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1.发明授权Semiconductor chip comprising a metal coating structure and associated production method 有权半导体芯片包括金属涂层结构和相关联的制造方法公开(公告)号：US07880300B2
公开(公告)日：2011-02-01
申请号：US11692530
申请日：2007-03-28
IPC分类号： H01L23/48
CPC分类号： H01L24/12 , H01L23/3142 , H01L23/53238 , H01L24/05 , H01L24/11 , H01L2224/0401 , H01L2224/05017 , H01L2224/05557 , H01L2224/05562 , H01L2224/05664 , H01L2224/1147 , H01L2224/13099 , H01L2224/45124 , H01L2224/48764 , H01L2924/00014 , H01L2924/0002 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01068 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/05042 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2224/48 , H01L2224/05552
摘要： A semiconductor chip (1) has a metal coating structure (2) which has on an active upper side (3) of the semiconductor chip (1) at least one lower metal layer (8) with copper or copper alloy, on which a central metal layer (9) with nickel is arranged. The metal coating structure (2) is terminated by an upper metal layer (10) of palladium and/or a precious metal. The central metal layer (9) with nickel and/or nickel phosphide has a rough interface (11) with respect to the plastic package molding compound surrounding the metal coating structure (2).
摘要翻译： 半导体芯片（1）具有在半导体芯片（1）的有源上侧（3）上具有至少一个具有铜或铜合金的下金属层（8）的金属涂层结构（2），在其上具有中心 配置有镍的金属层（9）。 金属涂层结构（2）由钯和/或贵金属的上金属层（10）封端。 具有镍和/或镍磷化物的中心金属层（9）相对于围绕金属涂层结构（2）的塑料封装模塑料具有粗糙界面（11）。
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公开(公告)号：US07791177B2
公开(公告)日：2010-09-07
申请号：US11953380
申请日：2007-12-10
IPC分类号： H01L23/496 , H01L21/56
CPC分类号： H01L23/49811 , H01L23/3107 , H01L23/49517 , H01L23/49575 , H01L24/48 , H01L24/49 , H01L2224/0603 , H01L2224/48091 , H01L2224/48095 , H01L2224/48137 , H01L2224/48139 , H01L2224/48247 , H01L2224/48472 , H01L2224/49111 , H01L2224/49431 , H01L2924/00014 , H01L2924/01068 , H01L2924/14 , H01L2924/15787 , H01L2924/181 , H01L2924/1815 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Embodiments provide an electronic device including a carrier defining a first major surface, a chip attached to the first major surface, an array of leads connected to the first major surface, and a thickness of encapsulation material disposed on the first major surface of the carrier. Each lead extends through the thickness of the encapsulation material.
摘要翻译： 实施例提供一种电子设备，其包括限定第一主表面的载体，附接到第一主表面的芯片，连接到第一主表面的引线阵列，以及设置在载体的第一主表面上的封装材料的厚度。 每个引线延伸穿过封装材料的厚度。
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3.发明授权公开(公告)号：US07749797B2
公开(公告)日：2010-07-06
申请号：US11574861
申请日：2005-08-18
IPC分类号： H01L21/00 , H01L21/48 , H01L31/0203 , H01L23/28
CPC分类号： H01L31/0203 , H01L23/24 , H01L23/49861 , H01L24/83 , H01L2224/32225 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/8314 , H01L2224/83192 , H01L2224/85385 , H01L2224/92247 , H01L2924/01006 , H01L2924/01033 , H01L2924/01068 , H01L2924/01082 , H01L2924/14 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor device and method is disclosed. In one embodiment, the semiconductor device includes a cavity housing and a sensor chip. In one embodiment, the cavity housing has an opening to the surroundings. The sensor region of the sensor chip faces said opening. The sensor chip is mechanically decoupled from the cavity housing. In one embodiment, the sensor chip is embedded into a rubber-elastic composition on all sides in the cavity of the cavity housing.
摘要翻译： 公开了半导体器件和方法。 在一个实施例中，半导体器件包括空腔壳体和传感器芯片。 在一个实施例中，空腔壳体具有到周围的开口。 传感器芯片的传感器区域面向所述开口。 传感器芯片与空腔外壳机械分离。 在一个实施例中，传感器芯片被嵌入到空腔壳体的空腔中的所有侧面上的橡胶弹性组合物中。
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4.发明申请公开(公告)号：US20090026558A1
公开(公告)日：2009-01-29
申请号：US11574861
申请日：2005-08-18
CPC分类号： H01L31/0203 , H01L23/24 , H01L23/49861 , H01L24/83 , H01L2224/32225 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/8314 , H01L2224/83192 , H01L2224/85385 , H01L2224/92247 , H01L2924/01006 , H01L2924/01033 , H01L2924/01068 , H01L2924/01082 , H01L2924/14 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor sensor device and method is disclosed. In one embodiment, the semiconductor device includes a cavity housing and a sensor chip. In one embodiment, the cavity housing has an opening to the surroundings. The sensor region of the sensor chip faces said opening. The sensor chip is mechanically decoupled from the cavity housing. In one embodiment, the sensor chip is embedded into a rubber-elastic composition on all sides in the cavity of the cavity housing.
摘要翻译： 公开了一种半导体传感器装置和方法。 在一个实施例中，半导体器件包括空腔壳体和传感器芯片。 在一个实施例中，空腔壳体具有到周围的开口。 传感器芯片的传感器区域面向所述开口。 传感器芯片与空腔外壳机械分离。 在一个实施例中，传感器芯片被嵌入到空腔壳体的空腔中的所有侧面上的橡胶弹性组合物中。
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5.发明申请公开(公告)号：US20080224301A1
公开(公告)日：2008-09-18
申请号：US11927239
申请日：2007-10-29
CPC分类号： H01L23/49513 , H01L23/3107 , H01L23/3142 , H01L23/49586 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L2224/2929 , H01L2224/29393 , H01L2224/29499 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48471 , H01L2224/73265 , H01L2224/83136 , H01L2224/83192 , H01L2224/838 , H01L2224/92247 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01056 , H01L2924/01078 , H01L2924/01082 , H01L2924/078 , H01L2924/14 , H01L2924/181 , H01L2924/18301 , Y10S977/938 , H01L2924/00012 , H01L2224/48227 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A lead structure for a semiconductor component includes: external leads for external connections outside a plastic housing composition, internal leads for electrical connections within the plastic housing composition, and a chip mounting island composed of the lead material. While leaving free contact pads of the internal leads, the top sides of the chip mounting island and the internal leads are equipped with nanotubes as an anchoring layer. The plastic housing composition is arranged in the interspaces between the nanotubes arranged on the internal leads, while an adhesive composition for the semiconductor chip is arranged in the interspaces between the nanotubes arranged on the chip mounting island. The adhesive composition and the plastic housing composition fill the interspaces in a manner free of voids.
摘要翻译： 用于半导体部件的引线结构包括：用于在塑料外壳组合物外部的外部连接的外部引线，用于塑料外壳组合物内的电连接的内部引线以及由引线材料构成的芯片安装岛。 在离开内部引线的自由接触垫的同时，芯片安装岛的顶侧和内部引线配备有作为锚定层的纳米管。 塑料外壳组合物布置在布置在内部引线上的纳米管之间的间隙中，而用于半导体芯片的粘合剂组合物布置在布置在芯片安装岛上的纳米管之间的间隙中。 粘合剂组合物和塑料外壳组合物以无空隙的方式填充空隙。
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6.发明授权Thermoplastic-thermosetting composite and method for bonding a thermoplastic material to a thermosetting material 有权热塑性热固性复合材料和将热塑性材料粘合到热固性材料上的方法公开(公告)号：US08507080B2
公开(公告)日：2013-08-13
申请号：US11915037
申请日：2006-04-26
IPC分类号： B23B5/14
CPC分类号： B32B27/08 , B29C65/48 , B29C66/028 , B29C66/30321 , B29C66/30325 , B29C66/30341 , B29C66/721 , B29C66/7392 , B29C66/7394 , B32B7/12 , B32B25/08 , B32B25/14 , B32B25/20 , B32B27/18 , B32B27/36 , B32B2250/03 , B32B2250/24 , B32B2264/105 , B32B2307/202 , B32B2457/00 , B32B2605/00 , H01L23/3135 , H01L23/3142 , H01L24/48 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48464 , H01L2224/48471 , H01L2224/73265 , H01L2924/00014 , H01L2924/01021 , H01L2924/01037 , H01L2924/01078 , H01L2924/12044 , H01L2924/181 , H01L2924/18301 , H01L2924/00 , H01L2224/48227 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2224/4554
摘要： Composite with a first part composed of a thermoset material and with a second part composed of a thermoplastic material, and with an adhesion-promoter layer located between these, where the first part has been bonded by way of the adhesion-promoter layer to the second part, and where the adhesion-promoter layer comprises pyrolytically deposited semiconductor oxides and/or pyrolytically deposited metal oxides.
摘要翻译： 具有由热固性材料构成的第一部分和由热塑性材料构成的第二部分的复合材料，以及位于它们之间的粘合促进剂层，其中第一部分已经通过粘合促进剂层粘合到第二部分 部分，并且其中粘附促进剂层包含热解沉积的半导体氧化物和/或热解沉积的金属氧化物。
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公开(公告)号：US20120223424A1
公开(公告)日：2012-09-06
申请号：US13461202
申请日：2012-05-01
IPC分类号： H01L23/48
CPC分类号： H01L23/49894 , H01L21/56 , H01L23/293 , H01L23/3142 , H01L24/48 , H01L2224/48091 , H01L2224/48247 , H01L2224/8592 , H01L2924/00014 , H01L2924/01019 , H01L2924/01068 , H01L2924/01078 , H01L2924/12044 , H01L2924/181 , H01L2924/19041 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Semiconductor component and method for production of a semiconductor component. The invention relates to a semiconductor component having a semiconductor chip, which is arranged on a substrate, in one embodiment on a chip carrier, and an encapsulation material, which at least partially surrounds the semiconductor chip. The chip carrier is at least partly provided with a layer of polymer foam.
摘要翻译： 半导体元件的制造方法及半导体元件的制造方法。 本发明涉及一种具有半导体芯片的半导体元件，该半导体元件布置在基板上，在一个实施例中在芯片载体上，以及至少部分地围绕半导体芯片的封装材料。 芯片载体至少部分地设置有聚合物泡沫层。
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公开(公告)号：US07911039B2
公开(公告)日：2011-03-22
申请号：US11860556
申请日：2007-09-25
IPC分类号： H01L23/495
CPC分类号： H05K3/284 , H01L23/3107 , H01L23/4334 , H01L23/49531 , H01L24/48 , H01L25/162 , H01L2224/48091 , H01L2224/48247 , H01L2224/48472 , H01L2924/00014 , H01L2924/01068 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/19107 , H01L2924/3025 , H05K1/0306 , H05K1/142 , H05K2201/09063 , H05K2201/09072 , H05K2201/1034 , H05K2201/10977 , H05K2203/049 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A component arrangement comprising a carrier, a component in a housing with electrical contacts and a moulding compound that encloses the carrier, the semiconductor component in the housing and the electrical contacts, wherein the component is applied on the carrier, and wherein the carrier is provided with holes, and a method for producing a component arrangement, wherein the carrier is provided with holes, the component is positioned on the carrier, the component is connected to the carrier, the component with the carrier is positioned in the leadframe, and this arrangement is enclosed by a moulding compound.
摘要翻译： 一种部件装置，包括载体，具有电触头的壳体中的部件和封装载体的模制化合物，壳体中的半导体部件和电触点，其中将部件施加在载体上，并且其中提供载体 具有孔，以及用于制造部件布置的方法，其中，所述载体设置有孔，所述部件位于所述载体上，所述部件连接到所述载体，所述部件与所述载体位于所述引线框架中，并且所述布置 被模塑料包围。
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9.发明授权Electronic module with a semiconductor chip and a component housing and methods for producing the same 有权具有半导体芯片和部件壳体的电子模块及其制造方法公开(公告)号：US07714422B2
公开(公告)日：2010-05-11
申请号：US11751755
申请日：2007-05-22
IPC分类号： H01L23/02
CPC分类号： H05K5/062 , H01L23/3128 , H01L23/49811 , H01L23/49833 , H01L23/552 , H01L23/60 , H01L25/16 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/16235 , H01L2924/00014 , H01L2924/1301 , H01L2924/13033 , H01L2924/181 , H01L2924/19041 , H05K5/0247 , H01L2924/00 , H01L2224/05599 , H01L2924/00012
摘要： An electronic module includes a component housing and at least one semiconductor chip. The semiconductor chip is arranged on a circuit carrier in the component housing. The semiconductor chip is connected to an upper face of the circuit carrier via connection elements. In this case, the semiconductor chip, the connection elements and, partially, the circuit carrier are embedded in a plastic housing compound. A metal plate which is structured into lead interconnects and contact connecting pads is provided on the upper face of the component housing.
摘要翻译： 电子模块包括部件壳体和至少一个半导体芯片。 半导体芯片布置在部件壳体中的电路载体上。 半导体芯片通过连接元件连接到电路载体的上表面。 在这种情况下，半导体芯片，连接元件和部分地，电路载体被嵌入在塑料外壳中。 构成引线互连和接触连接焊盘的金属板设置在部件壳体的上表面上。
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10.发明授权公开(公告)号：US07705436B2
公开(公告)日：2010-04-27
申请号：US11834262
申请日：2007-08-06
IPC分类号： H01L23/495
CPC分类号： H01L23/49562 , H01L23/49524 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/37 , H01L24/40 , H01L24/50 , H01L24/83 , H01L24/84 , H01L24/86 , H01L2224/06181 , H01L2224/29 , H01L2224/29101 , H01L2224/29109 , H01L2224/29111 , H01L2224/29298 , H01L2224/32245 , H01L2224/371 , H01L2224/37124 , H01L2224/37147 , H01L2224/37599 , H01L2224/37647 , H01L2224/40095 , H01L2224/40245 , H01L2224/45124 , H01L2224/83801 , H01L2224/8381 , H01L2224/83825 , H01L2224/8384 , H01L2224/8385 , H01L2224/84801 , H01L2224/8485 , H01L2924/00013 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01327 , H01L2924/014 , H01L2924/0781 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/15747 , H01L2924/181 , H01L2924/0105 , H01L2924/01049 , H01L2924/00 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2224/48 , H01L2924/00012
摘要： A semiconductor chip has at least one first contact and one second contact on its top side and has connecting elements which are arranged jointly on a structure element and which connect the first contact and the second contact of the top side of the semiconductor chip to the external contacts.
摘要翻译： 半导体芯片在其顶侧具有至少一个第一接触和一个第二触点，并具有连接在结构元件上的连接元件，并且将半导体芯片的顶侧的第一触点和第二触点连接到外部 联系人
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