公开(公告)号：US09895686B2

公开(公告)日：2018-02-20

申请号：US13505219

申请日：2009-12-01

申请人： Xionghou Gao ,  Dong Ji ,  Haitao Zhang ,  Hongchang Duan ,  Di Li ,  ZhengGuo Tan ,  Yi Su ,  Zhicheng Tang ,  Yi Wang ,  Yanqing Ma ,  Yanbo Sun

发明人： Xionghou Gao ,  Dong Ji ,  Haitao Zhang ,  Hongchang Duan ,  Di Li ,  ZhengGuo Tan ,  Yi Su ,  Zhicheng Tang ,  Yi Wang ,  Yanqing Ma ,  Yanbo Sun

IPC分类号： B01J29/06 ,  B01J37/28 ,  B01J29/04 ,  B01J29/12 ,  B01J29/068 ,  B01J29/44 ,  B01J29/74 ,  C01B39/02 ,  C07C4/06 ,  C10G11/18 ,  B01J37/02 ,  B01J37/08

CPC分类号： B01J37/28 ,  B01J29/041 ,  B01J29/061 ,  B01J29/068 ,  B01J29/126 ,  B01J29/44 ,  B01J29/7415 ,  B01J37/0207 ,  B01J37/0236 ,  B01J37/08 ,  B01J2229/186 ,  B01J2229/24 ,  B01J2229/37 ,  B01J2229/40 ,  C01B39/026 ,  C07C4/06 ,  C07C2529/12 ,  C07C2529/22 ,  C07C2529/44 ,  C07C2529/74 ,  C10G11/18 ,  C10G2300/1044 ,  C10G2400/20 ,  C07C11/02

摘要： A method for producing double-component modified molecular sieve comprises adding molecular sieve to an aqueous solution containing phosphorus to form a mixture, allowing the mixture to react at pH of 1-10, temperature of 70-200° C. and pressure of 0.2-1.2 MPa for 10-200 min, and then filtering, drying and baking the resultant to obtain phosphorus-modified molecular sieve, and then adding the phosphorus-modified molecular sieve to an aqueous solution containing silver ions, allowing the phosphorus-modified molecular sieve to react with silver ions at 0-100° C. in dark condition for 30-150 min, and then filtering, drying and baking. The obtained double-component modified molecular sieve contains 88-99 wt % molecular sieve with a ratio of silica to alumina between 15 and 60, 0.5-10 wt % phosphorus (based on oxides) and 0.01-2 wt % silver (based on oxides), all based on dry matter. A catalyst produced from the double-component modified molecular sieve has improved hydrothermal stability and microactivity.

公开(公告)号：US09786202B2

公开(公告)日：2017-10-10

申请号：US13582907

申请日：2011-03-04

申请人： Weimin Huang ,  Jiang Liu ,  Jiayin Zhou ,  Jing Zhang ,  Beng Hai Lee ,  Wing Kee Wong ,  Ngan Meng Tan ,  Zhuo Zhang ,  Fengshou Yin ,  Stephen Chang ,  Chee Kong Chui ,  Yi Su

发明人： Weimin Huang ,  Jiang Liu ,  Jiayin Zhou ,  Jing Zhang ,  Beng Hai Lee ,  Wing Kee Wong ,  Ngan Meng Tan ,  Zhuo Zhang ,  Fengshou Yin ,  Stephen Chang ,  Chee Kong Chui ,  Yi Su

IPC分类号： G09B23/28 ,  G09B23/30

CPC分类号： G09B23/28 ,  G06F19/00 ,  G09B23/30

摘要： A surgical training system and method. The system comprises means for recording reference data representing a reference manipulation of a computer generated model of an object by a master user; means for physically guiding a trainee user based on the recorded reference data during a training manipulation of the model of the object by the trainee user; and means for recording assessment data representing an assessment manipulation of the model of the object by the trainee user without guidance.

公开(公告)号：US09397458B2

公开(公告)日：2016-07-19

申请号：US13004016

申请日：2011-01-10

申请人： Tak K. Wang ,  Chung-Yi Su

发明人： Tak K. Wang ,  Chung-Yi Su

IPC分类号： G02B6/36 ,  H01R27/00 ,  G02B6/38

CPC分类号： H01R27/00 ,  G02B6/3817 ,  Y10T29/49204

摘要： A connector assembly is provided that has optical communications capabilities and high data rate electrical communications capabilities and that is backwards compatible with one or more USB standards. A socket of the connector assembly has high data rate electrical connections and USB electrical connections such that it is capable of supporting high data rate signaling protocols for high data rate devices as well as USB signaling protocols. A plug of the connector assembly has high data rate electrical connections, USB electrical connections, and an optical-to-electrical (OE)/electrical-to-optical (EO) conversion module. The socket can be mated with the plug of the invention and with USB plugs that are compliant with existing USB plugs. Thus, both the socket and the plug have backwards compatibility with one or more existing USB standards.

摘要翻译： 提供了具有光通信能力和高数据速率电通信能力并且向后兼容于一个或多个USB标准的连接器组件。 连接器组件的插座具有高数据速率电连接和USB电连接，使得其能够支持用于高数据速率设备以及USB信令协议的高数据速率信令协议。 连接器组件的插头具有高数据速率的电气连接，USB电连接以及光 - 电（OE）/电 - 光（EO）转换模块。 插座可以与本发明的插头和符合现有USB插头的USB插头配合。 因此，插座和插头都具有与一个或多个现有USB标准的向后兼容性。

公开(公告)号：US09269135B2

公开(公告)日：2016-02-23

申请号：US13410190

申请日：2012-03-01

申请人： Yan-Wei Tien ,  Pei-Yi Su ,  You-Hong Huang ,  Ching-Cheng Wang

发明人： Yan-Wei Tien ,  Pei-Yi Su ,  You-Hong Huang ,  Ching-Cheng Wang

IPC分类号： G06F19/00 ,  G06K9/00 ,  G06T7/00

CPC分类号： G06T7/001 ,  G06T2207/30148

摘要： Defect management systems and methods are disclosed. A system for managing defects on an object includes an automatic defect classification (ADC) module, a lithographic plane review (LPR) module, and a defect progression monitor (DPM) module in communication with the ADC module and the LPR module. The DPM module is adapted to obtain information regarding a defect disposed on the object from the ADC module and the LPR module and determine if a repair or cleaning is needed of the object.

摘要翻译： 公开了缺陷管理系统和方法。 用于管理对象上的缺陷的系统包括与ADC模块和LPR模块通信的自动缺陷分类（ADC）模块，光刻平面审阅（LPR）模块和缺陷进度监视器（DPM）模块。 DPM模块适于从ADC模块和LPR模块获取有关设置在对象上的缺陷的信息，并确定是否需要修复或清理对象。

公开(公告)号：US08794850B2

公开(公告)日：2014-08-05

申请号：US12848253

申请日：2010-08-02

申请人： Chung-Yi Su ,  Tak Kui Wang

发明人： Chung-Yi Su ,  Tak Kui Wang

IPC分类号： G02B6/38

CPC分类号： H01R24/64 ,  G02B6/3817 ,  G02B6/3821 ,  G02B6/3825 ,  G02B6/3893 ,  G02B6/4246 ,  G02B6/4292 ,  H01R31/06

摘要： An adapter is provided that has both an electrical coupling configuration that complies with the RJ-45 wiring standard for electrical communications and an optical coupling configuration for optical communications. The adapter is configured as an interface for at least two modular connector assemblies to enable the modular connector assemblies to communicate with each other either optically or electrically, depending on whether the plugs of the assemblies are configured to have optical or electrical communications capabilities.

摘要翻译： 提供了一种适配器，其具有符合用于电气通信的RJ-45布线标准的电耦合配置和用于光通信的光耦合配置。 适配器被配置为用于至少两个模块化连接器组件的接口，以使得模块化连接器组件能够以光学或电气方式彼此通信，这取决于组件的插头是否被配置为具有光学或电气通信能力。

公开(公告)号：US08664741B2

公开(公告)日：2014-03-04

申请号：US13160030

申请日：2011-06-14

申请人： Ru-Yi Su ,  Fu-Chih Yang ,  Chun Lin Tsai ,  Chih-Chang Cheng ,  Ruey-Hsin Liu

发明人： Ru-Yi Su ,  Fu-Chih Yang ,  Chun Lin Tsai ,  Chih-Chang Cheng ,  Ruey-Hsin Liu

IPC分类号： H01L29/02

CPC分类号： H01L29/0649 ,  H01L21/26513 ,  H01L21/74 ,  H01L21/761 ,  H01L21/76202 ,  H01L23/528 ,  H01L27/0676 ,  H01L27/0802 ,  H01L28/20 ,  H01L29/0692 ,  H01L29/456 ,  H01L29/6609 ,  H01L29/8605 ,  H01L29/868

摘要： Provided is a high voltage semiconductor device that includes a PIN diode structure formed in a substrate. The PIN diode includes an intrinsic region located between a first doped well and a second doped well. The first and second doped wells have opposite doping polarities and greater doping concentration levels than the intrinsic region. The semiconductor device includes an insulating structure formed over a portion of the first doped well. The semiconductor device includes an elongate resistor device formed over the insulating structure. The resistor device has first and second portions disposed at opposite ends of the resistor device, respectively. The semiconductor device includes an interconnect structure formed over the resistor device. The interconnect structure includes: a first contact that is electrically coupled to the first doped well and a second contact that is electrically coupled to a third portion of the resistor located between the first and second portions.

摘要翻译： 提供一种高压半导体器件，其包括形成在衬底中的PIN二极管结构。 PIN二极管包括位于第一掺杂阱和第二掺杂阱之间的本征区。 第一和第二掺杂阱具有与内部区域相反的掺杂极性和更大的掺杂浓度水平。 半导体器件包括形成在第一掺杂阱的一部分上的绝缘结构。 半导体器件包括形成在绝缘结构上的细长电阻器件。 电阻器件分别设置在电阻器件的相对端处的第一和第二部分。 半导体器件包括形成在电阻器件上的互连结构。 互连结构包括：电耦合到第一掺杂阱的第一接触和电耦合到位于第一和第二部分之间的电阻器的第三部分的第二接触。

公开(公告)号：US08545803B2

公开(公告)日：2013-10-01

申请号：US13505224

申请日：2009-12-01

申请人： Xionghou Gao ,  Dong Ji ,  Haitao Zhang ,  Hongchang Duan ,  Di Li ,  ZhengGuo Tan ,  Yi Su ,  Chenxi Zhang ,  Yi Wang ,  Yanqing Ma ,  Yanbo Sun

发明人： Xionghou Gao ,  Dong Ji ,  Haitao Zhang ,  Hongchang Duan ,  Di Li ,  ZhengGuo Tan ,  Yi Su ,  Chenxi Zhang ,  Yi Wang ,  Yanqing Ma ,  Yanbo Sun

IPC分类号： C01B39/00 ,  C01F7/00

CPC分类号： B01J29/40 ,  B01J29/06 ,  B01J37/10 ,  B01J37/28 ,  B01J2229/34 ,  B01J2229/40 ,  B01J2229/42 ,  C10G11/05 ,  C10G11/18

摘要： Modified molecular sieve characterized by improved sodium-resisting contamination activity and preparation method thereof are provided. The method comprises: adding molecular sieve in phosphorus-containing organic solution, and reacting for 10-200 minutes at temperature of 70-200° C. and pressure of 0.2-1.2 MPa, and then filtering, drying and calcining. The said modified molecular sieve contains 90-99 wt. % molecular sieve as dry basis and 1-10 wt. % phosphorus as oxide. The said method can improve the capability of sodium-resisting contamination effectively, and its technology is simple and fits the existing catalyst production apparatus and process. The said modified molecular sieve has high sodium-resisting contamination activity, and the model catalyst by sodium contamination has high activity retention.

摘要翻译： 提供了具有改善的耐钠污染活性的改性分子筛及其制备方法。 该方法包括：在含磷有机溶液中加入分子筛，在70-200℃的温度和0.2-1.2 MPa的压力下反应10-200分钟，然后过滤，干燥和煅烧。 所述改性分子筛含有90-99wt。 ％分子筛为干基，1-10重量％ 磷作为氧化物。 所述方法可以有效提高耐钠污染的能力，其技术简单，适合现有的催化剂生产设备和工艺。 所述改性分子筛具有较高的抗钠污染活性，而钠污染模型催化剂具有较高的活性保留性。

公开(公告)号：US20130228860A1

公开(公告)日：2013-09-05

申请号：US13865941

申请日：2013-04-18

申请人： Hong Chang ,  Yi Su ,  Wenjun Li ,  Limin Weng ,  Gary Chen ,  Jongoh Kim ,  John Chen

发明人： Hong Chang ,  Yi Su ,  Wenjun Li ,  Limin Weng ,  Gary Chen ,  Jongoh Kim ,  John Chen

IPC分类号： H01L27/088 ,  H01L29/78 ,  H01L21/283

CPC分类号： H01L29/7811 ,  H01L21/26586 ,  H01L21/283 ,  H01L27/088 ,  H01L29/1095 ,  H01L29/402 ,  H01L29/407 ,  H01L29/41741 ,  H01L29/4236 ,  H01L29/42368 ,  H01L29/42372 ,  H01L29/4238 ,  H01L29/456 ,  H01L29/4933 ,  H01L29/66719 ,  H01L29/66727 ,  H01L29/66734 ,  H01L29/7813 ,  H01L29/7827

摘要： A method for fabricating a semiconductor device includes forming a plurality of trenches using a first mask. The trenches include source pickup trenches located in outside a termination area and between two adjacent active areas. First and second conductive regions separated by an intermediate dielectric region are formed using a second mask. A first electrical contact to the first conductive region and a second electrical contact to the second conductive region are formed using a third mask and forming a source metal region. Contacts to a gate metal region are formed using a fourth mask. A semiconductor device includes a source pickup contact located outside a termination region and outside an active region of the device.

公开(公告)号：US08467654B2

公开(公告)日：2013-06-18

申请号：US12754545

申请日：2010-04-05

申请人： Chung-Yi Su ,  Tak Kui Wang

发明人： Chung-Yi Su ,  Tak Kui Wang

IPC分类号： H04B10/02 ,  G02B6/00 ,  G02B6/36

CPC分类号： G02B6/42 ,  G02B6/241 ,  G02B6/3817 ,  G02B6/3893

摘要： A modular connector assembly is provided that has both an electrical coupling configuration that complies with the RJ-45 wiring standard and an optical coupling configuration that provides the assembly with optical communications capabilities. In addition, the modular connector assembly is configured to have backwards compatibility with existing 8P8C jacks and plugs that implement the RJ-45 wiring standard. Consequently, the modular connector assembly may be used to communicate optical data signals at higher data rates (e.g., 10 Gb/s and higher) or to communicate electrical data signals at lower data rates (e.g., 1 Gb/s).

摘要翻译： 提供了具有符合RJ-45布线标准的电耦合配置和为组件提供光通信能力的光耦合配置的模块化连接器组件。 此外，模块化连接器组件配置为具有与现有的8P8C插孔和插头实现RJ-45接线标准的向后兼容性。 因此，模块化连接器组件可以用于以更高的数据速率（例如，10Gb / s以上）通信光数据信号，或以更低的数据速率（例如，1Gb / s）传送电数据信号。

公开(公告)号：US20130134448A1

公开(公告)日：2013-05-30

申请号：US13411640

申请日：2012-03-05

申请人： Xin-Lin ZHOU ,  Chen-Yi SU

发明人： Xin-Lin ZHOU ,  Chen-Yi SU

IPC分类号： H01L27/15

CPC分类号： G02B6/0073 ,  G02B6/0083 ,  G02B6/009 ,  G02B6/0091

摘要： A light component includes a printed circuit board and a plurality of lighting emitting diodes (LEDs). The printed circuit board has a metal substrate. The LEDs are disposed on the printed circuit board, wherein two opposite edges of the metal substrate protrude out and are bent towards the LEDs to form two metal clamps.

摘要翻译： 光分量包括印刷电路板和多个发光二极管（LED）。 印刷电路板具有金属基板。 LED布置在印刷电路板上，其中金属基板的两个相对的边缘突出并朝向LED弯曲以形成两个金属夹具。