摘要:
A semiconductor device includes at least one first type of pad and at least one second type of pad having a different area from the first type of pad. A pad connection unit electrically couples the at least one second type of pad to an integrated circuit of the semiconductor device during a test mode, and disconnects the at least one second type of pad from the integrated circuit during a normal operating mode.
摘要:
A row address control circuit of a semiconductor memory device including dynamic memory cells includes a test mode setting unit, an address counter and a row address generating unit. The test mode setting unit is configured to provide a test mode signal that indicates whether a test operation is performed or not, in response to a test command; the address counter is configured to generate a first address that increases gradually; and the row address generating unit is configured to selectively choose one of the first address and a second address as a refresh address based on the test mode signal, the second address being externally provided.
摘要:
A semiconductor device includes at least one first type of pad and at least one second type of pad having a different area from the first type of pad. A pad connection unit electrically couples the at least one second type of pad to an integrated circuit of the semiconductor device during a test mode, and disconnects the at least one second type of pad from the integrated circuit during a normal operating mode.
摘要:
A semiconductor memory device is provided which comprises a group of address pads and an input circuit configured to receive a first address from the address pads at a first transition of an external clock signal and a second address from the address pads at a second transition of the external clock signal.
摘要:
A memory device, such as a DDR SDRAM, may be provided in which subsets of data output circuits of the device can be selectively enabled to allow sets of data output pins to be connected in common in a testing configuration. In some embodiments, a memory device includes a plurality of data output circuits, respective ones of which are configured to receive data from respective internal data lines and respective ones of which are coupled to respective data input/output pins. The device further includes a data output control circuit operative to selectively enable subsets of the plurality of data output circuits to drive their respective corresponding data input/output pins responsive to an externally-applied control signal. The data output control circuit may be operative to selectively cause subsets of the plurality of data output circuits to present a high impedance at their respective corresponding data input/output pins. The invention may be embodied as devices and methods.
摘要:
A memory system, memory device, and method for setting an operating mode of a memory device include a memory cell array; row and column decoders which select a row and a column of the memory cell array, respectively, according to a multi-bit address signal; and a mode control circuit which receives at least one bit from the multi-bit address signal used in the selection of the row or the column, and which sets an operating mode of the memory device according to the at least one bit, wherein the operating mode is one of a burst length mode, a DLL reset mode, a test mode, a CAS latency mode, and a burst type mode.
摘要:
Circuits and methods for controlling data I/O operations in semiconductor memory devices to provide variable data I/O widths for read, write and active memory operations. Circuits and methods for selectively controlling a data width of a data I/O buffer “on the fly” to enable variable data I/O widths during memory access operations.
摘要:
A semiconductor integrated circuit includes a sense amplifier for amplifying an input signal and a complement of the input signal. The sense amplifier includes cross-coupled transistors. Each unique cross-coupled transistor is coupled to a corresponding unique transistor formed as a diode. A resistor is coupled in series between one cross-coupled resistor and an input port receiving the input signal, and another resistor is coupled in series between the other cross-coupled transistor and another input port receiving the complement of the input signal. Resistances associated with the sources of each cross-coupled transistor provide the resistance of the resistors.
摘要:
A semiconductor integrated circuit includes a sense amplifier for amplifying an input signal and an complementary input signal, a full differential amplifier for amplifying the output of the sense amplifier, and a latch for latching the output of the full differential amplifier and outputting the latched output. The full differential amplifier includes a first differential amplifying unit for increasing the voltage of an output port when the level of an input signal input through an input port is larger than the level of an complementary input signal input through an complementary input port and reducing the voltage of the output port when the level of the input signal is lower than the level of the complementary input signal, a second differential amplifying unit for reducing the voltage of an complementary output port when the level of the input signal is larger than the level of the complementary input signal and increasing the voltage of the complementary output port when the level of the input signal is lower than the level of the complementary input signal, and an output voltage level control circuit connected between the output port and the complementary output port. The output voltage level control circuit controls the voltage levels of the output signals output from the output port and the complementary output port. The sense amplifier can stabilize the operation of the latch by reducing the mean voltage level of the output signal even when the supply A voltage increases, can easily control the voltage gain of the full differential amplifier by controlling the resistance, and stably operates at high speed. The current sense amplifier can include resistors associated with PMOS transistors to avoid unstable operation caused by increased transconductance arising from higher operating voltage.
摘要:
Integrated circuit memory devices include a column select signal generator which generates a column select signal (CSL) having leading and trailing edges and a preferred timing controller. The timing controller, which is electrically coupled to the column select signal generator and is responsive to at least one latency state signal (e.g., CLy), adjusts the timing of at least one of the leading and trailing edges of the column select signal pulse as a function of the value of the at least one latency state signal. Here, the value of the latency state signal can be adjusted to cause a shift in the timing of the column select signal (CSL) and thereby reduce the likelihood of reading errors. In particular, the timing controller is responsive to a first internal clock signal (e.g., PCLK) and generates first and second control signals as CSLE and CSLD. The column select signal generator is responsive to the first and second control signals. The first control signal is preferably delayed and inverted relative to the first internal clock signal by a first delay and the second control signal is preferably delayed relative to the first internal clock signal by a second delay which is less than the first delay. The timing controller also adjusts the timing of at least one of the leading and trailing edges of the column select signal by adjusting the values of the first and second delays as a function of the value of the at least one latency state signal.