公开(公告)号：US08351053B2

公开(公告)日：2013-01-08

申请号：US12823743

申请日：2010-06-25

Applicant: Wonmo Kang ,  M. Taher A. Saif

Inventor： Wonmo Kang ,  M. Taher A. Saif

IPC: G01B11/14

CPC classification number: G01N3/02 ,  B81C99/005 ,  G01N2203/0016

Abstract: According to example embodiments of the invention, a microscale testing stage comprises a frame having first and second opposing ends and first and second side beams, at least one deformable force sensor beam, a first longitudinal beam having a free end, a second longitudinal beam having a facing free end, a support structure, and a pair of slots disposed at each of the free ends. In certain embodiments, a separately fabricated microscale or nanoscale specimen comprises a central gauge length portion of a material to be tested, and first and second hinges providing a self-aligning mechanism for uniaxial loading. In other embodiments, a layer of a conductive material defines first and second conductive paths and an open circuit that can be closed by the specimen across the gap. In other embodiments, the stage is formed of a high melting temperature material.

Abstract translation: 根据本发明的示例性实施例，微型测试台包括具有第一和第二相对端以及第一和第二侧梁的框架，至少一个可变形力传感器梁，具有自由端的第一纵向梁，具有 面向自由端，支撑结构以及设置在每个自由端的一对槽。 在某些实施例中，单独制造的微米级或纳米尺度样本包括待测试材料的中心标尺长度部分，以及提供用于单轴加载的自对准机构的第一和第二铰链。 在其他实施例中，导电材料层限定了第一和第二导电路径以及开放电路，该开路可被样品跨过间隙封闭。 在其它实施方案中，该阶段由高熔点材料形成。

公开(公告)号：US20110317157A1

公开(公告)日：2011-12-29

申请号：US12823743

申请日：2010-06-25

Applicant: Wonmo Kang ,  M. Taher A. Saif

Inventor： Wonmo Kang ,  M. Taher A. Saif

IPC: G01N21/01

CPC classification number: G01N3/02 ,  B81C99/005 ,  G01N2203/0016

Abstract: According to example embodiments of the invention, a microscale testing stage comprises a frame having first and second opposing ends and first and second side beams, at least one deformable force sensor beam, a first longitudinal beam having a free end, a second longitudinal beam having a facing free end, a support structure, and a pair of slots disposed at each of the free ends. In certain embodiments, a separately fabricated microscale or nanoscale specimen comprises a central gauge length portion of a material to be tested, and first and second hinges providing a self-aligning mechanism for uniaxial loading. In other embodiments, a layer of a conductive material defines first and second conductive paths and an open circuit that can be closed by the specimen across the gap. In other embodiments, the stage is formed of a high melting temperature material.

Abstract translation: 根据本发明的示例性实施例，微尺度测试台包括具有第一和第二相对端以及第一和第二侧梁的框架，至少一个可变形力传感器梁，具有自由端的第一纵向梁，具有 面向自由端，支撑结构以及设置在每个自由端的一对槽。 在某些实施例中，单独制造的微米级或纳米尺度样本包括待测试材料的中心标尺长度部分，以及提供用于单轴加载的自对准机构的第一和第二铰链。 在其他实施例中，导电材料层限定了第一和第二导电路径以及开放电路，该开路可被样品跨过间隙封闭。 在其它实施方案中，该阶段由高熔点材料形成。

公开(公告)号：US20240272052A1

公开(公告)日：2024-08-15

申请号：US18451746

申请日：2023-08-17

Applicant: Wonjune Choi ,  Maxwell Kulak ,  Wonmo Kang

Inventor： Wonjune Choi ,  Maxwell Kulak ,  Wonmo Kang

IPC: G01N3/08 ,  G01N3/06

CPC classification number: G01N3/08 ,  G01N3/068 ,  G01N2203/0017 ,  G01N2203/0051 ,  G01N2203/0075 ,  G01N2203/028 ,  G01N2203/0647 ,  G01N2203/0676

Abstract: A method and device for electro-thermo-mechanical tensile testing of wires is disclosed. The device includes a sample frame having upper and lower parts, with the upper part coupled to the lower part through a plurality of sacrificial supports, the upper and lower parts each having an electrical contact pad. The upper and lower parts are electrically non-conductive. The device also includes a wire sample with tracking beads, the wire sample affixed to the upper and lower parts such that the electrical contact pads of the upper and lower parts are communicatively coupled through the wire sample. The device also includes a piezo actuator coupled to the upper part, a weight coupled to the lower part, a power supply configured to pass a current through the wire sample, an electronic balance beneath the weight, and a digital camera pointed at the tracking beads of the wire sample.

公开(公告)号：US20230282388A1

公开(公告)日：2023-09-07

申请号：US18169320

申请日：2023-02-15

Applicant: Hamzeh Kashani ,  Wonmo Kang

Inventor： Hamzeh Kashani ,  Wonmo Kang

IPC: H01B1/02 ,  H01B1/04 ,  B82Y30/00

CPC classification number: H01B1/026 ,  B82Y30/00 ,  H01B1/04

Abstract: A composite wire material may comprise a core wire comprising copper (Cu). The core wire material may comprise a first layer on a circumferential surface of the core wire, where the first layer comprises graphene. The composite wire material may comprise a second layer on a circumferential surface of the first layer, where the second layer comprises nickel (Ni).