摘要:
In an embodiment, a semiconductor memory device includes a clock latency that can be controlled responsive to whether or not an output order of burst data is reordered. The semiconductor memory device may comprise a control unit and a latency control unit. The control unit may generate a latency control signal having a logic level that varies depending on whether or not an output order of burst data is reordered. The latency control unit may control a latency value in response to the latency control signal. The semiconductor memory device and the method of controlling the latency value responsive to a reordering of the burst data allow for an optimally fast memory access time.
摘要:
A method of configuring a semiconductor integrated circuit (IC) includes arranging a circuit region in the center of a unit cell. Capacitor/resistor regions are arranged along the left and right edge portions of the unit cell. The capacitor/resistor regions include a plurality of active resistors having the same length and a capacitor having a width equal to the length of the plurality of active resistors. In addition, a first conductive layer is arranged longitudinally in each of the capacitor/resistor regions so as to contact the left and right edge portions of the unit cell.
摘要:
In an embodiment, a semiconductor memory device includes a clock latency that can be controlled responsive to whether or not an output order of burst data is reordered. The semiconductor memory device may comprise a control unit and a latency control unit. The control unit may generate a latency control signal having a logic level that varies depending on whether or not an output order of burst data is reordered. The latency control unit may control a latency value in response to the latency control signal. The semiconductor memory device and the method of controlling the latency value responsive to a reordering of the burst data allow for an optimally fast memory access time.
摘要:
A semiconductor device package includes a plurality of semiconductor memory devices whose address input terminals are commonly connected to the external address input pins of the package, and an internal address generating device for using an address signal applied through at least one of the address input pins to select one of the memory devices to perform a read/write data operation. Only the selected memory device is enabled to perform the read/write operation on a memory cell corresponding to the received address signal. The external pin configuration of the semiconductor device package is compatible with a conventional memory board layout.
摘要:
Refreshing of a portion of a DRAM device is bypassed when carrying out a refreshing operation on the DRAM device. By bypassing the refreshing of a portion of the DRAM device when carrying out a refreshing operation, the operational speed of the DRAM device and of systems that use the DRAM device can be increased, and/or the power consumption thereof can be decreased. More specifically, graphic memory apparatus include a DRAM device that is divided into a frame buffer zone that supplies pixel data for a display and at least one other zone, such as a z buffer and/or a texture storing zone. Refreshing of the frame buffer zone is bypassed when carrying out a refreshing operation on the DRAM device. In a preferred embodiment, indications of a starting DRAM address and an ending DRAM address for the frame buffer may be stored. A refreshing operation is performed only on those DRAM addresses that fall outside the starting address and the ending address.
摘要:
A semiconductor device package includes a plurality of semiconductor memory devices whose address input terminals are commonly connected to the external address input pins of the package, and an internal address generating device for using an address signal applied through at least one of the address input pins to select one of the memory devices to perform a read/write data operation. Only the selected memory device is enabled to perform the read/write operation on a memory cell corresponding to the received address signal. The external pin configuration of the semiconductor device package is compatible with a conventional memory board layout.
摘要:
A semiconductor memory device includes a memory cell array and a differential amplifying and latching circuit for latching and outputting each of signal pairs output from the memory cell array in case of a first latency operation, and for amplifying a voltage difference of each of the signal pairs output from the memory cell array in case of a second latency operation.
摘要:
A voltage generating circuit for a semiconductor memory device. The voltage generating circuit includes a multi-boosting unit for stepping up a power supply voltage, a transfer transistor connected to a final boosting node of the multi-boosting unit and an output node, and a charge-sharing element, electrically connected to the final boosting node and a gate node of the transfer transistor, enabled during at least a part of the period the power supply voltage is stepped-up by the multi-boosting unit and performing charge sharing between the final boosting node and the gate node of the transfer transistor.
摘要:
A semiconductor memory device has a sub word line driver structure and includes a main word line decoder driver, an address programming circuit, and a redundant main word line decoder driver. When row address bit signals are input, the main word line decoder driver drives a main word line corresponding to the row address bit signals regardless of a row replacement with redundant rows. If the row address bit signals correspond to programmed defective row address bit signals, the address programming circuit generates a redundant row select signal, in response to which the activated main word line is deactivated and a redundant main word line is activated. According to the redundant row replacement scheme of the present invention, access time is reduced without an increase of a layout area.
摘要:
A method of configuring a semiconductor integrated circuit (IC) includes arranging a circuit region in the center of a unit cell. Capacitor/resistor regions are arranged along the left and right edge portions of the unit cell. The capacitor/resistor regions include a plurality of active resistors having the same length and a capacitor having a width equal to the length of the plurality of active resistors. In addition, a first conductive layer is arranged longitudinally in each of the capacitor/resistor regions so as to contact the left and right edge portions of the unit cell.