On chip shielding structure for integrated circuits or devices on a substrate and method of shielding
    3.
    发明授权
    On chip shielding structure for integrated circuits or devices on a substrate and method of shielding 有权
    用于集成电路或基板上的器件的片上屏蔽结构和屏蔽方法

    公开(公告)号:US08589832B2

    公开(公告)日:2013-11-19

    申请号:US11844397

    申请日:2007-08-24

    CPC classification number: H05K9/0022

    Abstract: An electromagnetic shielding structure that includes a conductive structure surrounding and accommodating a circuit or a circuit device arranged on a substrate. At least one feed through device is associated with the conductive structure and provides signals to the circuit or circuit device. The method includes forming a shielding structure so that the shielding structure at least one of is at least partially arranged within the substrate and surrounds the circuit or circuit device and associating at least one feed through device with the shielding structure.

    Abstract translation: 一种电磁屏蔽结构,其包括围绕并容纳布置在基板上的电路或电路装置的导电结构。 至少一个馈送装置与导电结构相关联,并向电路或电路装置提供信号。 所述方法包括形成屏蔽结构,使得所述屏蔽结构至少部分地至少部分地布置在所述基板内并且围绕所述电路或电路装置并且将至少一个馈送装置与所述屏蔽结构相关联。

    Integrated millimeter wave antenna and transceiver on a substrate
    4.
    发明授权
    Integrated millimeter wave antenna and transceiver on a substrate 有权
    集成毫米波天线和收发器在基板上

    公开(公告)号:US08519892B2

    公开(公告)日:2013-08-27

    申请号:US13534350

    申请日:2012-06-27

    Abstract: A semiconductor chip integrating a transceiver, an antenna, and a receiver is provided. The transceiver is located on a front side of a semiconductor substrate. A through substrate via provides electrical connection between the transceiver and the receiver located on a backside of the semiconductor substrate. The antenna connected to the transceiver is located in a dielectric layer located on the front side of the substrate. The separation between the reflector plate and the antenna is about the quarter wavelength of millimeter waves, which enhances radiation efficiency of the antenna. An array of through substrate dielectric vias may be employed to reduce the effective dielectric constant of the material between the antenna and the reflector plate, thereby reducing the wavelength of the millimeter wave and enhance the radiation efficiency. A design structure for designing, manufacturing, or testing a design for such a semiconductor chip is also provided.

    Abstract translation: 提供集成收发器,天线和接收器的半导体芯片。 收发器位于半导体衬底的前侧。 通过基底通孔提供收发器和位于半导体衬底背面的接收器之间的电连接。 连接到收发器的天线位于位于基板正面的电介质层中。 反射板与天线之间的间隔大约是毫米波的四分之一波长,这提高了天线的辐射效率。 可以采用贯穿衬底电介质通孔的阵列来降低天线和反射板之间材料的有效介电常数,由此减小毫米波的波长并提高辐射效率。 还提供了用于设计,制造或测试这种半导体芯片的设计的设计结构。

    Integrated millimeter wave antenna and transceiver on a substrate
    8.
    发明授权
    Integrated millimeter wave antenna and transceiver on a substrate 有权
    集成毫米波天线和收发器在基板上

    公开(公告)号:US07943404B2

    公开(公告)日:2011-05-17

    申请号:US12187436

    申请日:2008-08-07

    CPC classification number: H01Q1/40 H01Q9/28

    Abstract: A semiconductor chip integrating a transceiver, an antenna, and a receiver is provided. The transceiver is formed on a front side of a semiconductor substrate. At least one through substrate via provides electrical connection between the transceiver and the backside of the semiconductor substrate. The antenna, which is connected to the transceiver, is formed in a dielectric layer on the front side. The reflector plate is connected to the through substrate via, and is formed on the backside. The separation between the reflector plate and the antenna is about the quarter wavelength of millimeter waves, which enhances radiation efficiency of the antenna. An array of through substrate trenches may be formed and filled with a dielectric material to reduce the effective dielectric constant of the material between the antenna and the reflector plate, thereby reducing the wavelength of the millimeter wave and enhance the radiation efficiency.

    Abstract translation: 提供集成收发器,天线和接收器的半导体芯片。 收发器形成在半导体衬底的前侧。 至少一个通过衬底通孔提供收发器和半导体衬底的背面之间的电连接。 连接到收发器的天线形成在前侧的电介质层中。 反射板与穿通基板连接,并形成在背面。 反射板与天线之间的间隔大约是毫米波的四分之一波长,这提高了天线的辐射效率。 通过衬底沟槽的阵列可以形成并填充介电材料,以减小天线和反射板之间的材料的有效介电常数,从而减小毫米波的波长并提高辐射效率。

    Design structure for an on-chip high frequency electro-static discharge device
    10.
    发明授权
    Design structure for an on-chip high frequency electro-static discharge device 失效
    片上高频静电放电装置的设计结构

    公开(公告)号:US07768762B2

    公开(公告)日:2010-08-03

    申请号:US12144084

    申请日:2008-06-23

    CPC classification number: G06F17/5068 H01L23/60 H01L2924/0002 H01L2924/00

    Abstract: A design structure for an on-chip high frequency electro-static discharge device is described. In one embodiment, the electro-static discharge device comprises a substrate and multiple metal level layers disposed on the substrate. Each metal level comprises more than one electrode formed therein and more than one via connecting with some of the electrodes in adjacent metal levels. The device further includes a gap formed about one of the metal level layers, wherein the gap is hermetically sealed to provide electro-static discharge protection for the integrated circuit.

    Abstract translation: 描述了片上高频静电放电装置的设计结构。 在一个实施例中,静电放电装置包括衬底和设置在衬底上的多个金属层。 每个金属层包括多于一个电极,其中形成有多个电极,并且多个通孔与相邻金属层中的一些电极连接。 所述装置还包括围绕所述金属层之一形成的间隙,其中所述间隙被气密密封,以为所述集成电路提供静电放电保护。

Patent Agency Ranking