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公开(公告)号:US5382333A
公开(公告)日:1995-01-17
申请号:US950757
申请日:1992-09-24
申请人: Kazuhiro Ando , Takamasa Kawakami , Yasuhiro Shouji , Yasuo Tanaka , Takeo Kanaoka , Norio Sayama
发明人: Kazuhiro Ando , Takamasa Kawakami , Yasuhiro Shouji , Yasuo Tanaka , Takeo Kanaoka , Norio Sayama
CPC分类号: C23C22/83 , C23C22/63 , H05K3/385 , H05K2201/0355 , H05K2203/0315 , H05K2203/1157 , H05K3/4611
摘要: A process for producing a copper-clad laminate using a copper foil obtained by subjecting the surface of the copper foil to chemical oxidation thereby to form, on the surface, a fine roughness constituted by a copper oxide of a brown to black color and then reducing the copper oxide constituting the fine roughness in an atmosphere in which a reducing gas is present.
摘要翻译: 一种使用铜箔制造覆铜层压板的方法,其通过使铜箔的表面进行化学氧化,从而在表面上形成由褐色至黑色的氧化铜构成的微细粗糙度,然后还原 在存在还原气体的气氛中构成微细粗糙度的氧化铜。
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公开(公告)号:US5252355A
公开(公告)日:1993-10-12
申请号:US738013
申请日:1991-07-30
申请人: Kazuhiro Ando , Takamasa Kawakami , Yasuhiro Shouji , Yasuo Tanaka , Takeo Kanaoka , Norio Sayama
发明人: Kazuhiro Ando , Takamasa Kawakami , Yasuhiro Shouji , Yasuo Tanaka , Takeo Kanaoka , Norio Sayama
CPC分类号: H05K3/385 , H05K2203/0315 , H05K2203/1157 , H05K3/4611
摘要: A process for producing a multilayered printed circuit board which comprises using, as an intermediate layer, an inner-layer board obtained by chemically oxidizing the surface of a copper foil constituting an outermost layer of an inner-layer board having a printed circuit formed in the copper foil, thereby to form on the surface a finely roughened layer constituted by a copper oxide of a brown to black color, and then reducing the copper oxide constituting the finely roughened layer in an atmosphere in which a reducing gas is present.
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