SEALANT FOR OPTICAL SEMICONDUCTORS AND OPTICAL SEMICONDUCTOR DEVICE
    2.
    发明申请
    SEALANT FOR OPTICAL SEMICONDUCTORS AND OPTICAL SEMICONDUCTOR DEVICE 审中-公开
    适用于光学半导体和光学半导体器件

    公开(公告)号:US20120126282A1

    公开(公告)日:2012-05-24

    申请号:US13387725

    申请日:2011-03-18

    摘要: The present invention provides a sealant for an optical semiconductor device which has high gas barrier property against corrosive gas, and is less likely to crack or is less likely to peel off even when used in harsh environments.The sealant for an optical semiconductor device includes: a first silicone resin component including at least one of a first silicone resin A represented by formula (1A) shown below and a first silicone resin B represented by formula (1B) shown below, the first silicone resin A not containing a hydrogen atom bound to a silicon atom, but containing an aryl group and an alkenyl group, the first silicone resin B not containing a hydrogen atom bound to a silicon atom, but containing an aryl group and an alkenyl group; a second silicone resin component including at least one of a second silicone resin A represented by formula (51A) shown below and a second silicone resin B represented by formula (51B) shown below, the second silicone resin A containing an aryl group and a hydrogen atom directly bound to a silicon atom, the second silicone resin B containing an aryl group and a hydrogen atom directly bound to a silicon atom; and a catalyst for hydrosilylation reaction.

    摘要翻译: 本发明提供一种用于光学半导体器件的密封剂,其对腐蚀性气体具有高阻气性,并且即使在恶劣环境中使用也不太可能破裂或不太可能剥落。 用于光学半导体器件的密封剂包括:第一有机硅树脂组分,其包含以下所示的由式(1A)表示的第一有机硅树脂A和由下式(1B)表示的第一有机硅树脂B,第一硅氧烷 不含有与硅原子但含有芳基和烯基的氢原子的第一有机硅树脂B不含有与硅原子结合但含有芳基和烯基的氢原子; 第二有机硅树脂组分,其包含如下所示的由式(51A)表示的第二有机硅树脂A和由下式(51B)表示的第二有机硅树脂B中的至少一种,第二有机硅树脂A含有芳基和氢 直接与硅原子结合的原子,第二有机硅树脂B含有与硅原子直接结合的芳基和氢原子; 和氢化硅烷化反应的催化剂。