公开(公告)号：US20070134822A1

公开(公告)日：2007-06-14

申请号：US11543256

申请日：2006-10-05

申请人： Shu Yamamoto ,  Yasuhiro Chouno ,  Yoshichika Tokuno

发明人： Shu Yamamoto ,  Yasuhiro Chouno ,  Yoshichika Tokuno

IPC分类号： H01L21/66

CPC分类号： B01F3/08 ,  B01F15/0022 ,  B01F15/0408 ,  B01F2215/0096 ,  H01L21/6704 ,  H01L21/67051 ,  H01L21/6715 ,  H01L21/67253

摘要： A process system produces a process liquid of a predetermined concentration in a blending tank by blending solutions respectively supplied from a plurality of solution supply sources, supplies the process liquid to a supply tank to store therein the process liquid, and supplies the process liquid from the supply tank to a process liquid discharge port. In this process system, whether a concentration of the process liquid in the supply tank has changed or not is judged. When it is judged that the concentration of the process liquid in the supply tank has changed, the process liquid is additionally supplied from the blending tank to the supply tank, or the solution is directly supplied from the solution supply source to the supply tank, so as to maintain the concentration of the process liquid.

摘要翻译： 处理系统通过混合从多个溶液供应源分别供应的溶液，在混合罐中产生预定浓度的处理液体，将处理液体供应到供应罐以在其中存储处理液体，并将处理液体从 供应罐到处理液排出口。 在该处理系统中，判断供给罐中的处理液的浓度是否变化。 当判断供应罐中的处理液体的浓度已经改变时，处理液体从混合罐另外供应到供应罐，或者溶液从溶液供应源直接供应到供应罐，因此 以保持工艺液体的浓度。

公开(公告)号：US20060102210A1

公开(公告)日：2006-05-18

申请号：US10522155

申请日：2003-07-25

申请人： Yasuhiro Chouno ,  Norihiro Ito

发明人： Yasuhiro Chouno ,  Norihiro Ito

IPC分类号： B08B3/04

CPC分类号： H01L21/67748 ,  H01L21/68728 ,  H01L21/68742

摘要： A substrate processing vessel has a vessel body 100 and a cover 130 hermetically joined to the vessel body 100. The vessel body 100 is provided with a plurality of substrate support rods 102. Each of the support rods 102 has a shank 103 and a head 104 having a diameter greater than that of the shank 103 and attached to the upper end of the shank 103. The shanks 103 penetrate the vessel body 100 and project downward from the vessel body 100. When each substrate support rod 102 is lowered to its lower position, the head 104 is seated hermetically on a part, around the open upper end of a through hole 108 through which the shank 103 is inserted, of the vessel body 100. When each substrate support rod 102 is raised to its upper position, a space of a big thickness capable of receiving a wafer carrying arm 14a is formed between the upper surface of the vessel body 100 and a wafer W supported on the substrate support rods 102. A processing space defined by the substrate processing vessel may be very thin, the amount of a processing fluid necessary for processing the wafer W can be reduced and throughput can be increased.

摘要翻译： 衬底处理容器具有容器主体100和与容器主体100密封接合的盖130.容器主体100设置有多个基板支撑杆102.每个支撑杆102具有柄103和头部104 其直径大于柄103的直径并且附接到柄103的上端。柄103穿透血管主体100并从血管主体100向下突出。当每个基底支撑杆102下降到其较低位置 头部104气密地坐在容器主体100的一个部分上，该部分围绕容器主体100插入的通孔108的敞开的上端。当每个基板支撑杆102升高到其上部位置时， 在容器主体100的上表面和支撑在基板支撑杆102上的晶片W之间形成能够接收晶片承载臂14a的大厚度的厚度。由基板处理容器ma限定的处理空间 y非常薄，可以减少处理晶片W所需的处理流体的量，并且可以提高生产量。

公开(公告)号：US07445689B2

公开(公告)日：2008-11-04

申请号：US10682005

申请日：2003-10-08

申请人： Masahiro Yoshida ,  Yasuhiro Chouno

发明人： Masahiro Yoshida ,  Yasuhiro Chouno

IPC分类号： C23F1/00 ,  H01L21/306

CPC分类号： H01L21/67751 ,  H01L21/67167 ,  H01L21/67178 ,  H01L21/6719 ,  H01L21/67236 ,  Y10S414/135

摘要： The substrate processing system has an ozone generator that generates and supplies an ozone-containing gas to plural or N (N is a natural number not less than 2) ozone process units. The ozone generator has capacity of supplying the first processing fluid to only N−n of the first processing units simultaneously at respective supply rates each in accordance with a demand for appropriately performing the first process in each of the first processing units, where n is a natural number and N−n is not less than 2. A controller that controls a timing of loading of the substrate into the ozone process units by the conveyer so as to avoid a case where more than N−n of the first processing units are simultaneously carrying out the first treatment each using the first processing fluid, where n is a natural number and N−n is not less than 2.

摘要翻译： 基板处理系统具有臭氧发生器，该臭氧发生器产生并供给含臭氧的气体至多个或N（N为自然数不少于2个）臭氧处理单元。 臭氧发生器具有根据在每个第一处理单元中适当地执行第一处理的需求以相应的供给速率同时向第一处理单元中的Nn提供第一处理流体的能力，其中n是自然数 Nn不小于2.一种控制器，其控制由输送机将基板装载到臭氧处理单元中的定时，以避免多于Nn个第一处理单元同时进行第一处理的情况 使用第一处理流体，其中n是自然数，Nn不小于2。

公开(公告)号：US07086410B2

公开(公告)日：2006-08-08

申请号：US10384089

申请日：2003-03-07

申请人： Yasuhiro Chouno ,  Norihiro Ito ,  Keigo Satake ,  Tadashi Iino

发明人： Yasuhiro Chouno ,  Norihiro Ito ,  Keigo Satake ,  Tadashi Iino

IPC分类号： G05D16/20

CPC分类号： H01L21/67253 ,  H01L21/67017 ,  Y10S134/902 ,  Y10S438/935 ,  Y10T137/0396 ,  Y10T137/7761 ,  Y10T137/87917

摘要： A common solvent vapor supply source 41 and a common processing gas supply source 42 supply ozone gas and steam to a plurality of processing vessels 30A, 30B. Pressures in the processing vessels are regulated by adjusting the openings of the valuable throttle valves 50A, 50B, which are placed in exhaust lines 80A, 80B, respectively.

摘要翻译： 常见的溶剂蒸气供给源41和公共处理气体供应源42向多个处理容器30A，30B供应臭氧气体和蒸汽。处理容器中的压力通过调节有价值的节流阀50A的开口来调节 ，50B，它们分别放置在排气管线80A，80B中。

公开(公告)号：US08978670B2

公开(公告)日：2015-03-17

申请号：US12897384

申请日：2010-10-04

申请人： Junya Minamida ,  Issei Ueda ,  Yasuhiro Chouno ,  Osamu Kuroda ,  Kazuyoshi Eshima ,  Masahiro Yoshida ,  Satoshi Morita

发明人： Junya Minamida ,  Issei Ueda ,  Yasuhiro Chouno ,  Osamu Kuroda ,  Kazuyoshi Eshima ,  Masahiro Yoshida ,  Satoshi Morita

IPC分类号： B08B3/00 ,  H01L21/67

CPC分类号： H01L21/67051 ,  H01L21/6708 ,  H01L21/67178 ,  H01L21/6719 ,  H01L21/67196 ,  Y10S414/135

摘要： Provided is a substrate processing apparatus wherein, even if a trouble occurs, it is bound to continue a process for the substrate without stopping the substrate processing apparatus entirely. The substrate processing apparatus according to the present disclosure includes first and second substrate conveying devices configured to convey wafers, and first and second processing blocks provided on the right and left sides of the substrate conveying device and having processing unit arrays each configured to perform the same process. Processing unit arrays on one side and processing unit arrays on the other side are respectively connected to a processing liquid supply system commonly provided with them. And, when any one of substrate conveying devices, processing liquid supply systems has a problem, the process for the wafer can be performed in the processing unit array to which the substrate conveying device and the processing liquid supply system under normal operation belong.

摘要翻译： 提供了一种基板处理装置，其中即使发生故障，也必须在不停止基板处理装置的情况下继续进行基板的处理。 根据本公开的基板处理装置包括被配置为输送晶片的第一和第二基板输送装置，以及设置在基板输送装置的左侧和左侧的第一和第二处理块，并且具有各自被配置为执行相同的处理单元阵列 处理。 一侧的处理单元阵列和另一侧的处理单元阵列分别连接到通常设置有它们的处理液体供应系统。 并且，当基板输送装置中的任一个处理液供给系统存在问题时，可以在基板输送装置和处理液供给系统正常运转所属的处理单元阵列中进行晶片的处理。

公开(公告)号：US07180035B2

公开(公告)日：2007-02-20

申请号：US10519126

申请日：2003-06-25

申请人： Norihiro Ito ,  Hiroaki Kawaguchi ,  Yasuhiro Chouno

发明人： Norihiro Ito ,  Hiroaki Kawaguchi ,  Yasuhiro Chouno

IPC分类号： F22B1/28 ,  H01L21/303

CPC分类号： H01L21/67051 ,  Y10S134/902

摘要： A steam generator 40′ provided in a substrate processing apparatus includes a tank 301 having a hollow cylindrical member 302 formed of a composite of PTFE and PFA and a pair of side wall plates 303 connected to the opposite ends of the cylindrical member 302. The tank 301 is surrounded by a shell 305 of an aluminum alloy to prevent deformation of the tank due to internal pressure of the tank. A heater 308 is attached to the outer surfaces of the plate members 307 of the shell 305. The shell 305 restrains the tank 301 and compresses elastic sealing members 305 to sealingly engage the cylindrical member 302 and the side wall plate 303 with each other.

摘要翻译： 设置在基板处理装置中的蒸汽发生器40'包括具有由PTFE和PFA的复合材料形成的中空圆柱形构件302的罐301和连接到圆柱形构件302的相对端的一对侧壁板303。 301由铝合金的外壳305围绕，以防止由于罐的内部压力引起的罐的变形。 加热器308附接到壳体305的板构件307的外表面。壳体305限制罐301并压缩弹性密封构件305以使圆筒构件302和侧壁板303彼此密封地接合。

公开(公告)号：US20060110143A1

公开(公告)日：2006-05-25

申请号：US10519126

申请日：2003-06-25

申请人： Norihiro Ito ,  Hiroaki Kawaguchi ,  Yasuhiro Chouno

发明人： Norihiro Ito ,  Hiroaki Kawaguchi ,  Yasuhiro Chouno

IPC分类号： B01D7/00

CPC分类号： H01L21/67051 ,  Y10S134/902

摘要： A steam generator 40′ provided in a substrate processing apparatus includes a tank 301 having a hollow cylindrical member 302 formed of a composite of PTFE and PFA and a pair of side wall plates 303 connected to the opposite ends of the cylindrical member 302. The tank 301 is surrounded by a shell 305 of an aluminum alloy to prevent deformation of the tank due to internal pressure of the tank. A heater 308 is attached to the outer surfaces of the plate members 307 of the shell 305. The shell 305 restrains the tank 301 and compresses elastic sealing members 305 to sealingly engage the cylindrical member 302 and the side wall plate 303 with each other.

摘要翻译： 设置在基板处理装置中的蒸汽发生器40'包括具有由PTFE和PFA的复合材料形成的中空圆柱形构件302的罐301和连接到圆柱形构件302的相对端的一对侧壁板303。 301由铝合金的外壳305围绕，以防止由于罐的内部压力引起的罐的变形。 加热器308附接到壳体305的板构件307的外表面。壳体305限制罐301并压缩弹性密封构件305以使圆筒构件302和侧壁板303彼此密封地接合。

公开(公告)号：US20110079252A1

公开(公告)日：2011-04-07

申请号：US12897384

申请日：2010-10-04

申请人： Junya MINAMIDA ,  Issei UEDA ,  Yasuhiro CHOUNO ,  Osamu KURODA ,  Kazuyoshi ESHIMA ,  Masahiro YOSHIDA ,  Satoshi MORITA

发明人： Junya MINAMIDA ,  Issei UEDA ,  Yasuhiro CHOUNO ,  Osamu KURODA ,  Kazuyoshi ESHIMA ,  Masahiro YOSHIDA ,  Satoshi MORITA

IPC分类号： B08B3/00

CPC分类号： H01L21/67051 ,  H01L21/6708 ,  H01L21/67178 ,  H01L21/6719 ,  H01L21/67196 ,  Y10S414/135

摘要： Provided is a substrate processing apparatus wherein, even if a trouble occurs, it is bound to continue a process for the substrate without stopping the substrate processing apparatus entirely. The substrate processing apparatus according to the present disclosure includes first and second substrate conveying devices configured to convey wafers, and first and second processing blocks provided on the right and left sides of the substrate conveying device and having processing unit arrays each configured to perform the same process. Processing unit arrays on one side and processing unit arrays on the other side are respectively connected to a processing liquid supply system commonly provided with them. And, when any one of substrate conveying devices, processing liquid supply systems has a problem, the process for the wafer can be performed in the processing unit array to which the substrate conveying device and the processing liquid supply system under normal operation belong.

摘要翻译： 提供了一种基板处理装置，其中即使发生故障，也必须在不停止基板处理装置的情况下继续进行基板的处理。 根据本公开的基板处理装置包括被配置为输送晶片的第一和第二基板输送装置，以及设置在基板输送装置的左侧和左侧的第一和第二处理块，并且具有各自被配置为执行相同的处理单元阵列 处理。 一侧的处理单元阵列和另一侧的处理单元阵列分别连接到通常设置有它们的处理液体供应系统。 并且，当基板输送装置中的任一个处理液供给系统存在问题时，可以在基板输送装置和处理液供给系统正常运转所属的处理单元阵列中进行晶片的处理。

公开(公告)号：US06186171B1

公开(公告)日：2001-02-13

申请号：US09268183

申请日：1999-03-15

申请人： Hiroshi Tanaka ,  Yasuhiro Chouno ,  Takashi Terada ,  Satoshi Nakashima

发明人： Hiroshi Tanaka ,  Yasuhiro Chouno ,  Takashi Terada ,  Satoshi Nakashima

IPC分类号： F04B4900

CPC分类号： F04B9/1372 ,  Y10T137/86043

摘要： In a pneumatically driven liquid supply apparatus comprising a circulation pump 26 or constant-volume pump 34 for supplying a washing liquid or chemical to a washing tank 20 for semiconductor wafers used during the fabrication of semiconductor devices; an electromagnetic switching valve 51 and a pressure regulator 52 that configure an air-pressure adjustment means 50 are connected to an air source 60; and air supply pipelines 41a, 41b, 41d, and 41e are each connected to the air-pressure adjustment means 50, the circulation pump 26 and the constant-volume pump 34. A leakage sensor 70 is interposed within each of the air supply pipelines 41a, 41b, 41d, and 41e between the air-pressure adjustment means 50 and the circulation pump 26 or constant-volume pump 34, so that any liquid that flows backward through the circulation pump 26 or the constant-volume pump 34 and into the air supply pipeline 41a, 41b, 41d, or 41e is detected by the leakage sensor 70. This makes it possible to prevent damage or halting of the functions of the air-pressure adjustment means due to liquid flowing into the air supply pipelines via one of the pumps.

摘要翻译： 在气动驱动液体供给装置中，包括循环泵26或恒定容积泵34，用于将洗涤液或化学品供应到半导体器件制造期间使用的半导体晶片的洗涤槽20; 构成气压调节装置50的电磁切换阀51和压力调节器52连接到空气源60; 空气供给管道41a，41b，41d，41e分别与气压调节机构50，循环泵26，恒定容积泵34连接。另外，在各供气管41a 空气压力调节装置50与循环泵26或恒定体积泵34之间的流体，41b，41d和41e，使得流过循环泵26或恒定容积泵34并进入空气的任何液体 供给管道41a，41b，41d或41e由泄漏传感器70检测。这使得可以防止由于液体经由空气供应管线中的一个流入空气供应管道而导致的空气压力调节装置的功能的损坏或停止 泵。

公开(公告)号：US5503171A

公开(公告)日：1996-04-02

申请号：US172419

申请日：1993-12-22

申请人： Kenji Yokomizo ,  Chihaya Tashima ,  Eiichi Mukai ,  Yoshiyuki Honda ,  Naohiko Hamamura ,  Shinya Murakami ,  Yasuhiro Chouno

发明人： Kenji Yokomizo ,  Chihaya Tashima ,  Eiichi Mukai ,  Yoshiyuki Honda ,  Naohiko Hamamura ,  Shinya Murakami ,  Yasuhiro Chouno

IPC分类号： H01L21/00 ,  B08B3/04

CPC分类号： H01L21/67057 ,  Y10S134/902

摘要： A substrates-washing apparatus includes a process vessel in which washing solution is stored to wash a plurality of substrates, a boat for holding the substrates parallel to one another in the process vessel, solution supply openings formed in the bottom of the process vessel, a solution supply system communicated with the solution supply openings to supply washing solution into the process vessel through the solution supply openings, and a straightening plate arranged between the substrates held on the boat and the solution supply openings in the bottom of the process vessel and provided with a plurality of apertures through which washing solution passes. The apertures form plural lines in the longitudinal direction of the straightening plate, the apertures in each line are arranged to correspond to the substrates alternately, and the apertures in one line are shifted from those in the other adjacent line.

摘要翻译： 基板洗涤装置包括处理容器，其中存储洗涤溶液以洗涤多个基板，用于将基板保持在处理容器中彼此平行的船，在处理容器的底部形成的溶液供应开口， 溶液供应系统与溶液供应开口连通，通过溶液供应开口将洗涤溶液供应到处理容器中，以及设置在保持在船上的基板和处理容器底部的溶液供应开口之间的矫直板， 洗涤液通过的多个孔。 这些孔在矫直板的长度方向上形成多条线，每条线中的孔交替地布置成对应于基底，并且一条线中的孔与另一条相邻的线偏移。