

摘要： In one embodiment, a semiconductor device package includes: (1) a substrate unit; (2) connecting elements disposed adjacent to a periphery of the substrate unit and extending upwardly from an upper surface of the substrate unit; (3) a semiconductor device disposed adjacent to the upper surface of the substrate unit and electrically connected to the substrate unit; and (4) a package body disposed adjacent to the upper surface of the substrate unit and covering the semiconductor device. A lateral surface of the package body is substantially aligned with a lateral surface of the substrate unit. The package body defines openings that at least partially expose respective ones of the connecting elements. At least one of the connecting elements has a width WC, and at least one of the openings has a width WU adjacent to an upper surface of the package body, such that WU>WC.

摘要翻译： 在一个实施例中，半导体器件封装包括：（1）衬底单元; （2）连接元件，其邻近所述基板单元的周边设置并从所述基板单元的上表面向上延伸; （3）半导体器件，与所述衬底单元的上表面相邻并且电连接到所述衬底单元; 和（4）与衬底单元的上表面相邻并且覆盖半导体器件的封装体。 封装主体的侧表面基本上与衬底单元的侧表面对准。 包装体限定了至少部分地暴露相应的连接元件的开口。 连接元件中的至少一个具有宽度WC，并且至少一个开口具有与封装主体的上表面相邻的宽度WU，使得WU> WC。

公开(公告)号：US20110272809A1

公开(公告)日：2011-11-10

申请号：US12775114

申请日：2010-05-06

申请人： Wen-Hsiung CHANG

发明人： Wen-Hsiung CHANG

IPC分类号： H01L23/48 ,  H01L23/498 ,  H01L21/768

CPC分类号： H01L24/78 ,  H01L21/6835 ,  H01L23/481 ,  H01L24/05 ,  H01L24/85 ,  H01L2221/6834 ,  H01L2224/04026 ,  H01L2224/05556 ,  H01L2224/78 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/12042 ,  H01L2224/48 ,  H01L2224/45099 ,  H01L2924/00

摘要： A semiconductor structure and a manufacturing method thereof are provided. The method includes the following steps. Firstly, a semiconductor substrate having an active surface and a back surface is provided. The active surface is opposite to the back surface, and the semiconductor substrate includes at least one grounding pad disposed on the active surface. Secondly, at least one through silicon via is formed through the semiconductor substrate from the back surface to the active surface thus exposing the grounding pad. Then, a conductive layer is formed on the back surface of the semiconductor substrate and filled into the through silicon via to electrically connect to the grounding pad and the semiconductor substrate.

摘要翻译： 提供半导体结构及其制造方法。 该方法包括以下步骤。 首先，提供具有有源面和背面的半导体基板。 活性表面与背面相对，并且半导体衬底包括设置在有源表面上的至少一个接地焊盘。 其次，通过半导体衬底从背表面到有源表面形成至少一个通硅通孔，从而露出接地焊盘。 然后，在半导体基板的背面上形成导电层，并填充到贯穿硅通孔中，以电连接到接地焊盘和半导体基板。