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1.发明申请公开(公告)号：US20110167846A1
公开(公告)日：2011-07-14
申请号：US13006902
申请日：2011-01-14
CPC分类号： F25B49/027 , F24F3/153 , F25B5/02 , F25B2600/2511 , F25B2600/2517 , F25B2600/2519 , F25B2700/19 , F25B2700/197
摘要： A method for dehumidification and controlling system pressure in a refrigeration system includes providing a refrigeration system having a compressor, a condenser and an evaporator connected in a closed refrigerant loop. Each of the condenser and evaporator have a plurality of refrigerant circuits. A first heat transfer fluid is flowed over the condenser and a second heat transfer fluid is flowed over the evaporator. At least one of the refrigerant circuits of the condenser is isolated to provide a decreased amount of heat transfer area within the condenser and to increase the refrigerant pressure within the refrigeration system when the refrigerant pressure within the refrigeration system is at or below a predetermined pressure. At least one of the refrigerant circuits of the evaporator is isolated to dehumidify and maintain the temperature of the second heat transfer fluid at or above a predetermined temperature when dehumidification is required.
摘要翻译： 一种制冷系统中除湿和控制系统压力的方法包括提供一种具有压缩机，冷凝器和蒸发器的制冷系统，其连接在封闭的制冷剂回路中。 冷凝器和蒸发器中的每一个具有多个制冷剂回路。 第一传热流体流过冷凝器，第二传热流体流过蒸发器。 冷凝器的至少一个制冷剂回路被隔离以在冷凝器内提供减少的传热面积，并且当制冷系统内的制冷剂压力处于或低于预定压力时，增加制冷系统内的制冷剂压力。 当需要除湿时，蒸发器的至少一个制冷剂回路被隔离以对第二传热流体的温度进行除湿并保持在预定温度以上。
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公开(公告)号：US20080073790A1
公开(公告)日：2008-03-27
申请号：US11866741
申请日：2007-10-03
IPC分类号： H01L23/48
CPC分类号： H01L24/05 , H01L23/3192 , H01L23/53223 , H01L24/03 , H01L2224/04042 , H01L2224/0501 , H01L2224/05022 , H01L2224/05082 , H01L2224/05124 , H01L2224/05155 , H01L2224/05644 , H01L2224/45124 , H01L2224/48744 , H01L2924/00014 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/12042 , H01L2924/14 , H01L2924/00 , H01L2224/48
摘要： A method for sealing an exposed surface of a wire bond pad with a material that is capable of preventing a possible chemical attack during electroless deposition of Ni/Au pad metallurgy is provided. Specifically, the present invention provides a method whereby a TiN/Ti or TiN/Al cap is used as a protective coating covering exposed surfaces of a wire bond pad. The TiN/Ti or TiN/Al cap is not affected by alkaline chemistries used in forming the Ni/Au metallization, yet it provides a sufficient electrical pathway connecting the bond pads to the Ni/Au pad metallization.
摘要翻译： 提供了一种通过能够防止在Ni / Au焊盘冶金的无电沉积期间可能的化学侵蚀的材料来密封引线接合焊盘的暴露表面的方法。 具体地说，本发明提供了一种TiN / Ti或TiN / Al帽作为覆盖引线接合焊盘露出表面的保护涂层的方法。 TiN / Ti或TiN / Al帽不受用于形成Ni / Au金属化的碱性化学物质的影响，但它提供了将接合焊盘连接到Ni / Au焊盘金属化的足够的电通路。
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公开(公告)号：US20070290345A1
公开(公告)日：2007-12-20
申请号：US11847776
申请日：2007-08-30
申请人： Lawrence Clevenger , Mukta Farooq , Louis Hsu , William Landers , Donna Zupanski-Nielsen , Carl Radens , Chih-Chao Yang
发明人： Lawrence Clevenger , Mukta Farooq , Louis Hsu , William Landers , Donna Zupanski-Nielsen , Carl Radens , Chih-Chao Yang
IPC分类号： H01L23/488 , H01L21/34
CPC分类号： H05K3/3436 , H01L23/13 , H01L23/49811 , H01L23/49816 , H01L23/49838 , H01L24/11 , H01L24/12 , H01L24/17 , H01L24/49 , H01L24/73 , H01L24/81 , H01L2224/0401 , H01L2224/0603 , H01L2224/06102 , H01L2224/13099 , H01L2224/131 , H01L2224/13111 , H01L2224/1403 , H01L2224/49109 , H01L2224/81801 , H01L2924/00013 , H01L2924/00014 , H01L2924/01006 , H01L2924/01029 , H01L2924/01047 , H01L2924/0105 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H05K2201/094 , H05K2201/09736 , H05K2201/09845 , Y02P70/613 , H01L2224/29099 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An electrical structure and method comprising a first substrate electrically and mechanically connected to a second substrate. The first substrate comprises a first electrically conductive pad and a second electrically conductive pad. The second substrate comprises a third electrically conductive pad, a fourth electrically conductive pad, and a first electrically conductive member. The fourth electrically conductive pad comprises a height that is different than a height of the first electrically conductive member. The electrically conductive member is electrically and mechanically connected to the fourth electrically conductive pad. A first solder ball connects the first electrically conductive pad to the third electrically conductive pad. The first solder ball comprises a first diameter. A second solder ball connects the second electrically conductive pad to the first electrically conductive member. The second solder ball comprises a second diameter. The first diameter is greater than said second diameter.
摘要翻译： 一种电结构和方法，包括电和机械地连接到第二衬底的第一衬底。 第一基板包括第一导电焊盘和第二导电焊盘。 第二基板包括第三导电焊盘，第四导电焊盘和第一导电部件。 第四导电焊盘包括与第一导电构件的高度不同的高度。 导电构件电连接和机械地连接到第四导电垫。 第一焊球将第一导电焊盘连接到第三导电焊盘。 第一焊球包括第一直径。 第二焊球将第二导电焊盘连接到第一导电构件。 第二焊球包括第二直径。 第一直径大于所述第二直径。
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公开(公告)号：US20050074959A1
公开(公告)日：2005-04-07
申请号：US10676172
申请日：2003-10-01
IPC分类号： H01L21/44 , H01L23/31 , H01L23/485 , H01L23/532
CPC分类号： H01L24/05 , H01L23/3192 , H01L23/53223 , H01L24/03 , H01L2224/04042 , H01L2224/0501 , H01L2224/05022 , H01L2224/05082 , H01L2224/05124 , H01L2224/05155 , H01L2224/05644 , H01L2224/45124 , H01L2224/48744 , H01L2924/00014 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/12042 , H01L2924/14 , H01L2924/00 , H01L2224/48
摘要： A method for sealing an exposed surface of a wire bond pad with a material that is capable of preventing a possible chemical attack during electroless deposition of Ni/Au pad metallurgy is provided. Specifically, the present invention provides a method whereby a TiN/Ti or TiN/Al cap is used as a protective coating covering exposed surfaces of a wire bond pad. The TiN/Ti or TiN/Al cap is not affected by alkaline chemistries used in forming the Ni/Au metallization, yet it provides a sufficient electrical pathway connecting-the bond pads to the Ni/Au pad metallization.
摘要翻译： 提供了一种通过能够防止在Ni / Au焊盘冶金的无电沉积期间可能的化学侵蚀的材料来密封引线接合焊盘的暴露表面的方法。 具体地说，本发明提供了一种TiN / Ti或TiN / Al帽作为覆盖引线接合焊盘露出表面的保护涂层的方法。 TiN / Ti或TiN / Al帽不受用于形成Ni / Au金属化的碱性化学物质的影响，但它提供了将接合焊盘连接到Ni / Au焊盘金属化的足够的电路。
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公开(公告)号：US07845185B2
公开(公告)日：2010-12-07
申请号：US11165106
申请日：2005-06-23
IPC分类号： F25B41/00
CPC分类号： F24F3/153 , F25B5/02 , F25B2400/0403 , F25B2600/2507
摘要： An HVAC system including a compressor, a condenser and an evaporator arrangement connected in a closed refrigerant loop. The evaporator arrangement includes a plurality of refrigerant circuits. The evaporator arrangement also includes at least one distributor configured to distribute and deliver refrigerant to each circuit of the plurality of circuits. The plurality of circuits are arranged into a first and second set of circuits. The evaporator arrangement also includes a valve configured and disposed to isolate the first set of circuits from refrigerant flow from the condenser and provide flow of refrigerant from the compressor in a dehumidification operation of the HVAC system.
摘要翻译： 一种HVAC系统，包括压缩机，冷凝器和连接在闭合制冷剂回路中的蒸发器装置。 蒸发器装置包括多个制冷剂回路。 蒸发器装置还包括至少一个配置成将制冷剂分配并输送到多个回路中的每个回路的分配器。 多个电路被布置成第一和第二组电路。 蒸发器装置还包括构造和设置为将第一组回路与来自冷凝器的制冷剂流隔离并且在HVAC系统的除湿操作中提供来自压缩机的制冷剂流动的阀。
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公开(公告)号：US20220125868A1
公开(公告)日：2022-04-28
申请号：US17452029
申请日：2021-10-22
申请人： William Landers
发明人： William Landers
IPC分类号： A61K36/185 , A23L33/00 , A23L33/105 , A23L3/54 , A23L2/52 , A23F5/02 , A61K9/00 , A61K36/74 , A61K36/752
摘要： The present disclosure provides new beverages and methods of making said beverages from hemp juice, coffee fruit, and oranges. The present disclosure also provides new beverages and methods of making said beverages from hemp juice and coffee fruit juice. The disclosure further relates to the production of a non-water-soluble and water-soluble coffee fruit, hemp juice, and orange powders.
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公开(公告)号：US20050242414A1
公开(公告)日：2005-11-03
申请号：US10709320
申请日：2004-04-28
申请人： Matthew Angyal , Edward Barth , Sanjit Das , Charles Davis , Habib Hichri , William Landers , Jia Lee
发明人： Matthew Angyal , Edward Barth , Sanjit Das , Charles Davis , Habib Hichri , William Landers , Jia Lee
IPC分类号： H01L23/58
CPC分类号： H01L23/53295 , C23C16/401 , H01L21/02126 , H01L21/022 , H01L21/02216 , H01L21/02274 , H01L21/02362 , H01L21/31633 , H01L21/76829 , H01L21/76835 , H01L23/5329 , H01L2924/0002 , H01L2924/00
摘要： An interlevel dielectric layer (ILD) comprises a low-k dielectric layer; and a low-k dielectric film, deposited under compressive stress, atop the dielectric layer. The dielectric layer comprises a low-k material, such as an organosilicon glass (OSG) or a SiCOH material. The dielectric film has a thickness, which is 2%-10% of the thickness of the dielectric layer, has a similar chemical composition to the dielectric layer, but has a different morphology than the dielectric layer. The dielectric film is deposited under compressive stress, in situ, at or near the end of the dielectric layer deposition by altering a process that was used to deposit the low-k dielectric layer.
摘要翻译： 层间电介质层（ILD）包括低k电介质层; 以及在压电应力下沉积在电介质层顶上的低k电介质膜。 电介质层包括低k材料，例如有机硅玻璃（OSG）或SiCOH材料。 电介质膜的厚度为电介质层厚度的2％-10％，与电介质层具有相似的化学成分，但具有与电介质层不同的形态。 通过改变用于沉积低k电介质层的工艺，在介电层沉积的结束处或在其附近的压应力下沉积电介质膜。
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公开(公告)号：US20100229579A1
公开(公告)日：2010-09-16
申请号：US12785063
申请日：2010-05-21
CPC分类号： F24F3/153 , F25B5/02 , F25B2400/0403 , F25B2600/2507
摘要： An HVAC system including a compressor, a condenser and an evaporator connected in a closed refrigerant loop. The evaporator includes a plurality of refrigerant circuits. The evaporator also includes at least one distributor configured to distribute and deliver refrigerant to each circuit of the plurality of circuits. The plurality of circuits are arranged into a first and second set of circuits. The evaporator also includes a valve configured and disposed to isolate the first set of circuits from refrigerant flow from the condenser and provide flow of refrigerant from the compressor in a dehumidification operation of the HVAC system.
摘要翻译： HVAC系统包括连接在封闭的制冷剂回路中的压缩机，冷凝器和蒸发器。 蒸发器包括多个制冷剂回路。 蒸发器还包括至少一个配置成将制冷剂分配并输送到多个回路中的每个回路的分配器。 多个电路被布置成第一和第二组电路。 蒸发器还包括构造和设置为将第一组回路与来自冷凝器的制冷剂流隔离并且在HVAC系统的除湿操作中提供来自压缩机的制冷剂流动的阀。
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公开(公告)号：US07559207B2
公开(公告)日：2009-07-14
申请号：US11159878
申请日：2005-06-23
IPC分类号： F25B41/00
CPC分类号： F25B49/027 , F25B2600/2517 , F25B2600/2519 , F25B2700/19
摘要： A method and system for controlling refrigerant pressure in an HVAC system. The method includes providing a compressor, a condenser and an evaporator connected in a closed refrigerant loop. The condenser has a header arrangement capable of distributing refrigerant to a plurality of refrigerant circuits within the condenser. The header arrangement also is capable of selectively isolating at least one of the circuits from refrigerant flow. Refrigerant pressure is sensed at a predetermined location in the refrigeration system. At least one of the circuits is isolated when the refrigerant pressure is less than or equal to a predetermined pressure.
摘要翻译： 一种用于控制HVAC系统中的制冷剂压力的方法和系统。 该方法包括提供连接在封闭制冷剂回路中的压缩机，冷凝器和蒸发器。 冷凝器具有能够将制冷剂分配到冷凝器内的多个制冷剂回路的集管装置。 集管装置还能够选择性地将至少一个回路与制冷剂流隔离。 在制冷系统中的预定位置处感测制冷剂压力。 当制冷剂压力小于或等于预定压力时，至少一个电路被隔离。
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10.发明申请公开(公告)号：US20070222073A1
公开(公告)日：2007-09-27
申请号：US11308396
申请日：2006-03-21
申请人： Mukta Farooq , Jasvir Jaspal , William Landers , Thomas Lombardi , Hai Longworth , H. Pogge , Roger Quon
发明人： Mukta Farooq , Jasvir Jaspal , William Landers , Thomas Lombardi , Hai Longworth , H. Pogge , Roger Quon
CPC分类号： H01L24/05 , H01L23/291 , H01L23/293 , H01L23/3192 , H01L24/03 , H01L24/11 , H01L24/13 , H01L2224/05001 , H01L2224/05022 , H01L2224/05026 , H01L2224/05147 , H01L2224/05166 , H01L2224/05171 , H01L2224/05572 , H01L2224/05647 , H01L2224/05655 , H01L2224/13099 , H01L2224/13111 , H01L2924/0001 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01051 , H01L2924/01073 , H01L2924/01074 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/14 , H01L2924/00014
摘要： A system and method comprises depositing a dielectric layer on a substrate and depositing a metal layer on the dielectric layer. The system and method further includes depositing a high temperature diffusion barrier metal cap on the metal layer. The system and method further includes depositing a second dielectric layer on the high temperature diffusion barrier metal cap and the first dielectric layer, and etching a via into the second dielectric layer, such that the high temperature diffusion barrier metal cap is exposed. The system and method further includes depositing an under bump metallurgy in the via, and forming a C4 ball on the under bump metallurgy layer.
摘要翻译： 一种系统和方法包括在基底上沉积电介质层并在介电层上沉积金属层。 该系统和方法还包括在金属层上沉积高温扩散阻挡金属帽。 该系统和方法还包括在高温扩散阻挡金属帽和第一电介质层上沉积第二电介质层，并将通孔蚀刻到第二电介质层中，使得暴露高温扩散阻挡金属帽。 该系统和方法还包括在通孔中沉积凸块下的冶金，并在凸块下金属层上形成C4球。
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