摘要:
An ESD protection circuit includes a first voltage clamp, connected between a first voltage supply node and a second voltage supply node of the circuit, and a second voltage clamp, connected between the second voltage supply node and a voltage return of the circuit. The first voltage supply node is adapted to receive a first voltage which is greater than a prescribed gate oxide reliability potential of the circuit. The second voltage supply node is operative to receive a second voltage which is less than the first voltage. The first voltage clamp is operative to clamp the first voltage on the first voltage supply node to a first value during an ESD event between the first and second voltage supply nodes, and the second voltage clamp is operative to clamp the second voltage on the second voltage supply node to a second value during an ESD event between the second voltage supply node and the voltage return.
摘要:
An ESD protection circuit for protecting a circuit from an ESD event occurring between a first voltage supply node and a second voltage supply node associated with the circuit to be protected includes an MOS device having a gate terminal, a first source/drain terminal and a second source/drain terminal. The first source/drain terminal is connected to the first voltage supply node and the second source/drain terminal is connected to the second voltage supply node. The ESD protection circuit further includes a trigger circuit coupled to the gate terminal of the MOS device. The trigger circuit is configured to generate a control signal at the gate terminal of the MOS device for activating the MOS device during the ESD event. At least a portion of the trigger circuit is formed in a floating well which becomes biased to a voltage that is substantially equal to a first voltage when the first voltage is supplied to the first voltage supply node or to a second voltage when the second voltage is applied to the second voltage supply node, whichever voltage is greater.
摘要:
A voltage level translator circuit is selectively operable in one of at least two modes in response to a control signal. In a first mode, the voltage level translator circuit is operative to translate an input signal referenced to a first source providing a first voltage to an output signal referenced to a second source providing a second voltage. In a second mode, the voltage level translator circuit is operative to provide a signal path from an input of the voltage translator circuit to an output thereof without translating the input signal. The control signal is indicative of a difference between the first voltage and the second voltage.
摘要:
A semiconductor resistor comprises a resistor body formed on a semiconductor substrate and first and second conductive terminals electrically connected to the resistor body at opposite ends thereof. The semiconductor resistor further includes at least first and second conductive paths between at least one of the first and second conductive terminals and the resistor body. The at least one conductive terminal is configured such that a resistance of the at least one conductive terminal between the at least first and second conductive paths is substantially matched to a resistance of the resistor body between the at least first and second conductive paths. In this manner, a current distribution between the at least first and second conductive paths is substantially matched.
摘要:
The present invention provides a method of forming a trench capacitor in an input/output region and a trench isolation structure in an active device region and a method of manufacturing an integrated circuit using the aforementioned method of forming. The invention comprises concurrently forming an isolation trench in an active region and a capacitive trench in an input/output region, concurrently forming a dielectric layer over the walls of the isolation trench and the capacitive trench, and forming a conductive material in the capacitive trench.
摘要:
The present invention provides, in one embodiment, an integrated circuit having a substrate and active devices formed on the surface of the substrate. Other embodiments of the integrated circuit provide for having at least either three or four metal layers. In a particular embodiment of the present invention, the integrated circuit comprises a bond pad formed over a portion of the active devices. The bond pad has a footprint. As used therein the word footprint means the area covered by the device to which the word refers. The integrated circuit further incudes a patterned metal layer having a metal layer footprint that is located between the bond pad and the substrate and a built-in self-test (BIST) circuit that has a BIST footprint, which is located between the substrate and the bond pad. In this particular embodiment, the bond pad footprint overlays at least a portion of the metal layer footprint and the BIST footprint. However, in a more advantageous embodiment, the bond pad footprint overlays a substantial portion of the metal layer footprint and the BIST footprint.
摘要:
An ESD protection circuit includes a first voltage clamp, connected between a first voltage supply node and a second voltage supply node of the circuit, and a second voltage clamp, connected between the second voltage supply node and a voltage return of the circuit. The first voltage supply node is adapted to receive a first voltage which is greater than a prescribed gate oxide reliability potential of the circuit. The second voltage supply node is operative to receive a second voltage which is less than the first voltage. The first voltage clamp is operative to clamp the first voltage on the first voltage supply node to a first value during an ESD event between the first and second voltage supply nodes, and the second voltage clamp is operative to clamp the second voltage on the second voltage supply node to a second value during an ESD event between the second voltage supply node and the voltage return.
摘要:
An integrated circuit device comprising a die having a top surface with a peripheral region and an interior region surrounded by the peripheral region. Bond pads are disposed in the peripheral region of the die. One or more internal buses are disposed in the interior region of the die. The one or more internal buses distribute power to internal node points of the die. One or more bond wires connect one or more peripheral bond pads with one or more internal buses.
摘要:
A voltage level translator circuit is selectively operable in one of at least two modes in response to a control signal. In a first mode, the voltage level translator circuit is operative to translate an input signal referenced to a first source providing a first voltage to an output signal referenced to a second source providing a second voltage. In a second mode, the voltage level translator circuit is operative to provide a signal path from an input of the voltage translator circuit to an output thereof without translating the input signal. The control signal is indicative of a difference between the first voltage and the second voltage.
摘要:
A low voltage, 5V tolerant open drain output buffer having moderate current tolerance capabilities is formed with 3.3V technology using a nominal power supply of 2.5V or less. The buffer includes an inverter, a series connection of the current paths of three n-channel FET transistors, and a backgate bias generator. One terminal of the series connection of three transistors is connected to a PAD, and the other terminal of the lower transistor of the series is connected to ground. The bias generator is formed using two p-channel field effect transistors (FETs) that are cross-connected between VDD and the PAD. A gate of a central one of the three transistors is connected to the power supply. An output of the bias generator is connected to a gate of the upper transistor. The inventive buffer may be manufactured using standard 3.3V processes, but functions with a power supply of, e.g., 2.5V or 1.8V.